Patents by Inventor Jan Danvir

Jan Danvir has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Selective underfill for flip chips and flip-chip assemblies
    Patent number: 6800946
    Abstract: The invention provides a method for attaching a flip chip to a printed wiring board. A bumped opto-electronic or electromechanical flip chip is provided. An underfill material is applied to a first portion of the flip chip, wherein a second portion of the flip chip is free of the underfill material. The flip chip is positioned on a printed wiring board, and a bumped portion of the flip chip is heated to electrically connect the flip chip to the printed wiring board. The second portion of the flip chip remains free of the underfill material when the flip chip is electrically connected to the printed wiring board.
    Type: Grant
    Filed: December 23, 2002
    Date of Patent: October 5, 2004
    Assignee: Motorola, Inc
    Inventors: Marc Chason, Jan Danvir
  • Selective underfill for flip chips and flip-chip assemblies
    Publication number: 20040118599
    Abstract: The invention provides a method for attaching a flip chip to a printed wiring board. A bumped opto-electronic or electromechanical flip chip is provided. An underfill material is applied to a first portion of the flip chip, wherein a second portion of the flip chip is free of the underfill material. The flip chip is positioned on a printed wiring board, and a bumped portion of the flip chip is heated to electrically connect the flip chip to the printed wiring board. The second portion of the flip chip remains free of the underfill material when the flip chip is electrically connected to the printed wiring board.
    Type: Application
    Filed: December 23, 2002
    Publication date: June 24, 2004
    Applicant: MOTOROLA, INC.
    Inventors: Marc Chason, Jan Danvir