Patents by Inventor Jan Campbell

Jan Campbell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic assembly with back side metallization and method for forming the same
    Patent number: 7723224
    Abstract: A method is provided for forming a microelectronic assembly. A contact structure (46) is formed over a first side of a first substrate (20) having a microelectronic device formed over a second side thereof. The contact structure is electrically connected to the microelectronic device. A non-solderable layer (52) is formed over at least a portion of the contact structure and at least a portion of the first substrate. The contact structure and a second substrate (62) are interconnected with solder (68).
    Type: Grant
    Filed: June 14, 2006
    Date of Patent: May 25, 2010
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Darrell G. Hill, Philip H. Bowles, Jan Campbell, Terry K. Daly, Jason R. Fender, Lakshmi N. Ramanathan, Neil T. Tracht
  • Microelectronic assembly with back side metallization and method for forming the same
    Publication number: 20070293033
    Abstract: A method is provided for forming a microelectronic assembly. A contact structure (46) is formed over a first side of a first substrate (20) having a microelectronic device formed over a second side thereof. The contact structure is electrically connected to the microelectronic device. A non-solderable layer (52) is formed over at least a portion of the contact structure and at least a portion of the first substrate. The contact structure and a second substrate (62) are interconnected with solder (68).
    Type: Application
    Filed: June 14, 2006
    Publication date: December 20, 2007
    Inventors: Darrell G. Hill, Philip H. Bowles, Jan Campbell, Terry K. Daly, Jason R. Fender, Lakshmi N. Ramanathan, Neil T. Tracht