Patents by Inventor Jamil Wakil

Jamil Wakil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7698114
    Abstract: Techniques for enhancing thermal design of a system having a number of boundary values are provided. A method for such enhancement includes representing thermal response of the system to the boundary values, obtaining at least one constraining parameter, and determining spatial and/or temporal distribution of the boundary values. The thermal response is represented as a superposition of temperature fields associated with given boundary values. The spatial and/or temporal distribution of the boundary values is determined based on the thermal response represented in the representing step, so as to satisfy the constraining parameter. The boundary values can be, for example, power sources, and the at least one constraining parameter can be, for example, a spatial or temporal location of one of the power sources.
    Type: Grant
    Filed: November 2, 2005
    Date of Patent: April 13, 2010
    Assignee: International Business Machines Corporation
    Inventors: Hendrik F. Hamann, James A. Lacey, Jamil Wakil, Alan J. Weger
  • Publication number: 20070236890
    Abstract: Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.
    Type: Application
    Filed: June 5, 2007
    Publication date: October 11, 2007
    Inventors: Jeffrey Coffin, Michael Gaynes, David Questad, Kamal Sikka, Hilton Toy, Jamil Wakil
  • Publication number: 20070202616
    Abstract: There is provided a method for measuring thermal properties of a semiconductor packaging material. The method includes incorporating at least one conducting feature into a substrate that includes the semiconductor packaging material, applying an electric current to the feature, and measuring a change in temperature of a region of the substrate around the feature as a result of the electric current. There is also provided a test vehicle for measuring thermal properties of a semiconductor packaging material.
    Type: Application
    Filed: February 24, 2006
    Publication date: August 30, 2007
    Applicant: International Business Machines Corporation
    Inventors: David Russell, Ronald Malfatt, Stefano Oggioni, Jamil Wakil
  • Publication number: 20070098037
    Abstract: Techniques for enhancing thermal design of a system having a number of boundary values are provided. A method for such enhancement includes representing thermal response of the system to the boundary values, obtaining at least one constraining parameter, and determining spatial and/or temporal distribution of the boundary values. The thermal response is represented as a superposition of temperature fields associated with given boundary values. The spatial and/or temporal distribution of the boundary values is determined based on the thermal response represented in the representing step, so as to satisfy the constraining parameter. The boundary values can be, for example, power sources, and the at least one constraining parameter can be, for example, a spatial or temporal location of one of the power sources.
    Type: Application
    Filed: November 2, 2005
    Publication date: May 3, 2007
    Applicant: International Business Machines Corporation
    Inventors: Hendrik Hamann, James Lacey, Jamil Wakil, Alan Weger
  • Publication number: 20060268521
    Abstract: Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.
    Type: Application
    Filed: May 26, 2005
    Publication date: November 30, 2006
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jeffrey Coffin, Michael Gaynes, David Questad, Kamal Sikka, Hilton Toy, Jamil Wakil
  • Publication number: 20060039114
    Abstract: A present invention provides real-time temperature and power mapping of fully operating electronic devices. The method utilizes infrared (IR) temperature imaging, while an IR-transparent coolant flows through a specially designed cell directly over the electronic device. In order to determine the chip power distributions the individual temperature fields for each heat source of a given power and size on the chip (as realized by a scanning focused laser beam) are measured under the same cooling conditions. Then the measured chip temperature distribution is represented as a superposition of the temperature fields of these individual heat sources and the corresponding power distribution is calculated with a set of linear equations.
    Type: Application
    Filed: August 17, 2004
    Publication date: February 23, 2006
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hendrik Hamann, James Lacey, Martin O'Boyle, Robert von Gutfeld, Jamil Wakil, Alan Weger