Patents by Inventor Ja Myeong Koo
Ja Myeong Koo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11374306Abstract: An electronic device comprising a metal case having a metal pad attached thereto is disclosed. According to the present invention, the electronic device comprises: a metal case having a metal terminal part formed therein; a metal pad joined to the metal terminal part by laser welding; and a conductive first coating layer coated on one surface of the metal pad, wherein the light reflectivity of the first coating layer is lower than the light reflectivity of the metal pad.Type: GrantFiled: August 23, 2017Date of Patent: June 28, 2022Assignee: Samsung Electronics Co., Ltd.Inventors: Ja-myeong Koo, Jeong-gen Yoon, Young-chul Lee, Myeong-hwa Kim, Tae-hyeong Kim, Yeon-kwan Moon, Min-goo Seo, Seung-yup Lee
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Patent number: 11291129Abstract: The present invention relates to an electronic device having a metal case, the electronic device comprising: a metal case having at least one electronic circuit or antenna formed therein; a metal pad arranged at the metal case and electrically connected to the at least one electronic circuit or antenna; a metal sheet attached to one surface of the metal pad; and an electronic circuit board electrically connected to the at least one electronic circuit or antenna of the metal case through a metal instrument for connection which detachably contacts the metal sheet.Type: GrantFiled: August 16, 2016Date of Patent: March 29, 2022Assignee: Samsung Electronics Co., Ltd.Inventors: Ja-myeong Koo, Young-chul Lee, Young-jun Moon, Jeong-gen Yoon, Soon-min Hong
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Patent number: 10664023Abstract: An electronic device includes a bracket having a through hole, a first circuit board and a second circuit board which are disposed below the bracket. The second circuit board is electrically connected with the first circuit board, and a first module and a second module are disposed above the bracket. The first module and the second module are electrically connected with the first circuit board via a wiring structure passing through the through hole.Type: GrantFiled: July 14, 2017Date of Patent: May 26, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Tae Sik Kim, Myung Jae Jo, Hye Won Kang, Ja Myeong Koo, Mu Jin Kim, Jeong Woon Koo, Dae Heon Kwon, Sei Neu Park, Won Hyun Park, Jae Young Yun
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Publication number: 20190221919Abstract: An electronic device comprising a metal case having a metal pad attached thereto is disclosed. According to the present invention, the electronic device comprises: a metal case having a metal terminal part formed therein; a metal pad joined to the metal terminal part by laser welding; and a conductive first coating layer coated on one surface of the metal pad, wherein the light reflectivity of the first coating layer is lower than the light reflectivity of the metal pad.Type: ApplicationFiled: August 23, 2017Publication date: July 18, 2019Inventors: Ja-myeong KOO, Jeong-gen YOON, Young-chul LEE, Myeong-hwa KIM, Tae-hyeong KIM, Yeon-kwan MOON, Min-goo SEO, Seung-yup LEE
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Publication number: 20180310423Abstract: The present invention relates to an electronic device having a metal case, the electronic device comprising: a metal case having at least one electronic circuit or antenna formed therein; a metal pad arranged at the metal case and electrically connected to the at least one electronic circuit or antenna; a metal sheet attached to one surface of the metal pad; and an electronic circuit board electrically connected to the at least one electronic circuit or antenna of the metal case through a metal instrument for connection which detachably contacts the metal sheet.Type: ApplicationFiled: August 16, 2016Publication date: October 25, 2018Inventors: Ja-myeong KOO, Young-chul LEE, Young-jun MOON, Jeong-gen YOON, Soon-min HONG
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Publication number: 20180017999Abstract: An electronic device includes a bracket having a through hole, a first circuit board and a second circuit board which are disposed below the bracket. The second circuit board is electrically connected with the first circuit board, and a first module and a second module are disposed above the bracket. The first module and the second module are electrically connected with the first circuit board via a wiring structure passing through the through hole.Type: ApplicationFiled: July 14, 2017Publication date: January 18, 2018Inventors: Tae Sik KIM, Myung Jae JO, Hye Won KANG, Ja Myeong KOO, Mu Jin KIM, Jeong Woon KOO, Dae Heon KWON, Sei Neu PARK, Won Hyun PARK, Jae Young YUN
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Patent number: 8785792Abstract: Disclosed herein is a case structure of an electronic product to which a film-type electronic circuit is adhered. The case structure may include a case of an electronic product and a first film adhered to the case. The case structure may further include a second film adhered to the first film such that one surface of the second film contacts the first film, and an electronic circuit layer adhered to the first film. The electronic circuit layer may be arranged between the first film and the second film, wherein the first film is thermally adhered to the case. The first film may have a melting at a melting point that is lower than a heat-resistant temperature of the case.Type: GrantFiled: July 6, 2011Date of Patent: July 22, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Ja Myeong Koo, Soon Min Hong, Tae Sang Park, Young Jun Moon, Gyun Heo, Sun Gu Yi
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Patent number: 8624124Abstract: According to an example embodiment, the multilayer stretchable cable includes a multilayer stretchable film and a plurality of conductive lines in the stretchable film. The conductive lines are in at least two different layers of the multilayer stretchable film in a thickness direction of the stretchable film, at least one conductive line is a signal line and at least one other conductive line in a layer adjacent to the signal line is a ground line. The signal line and the ground line are in zigzag patterns and are parallel to a width direction of the multilayer stretchable film.Type: GrantFiled: April 1, 2011Date of Patent: January 7, 2014Assignee: Samsung Electronics Co., LtdInventors: Ja Myeong Koo, Soon Wan Chung, Soon Min Hong, Young Jun Moon
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Publication number: 20120018186Abstract: Disclosed herein is a case structure of an electronic product to which a film-type electronic circuit is adhered. The case structure may include a case of an electronic product and a first film adhered to the case. The case structure may further include a second film adhered to the first film such that one surface of the second film contacts the first film, and an electronic circuit layer adhered to the first film. The electronic circuit layer may be arranged between the first film and the second film, wherein the first film is thermally adhered to the case. The first film may have a melting at a melting point that is lower than a heat-resistant temperature of the case.Type: ApplicationFiled: July 6, 2011Publication date: January 26, 2012Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ja Myeong Koo, Soon Min Hong, Tae Sang Park, Young Jun Moon, Gyun Heo, Sun Gu Yi
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Publication number: 20110272181Abstract: According to an example embodiment, the multilayer stretchable cable includes a multilayer stretchable film and a plurality of conductive lines in the stretchable film. The conductive lines are in at least two different layers of the multilayer stretchable film in a thickness direction of the stretchable film, at least one conductive line is a signal line and at least one other conductive line in a layer adjacent to the signal line is a ground line. The signal line and the ground line are in zigzag patterns and are parallel to a width direction of the multilayer stretchable film.Type: ApplicationFiled: April 1, 2011Publication date: November 10, 2011Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ja Myeong Koo, Soon Wan Chung, Soon Min Hong, Young Jun Moon
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Publication number: 20110026233Abstract: Disclosed herein is an apparatus for manufacturing an elastic cable including conductor tracks arranged in a zigzag shape between elastic films. The apparatus may include a conductor track supplying unit to supply at least one conductor track, an aligning unit to align the at least one conductor track supplied from the conductor track supplying unit, a film supplying unit to supply elastic films such that the at least one conductor track is surrounded by the elastic films, and a thermal lamination roller unit to thermally laminate the at least one conductor track arranged between the elastic films, wherein the aligning unit is reciprocally movable to arrange the at least one conductor track in a zigzag shape between the elastic films when the at least one conductor track is supplied to the thermal lamination roller unit.Type: ApplicationFiled: June 28, 2010Publication date: February 3, 2011Inventors: Soon Min Hong, Ja Myeong Koo, Young Jun Moon, Sun Gu Yi
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Publication number: 20090139758Abstract: A printed circuit board (PCB) assembly is disclosed, which includes a first PCB on which a plurality of first electrode terminals are arranged at intervals from one another; a second PCB on which a plurality of second electrode terminals respectively connected with the first electrode terminals are arranged at intervals from one another; and separation preventing member which prevents the first and the second electrode terminals from deviating from their correct positions when the first and the second electrode terminals are ultrasonically-welded to each other. Accordingly, lateral movement of the first and the second PCBs relative to each other is restricted owing to the separation preventing member, the plurality of first electrode terminals and second electrode terminals can be bonded to each other without deviating from their correct positions.Type: ApplicationFiled: June 3, 2008Publication date: June 4, 2009Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hyo Young Shin, Seung Boo Jung, Young Jun Moon, Soon Min Hong, Chang Yong Lee, Ja Myeong Koo, Hyun Tae Kim, Jong Bum Lee, Hyun Joo Han