Patents by Inventor Jan-Chen Huang

Jan-Chen Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cutting tool
    Patent number: 8360828
    Abstract: A cutting tool suitable for cutting a workpiece placed on a photocurable adhesive layer is provided. The cutting tool includes a main body, a cutting layer and a light emitting material. The cutting layer is disposed on a surface of the main body and is applicable in cutting the workpiece. The light emitting material is disposed inside the cutting layer or between the main body and the cutting layer. The light emitting material is suitable for emitting a light capable of curing the photocurable adhesive layer adjacent to a cutting path as the workpiece is cut by the cutting layer.
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: January 29, 2013
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Jan-Chen Huang, Chu-Ching Sung, Ming-Yu Huang
  • CUTTING TOOL
    Publication number: 20110259166
    Abstract: A cutting tool suitable for cutting a workpiece placed on a photocurable adhesive layer is provided. The cutting tool includes a main body, a cutting layer and a light emitting material. The cutting layer is disposed on a surface of the main body and is applicable in cutting the workpiece. The light emitting material is disposed inside the cutting layer or between the main body and the cutting layer. The light emitting material is suitable for emitting a light capable of curing the photocurable adhesive layer adjacent to a cutting path as the workpiece is cut by the cutting layer.
    Type: Application
    Filed: September 3, 2010
    Publication date: October 27, 2011
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Jan-Chen Huang, Chu-Ching Sung, Ming-Yu Huang