Abstract: Systems and methods for fabricating a substrate of a charged-particle detector for use in a charged-particle beam apparatus are disclosed. The substrate may include a charge sensing element formed on a first surface of the substrate and configured to detect charged particles originating from a sample; and a plurality of transistors formed in a first region of a second surface of the substrate, the second surface being opposite the first surface, wherein a top surface of each transistor of the plurality of transistors is coplanar with a top surface of the first region and with the second surface of the substrate.

Abstract: A charged particle detector includes a plurality of sensing elements. The sensing elements may be divided into in sections, with each section including an array of sensing elements. Each section may be coupled to adjacent sections by a set of switches in an upper hierarchy of a switch matrix. Individual sensing elements may be connected to the upper hierarchy in their section by pickup switches. Individual sensing elements may further be coupled to adjacent sensing elements by lateral switches in a lower hierarchy. When sensing elements are grouped together to detect a charged particle beam spot, an optimal configuration of lower and upper hierarchy switches may be selected to optimize bandwidth performance of the detector.

Abstract: A charged particle detector includes an array of sensing elements that may be selectively grouped with each other by a switch matrix. The sensing elements may be grouped in a shape and location that corresponds to an expected shape and location of beam spot to be detected. During a detection process, the grouping of sensing elements may be updated in real time. Updating may include both adding peripheral sensing elements to the group, as well as removing peripheral sensing elements from the group. A sensing element may be added if it is determined to be receiving sufficient irradiation from the beam spot. A sensing element may be removed if it is determined to not be receiving sufficient irradiation from the beam spot. The determination may be made by a thresholding circuit located within each sensing element.

Abstract: Detector modules, systems and methods for detecting signal beams are disclosed using a detector module and a support comprising a feedthrough. Furthermore, apparatuses, systems, and methods for sealing a vacuum system configured to provide an atmospheric environment and a vacuum chamber environment are disclosed. In some embodiments, a printed circuit board (PCB) comprising a first side for exposing to the atmospheric environment and a second side for exposing to the vacuum chamber environment and for covering an aperture in the vacuum chamber environment, wherein the second side is opposite to the first side. The apparatuses, systems, and methods may include a rigid body on the first side of the PCB and a device connected to the second side of the PCB and positioned on a portion of the PCB that covers the aperture. The PCB may be configured to provide an interface between the device and the rigid body.

Abstract: Detector modules, systems and methods for detecting signal beams are disclosed using a detector module and a support comprising a feedthrough. Furthermore, apparatuses, systems, and methods for sealing a vacuum system configured to provide an atmospheric environment and a vacuum chamber environment are disclosed. In some embodiments, a printed circuit board (PCB) comprising a first side for exposing to the atmospheric environment and a second side for exposing to the vacuum chamber environment and for covering an aperture in the vacuum chamber environment, wherein the second side is opposite to the first side. The apparatuses, systems, and methods may include a rigid body on the first side of the PCB and a device connected to the second side of the PCB and positioned on a portion of the PCB that covers the aperture. The PCB may be configured to provide an interface between the device and the rigid body.

Abstract: A detector for a scanning electron microscope (SEM) system comprises a semiconductor substrate, and a switching network formed on the semiconductor substrate and comprising a radiation hardened NMOS transistor, the NMOS transistor comprising a first source/drain diffusion region, a second source/drain diffusion region, and a gate patterned on the semiconductor substrate and encircling one of the first and second source/drain diffusion regions.

Abstract: A charged particle detector may include a plurality of sensing elements formed in a substrate, wherein a sensing element of the plurality of sensing elements is formed of a first region on a first side of the substrate, and a second region on a second side of the substrate, the second side being opposite to the first side. The detector may also include a plurality of third regions formed on the second side of the substrate, the third regions including one or more circuit components. The detector may also include an array of fourth regions formed on the second side of the substrate, the array of fourth regions being between adjacent third regions.

Abstract: Detector modules, systems and methods for detecting signal beams are disclosed using a detector module and a support comprising a feedthrough. Furthermore, apparatuses, systems, and methods for sealing a vacuum system configured to provide an atmospheric environment and a vacuum chamber environment are disclosed. In some embodiments, a printed circuit board (PCB) comprising a first side for exposing to the atmospheric environment and a second side for exposing to the vacuum chamber environment and for covering an aperture in the vacuum chamber environment, wherein the second side is opposite to the first side. The apparatuses, systems, and methods may include a rigid body on the first side of the PCB and a device connected to the second side of the PCB and positioned on a portion of the PCB that covers the aperture. The PCB may be configured to provide an interface between the device and the rigid body.

Abstract: An electrostatic clamp for use in holding an object onto a supporting table, the electrostatic clamp comprising: a multi-layer film comprising an electrode defined in an electrically conducting layer which is positioned between electrically insulating layers.

Abstract: A method of manufacturing a substrate holder for use in a lithographic apparatus, the method including providing a main body having a surface and a plurality of burls projecting from the surface and having end surfaces to support a substrate, providing a carrier surface adjacent the main body surface, and forming a conductive layer on at least part of the main body surface and an integral part on at least part of the carrier surface.

Abstract: An electrostatic clamp for use in holding an object onto a supporting table, the electrostatic clamp comprising: a multi-layer film comprising an electrode defined in an electrically conducting layer which is positioned between electrically insulating layers.

Abstract: A method of manufacturing a substrate holder for use in a lithographic apparatus, the method including providing a main body having a surface and a plurality of burls projecting from the surface and having end surfaces to support a substrate, providing a carrier surface adjacent the main body surface, and forming a conductive layer on at least part of the main body surface and an integral part on at least part of the carrier surface.

Abstract: A method of bonding a MEMS device to a substrate to form a MEMS device assembly. A thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate is determined. An adhesive is deposited onto a mating surface of the MEMS device and/or the mating surface of the substrate. The mating surfaces of the MEMS device and substrate are brought together, such that the adhesive can bond the MEMS device to the substrate. The volume of adhesive deposited at particular locations on the mating surface is varied to compensate for local variations in the thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate.

Abstract: A method of bonding a MEMS device to a substrate to form a MEMS device assembly. A thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate is determined. An adhesive is deposited onto a mating surface of the MEMS device and/or the mating surface of the substrate. The mating surfaces of the MEMS device and substrate are brought together, such that the adhesive can bond the MEMS device to the substrate. The volume of adhesive deposited at particular locations on the mating surface is varied to compensate for local variations in the thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate.