Abstract: The present document relates to an electrode for use in a layered device structure, the electrode comprising at least one layer of conductive material, wherein the electrode comprises at least one micro evaporator having an evaporator inlet for receiving a cooling fluid and an evaporator outlet for removing the cooling fluid after evaporation, wherein the micro evaporator includes a plurality of micro channels forming an evaporation volume, the micro channels being embedded in the layer of conductive material. The present document further relates to a battery design including such an electrode.

Abstract: An illumination module may include an emitter configured to emit light along an optical axis of the illumination module and an optical system located on or over the emitter. The optical system may include a curved surface where the curved surface is tilted in a first direction, such that the optical system introduces optical aberration in the first direction.

Abstract: The invention pertains to a method of cooling a microchip, using vaporization of a cooling liquid in a vaporization chamber of a cooling element wherein the vaporization chamber comprises channels and a plurality of flow-modifying structures.

Abstract: The present document relates to an electrode for use in a layered device structure, the electrode comprising at least one layer of conductive material, wherein the electrode comprises at least one micro evaporator having an evaporator inlet for receiving a cooling fluid and an evaporator outlet for removing the cooling fluid after evaporation, wherein the micro evaporator includes a plurality of micro channels forming an evaporation volume, the micro channels being embedded in the layer of conductive material. The present document further relates to a battery design including such an electrode.

Abstract: In the field of release and pickup of ultrathin semiconductor dies, there is provided an active carrier (1) for carrying a wafer (20) and a method for using such a carrier (1). The wafer (20) comprises a particular die arrangement (P). The active carrier (1) comprises a base plate (2) and a number of energizers (7) constructed on or in this base plate (2). The energizers (7) are laid out in an arrangement corresponding to the die arrangement (P). The energizers (7) can locally energize an adhesive layer (3) in proximity to a selected die (14) from the die arrangement (P). By this local energizing of the adhesive layer (P), the selected die is loosened from the adhesive layer (3). Furthermore the active carrier (1) comprises a plurality of externally addressable contacts (12) and conduction pathways (9). The conduction pathways (9) connect the contacts (12) to the energizers (7) thereby allowing individual control over said energizers (7) by addressing said contacts (12).