Patents by Inventor Jan-Der Guo

Jan-Der Guo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming LED by a substrate removal process
    Patent number: 7026181
    Abstract: The present invention relates to a method for forming LED. In the present invention, LED dies are defined by photolithography and etching processes to replace a cutting step, and a metal substrate of the LED is formed by chemical or physical method.
    Type: Grant
    Filed: August 1, 2005
    Date of Patent: April 11, 2006
    Assignee: Advanced Epitaxy Technology
    Inventors: Jan-Der Guo, Wen-Chung Tsai, Tsung-Yu Chen, Shao-Hua Huang
  • Method for forming LED by a substrate removal process
    Publication number: 20050272176
    Abstract: The present invention relates to a method for forming LED. In the present invention, LED dies are defined by photolithography and etching processes to replace a cutting step, and a metal substrate of the LED is formed by chemical or physical method.
    Type: Application
    Filed: August 1, 2005
    Publication date: December 8, 2005
    Inventors: Jan-Der Guo, Wen-Chung Tsai, Tsung-Yu Chen, Shao-Hua Huang
  • Method for forming LED by a substrate removal process
    Patent number: 6969626
    Abstract: The present invention relates to a method for forming LED. In the present invention, LED dies are defined by photolithography and etching processes to replace a cutting step, and a metal substrate of the LED is formed by chemical or physical method.
    Type: Grant
    Filed: February 5, 2004
    Date of Patent: November 29, 2005
    Assignee: Advanced Epitaxy Technology
    Inventors: Jan-Der Guo, Wen-Chung Tsai, Tsung-Yu Chen, Shao-Hua Huang
  • Method for forming LED by a substrate removal process
    Publication number: 20050176162
    Abstract: The present invention relates to a method for forming LED. In the present invention, LED dies are defined by photolithography and etching processes to replace a cutting step, and a metal substrate of the LED is formed by chemical or physical method.
    Type: Application
    Filed: February 5, 2004
    Publication date: August 11, 2005
    Inventors: Jan-Der Guo, Wen-Chung Tsai, Tsung-Yu Chen, Shao-Hua Huang