Patents by Inventor Ja Myeong Koo

Ja Myeong Koo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11374306
    Abstract: An electronic device comprising a metal case having a metal pad attached thereto is disclosed. According to the present invention, the electronic device comprises: a metal case having a metal terminal part formed therein; a metal pad joined to the metal terminal part by laser welding; and a conductive first coating layer coated on one surface of the metal pad, wherein the light reflectivity of the first coating layer is lower than the light reflectivity of the metal pad.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: June 28, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ja-myeong Koo, Jeong-gen Yoon, Young-chul Lee, Myeong-hwa Kim, Tae-hyeong Kim, Yeon-kwan Moon, Min-goo Seo, Seung-yup Lee
  • Patent number: 11291129
    Abstract: The present invention relates to an electronic device having a metal case, the electronic device comprising: a metal case having at least one electronic circuit or antenna formed therein; a metal pad arranged at the metal case and electrically connected to the at least one electronic circuit or antenna; a metal sheet attached to one surface of the metal pad; and an electronic circuit board electrically connected to the at least one electronic circuit or antenna of the metal case through a metal instrument for connection which detachably contacts the metal sheet.
    Type: Grant
    Filed: August 16, 2016
    Date of Patent: March 29, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ja-myeong Koo, Young-chul Lee, Young-jun Moon, Jeong-gen Yoon, Soon-min Hong
  • Patent number: 10664023
    Abstract: An electronic device includes a bracket having a through hole, a first circuit board and a second circuit board which are disposed below the bracket. The second circuit board is electrically connected with the first circuit board, and a first module and a second module are disposed above the bracket. The first module and the second module are electrically connected with the first circuit board via a wiring structure passing through the through hole.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: May 26, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae Sik Kim, Myung Jae Jo, Hye Won Kang, Ja Myeong Koo, Mu Jin Kim, Jeong Woon Koo, Dae Heon Kwon, Sei Neu Park, Won Hyun Park, Jae Young Yun
  • Publication number: 20190221919
    Abstract: An electronic device comprising a metal case having a metal pad attached thereto is disclosed. According to the present invention, the electronic device comprises: a metal case having a metal terminal part formed therein; a metal pad joined to the metal terminal part by laser welding; and a conductive first coating layer coated on one surface of the metal pad, wherein the light reflectivity of the first coating layer is lower than the light reflectivity of the metal pad.
    Type: Application
    Filed: August 23, 2017
    Publication date: July 18, 2019
    Inventors: Ja-myeong KOO, Jeong-gen YOON, Young-chul LEE, Myeong-hwa KIM, Tae-hyeong KIM, Yeon-kwan MOON, Min-goo SEO, Seung-yup LEE
  • Publication number: 20180310423
    Abstract: The present invention relates to an electronic device having a metal case, the electronic device comprising: a metal case having at least one electronic circuit or antenna formed therein; a metal pad arranged at the metal case and electrically connected to the at least one electronic circuit or antenna; a metal sheet attached to one surface of the metal pad; and an electronic circuit board electrically connected to the at least one electronic circuit or antenna of the metal case through a metal instrument for connection which detachably contacts the metal sheet.
    Type: Application
    Filed: August 16, 2016
    Publication date: October 25, 2018
    Inventors: Ja-myeong KOO, Young-chul LEE, Young-jun MOON, Jeong-gen YOON, Soon-min HONG
  • Publication number: 20180017999
    Abstract: An electronic device includes a bracket having a through hole, a first circuit board and a second circuit board which are disposed below the bracket. The second circuit board is electrically connected with the first circuit board, and a first module and a second module are disposed above the bracket. The first module and the second module are electrically connected with the first circuit board via a wiring structure passing through the through hole.
    Type: Application
    Filed: July 14, 2017
    Publication date: January 18, 2018
    Inventors: Tae Sik KIM, Myung Jae JO, Hye Won KANG, Ja Myeong KOO, Mu Jin KIM, Jeong Woon KOO, Dae Heon KWON, Sei Neu PARK, Won Hyun PARK, Jae Young YUN
  • Patent number: 8785792
    Abstract: Disclosed herein is a case structure of an electronic product to which a film-type electronic circuit is adhered. The case structure may include a case of an electronic product and a first film adhered to the case. The case structure may further include a second film adhered to the first film such that one surface of the second film contacts the first film, and an electronic circuit layer adhered to the first film. The electronic circuit layer may be arranged between the first film and the second film, wherein the first film is thermally adhered to the case. The first film may have a melting at a melting point that is lower than a heat-resistant temperature of the case.
    Type: Grant
    Filed: July 6, 2011
    Date of Patent: July 22, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ja Myeong Koo, Soon Min Hong, Tae Sang Park, Young Jun Moon, Gyun Heo, Sun Gu Yi
  • Patent number: 8624124
    Abstract: According to an example embodiment, the multilayer stretchable cable includes a multilayer stretchable film and a plurality of conductive lines in the stretchable film. The conductive lines are in at least two different layers of the multilayer stretchable film in a thickness direction of the stretchable film, at least one conductive line is a signal line and at least one other conductive line in a layer adjacent to the signal line is a ground line. The signal line and the ground line are in zigzag patterns and are parallel to a width direction of the multilayer stretchable film.
    Type: Grant
    Filed: April 1, 2011
    Date of Patent: January 7, 2014
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Ja Myeong Koo, Soon Wan Chung, Soon Min Hong, Young Jun Moon
  • Publication number: 20120018186
    Abstract: Disclosed herein is a case structure of an electronic product to which a film-type electronic circuit is adhered. The case structure may include a case of an electronic product and a first film adhered to the case. The case structure may further include a second film adhered to the first film such that one surface of the second film contacts the first film, and an electronic circuit layer adhered to the first film. The electronic circuit layer may be arranged between the first film and the second film, wherein the first film is thermally adhered to the case. The first film may have a melting at a melting point that is lower than a heat-resistant temperature of the case.
    Type: Application
    Filed: July 6, 2011
    Publication date: January 26, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ja Myeong Koo, Soon Min Hong, Tae Sang Park, Young Jun Moon, Gyun Heo, Sun Gu Yi
  • Publication number: 20110272181
    Abstract: According to an example embodiment, the multilayer stretchable cable includes a multilayer stretchable film and a plurality of conductive lines in the stretchable film. The conductive lines are in at least two different layers of the multilayer stretchable film in a thickness direction of the stretchable film, at least one conductive line is a signal line and at least one other conductive line in a layer adjacent to the signal line is a ground line. The signal line and the ground line are in zigzag patterns and are parallel to a width direction of the multilayer stretchable film.
    Type: Application
    Filed: April 1, 2011
    Publication date: November 10, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ja Myeong Koo, Soon Wan Chung, Soon Min Hong, Young Jun Moon
  • Publication number: 20110026233
    Abstract: Disclosed herein is an apparatus for manufacturing an elastic cable including conductor tracks arranged in a zigzag shape between elastic films. The apparatus may include a conductor track supplying unit to supply at least one conductor track, an aligning unit to align the at least one conductor track supplied from the conductor track supplying unit, a film supplying unit to supply elastic films such that the at least one conductor track is surrounded by the elastic films, and a thermal lamination roller unit to thermally laminate the at least one conductor track arranged between the elastic films, wherein the aligning unit is reciprocally movable to arrange the at least one conductor track in a zigzag shape between the elastic films when the at least one conductor track is supplied to the thermal lamination roller unit.
    Type: Application
    Filed: June 28, 2010
    Publication date: February 3, 2011
    Inventors: Soon Min Hong, Ja Myeong Koo, Young Jun Moon, Sun Gu Yi
  • Publication number: 20090139758
    Abstract: A printed circuit board (PCB) assembly is disclosed, which includes a first PCB on which a plurality of first electrode terminals are arranged at intervals from one another; a second PCB on which a plurality of second electrode terminals respectively connected with the first electrode terminals are arranged at intervals from one another; and separation preventing member which prevents the first and the second electrode terminals from deviating from their correct positions when the first and the second electrode terminals are ultrasonically-welded to each other. Accordingly, lateral movement of the first and the second PCBs relative to each other is restricted owing to the separation preventing member, the plurality of first electrode terminals and second electrode terminals can be bonded to each other without deviating from their correct positions.
    Type: Application
    Filed: June 3, 2008
    Publication date: June 4, 2009
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyo Young Shin, Seung Boo Jung, Young Jun Moon, Soon Min Hong, Chang Yong Lee, Ja Myeong Koo, Hyun Tae Kim, Jong Bum Lee, Hyun Joo Han