Abstract: A system for monitoring seed placement within the ground during the performance of a planting operation with a planting implement includes a row unit of that has a furrow opening assembly configured to create a furrow in the soil and a furrow closing assembly configured to close the furrow after the seeds have been deposited therein. Each seed is treated with a treatment applied after the seed is received within a component of the planting implement and before the furrow is closed around the seed, the treatment having a treatment dielectric property that is greater than a dielectric property of the seeds without the treatment. Additionally, the system includes a computing system configured to determine a seed placement parameter associated with the seeds as treated and planted underneath the surface of the soil based on data generated by a seed placement sensor supported relative to the row unit.

Abstract: A system for monitoring seed placement within the ground during the performance of a planting operation includes a row unit including a furrow opening assembly configured to create a furrow in the soil and a furrow closing assembly configured to close the furrow after the seeds have been deposited therein. Particularly, the seeds are coated seeds that are coated with a coating having a coating dielectric property that is greater than a dielectric property of the seeds without the coating. The system further includes a seed placement sensor supported relative to the row unit and configured to generate data indicative of the coated seeds as planted underneath a surface of the soil. Additionally, the system includes a computing system configured to determine a seed placement parameter associated with the coated seeds underneath the surface of the soil based at least in part on the data generated by the seed placement sensor.