Abstract: The present invention relates to a process for recovering platinum group metals from a feed containing one or more precursor compounds of one or more platinum group metal ions, wherein the process comprises the steps of (i) supplying to a cathode compartment of an electrochemical cell equipped with a cathode comprising a gas diffusion electrode with a porous electrochemically active material, the feed containing the one or more precursor compounds to form a liquid phase in the cathode compartment, (ii) supplying a CO2 containing gas to the cathode compartment, (iii) applying a potential to the cathode which is such as to cause electrochemical reduction of the CO2 to CO, (iv) and recovering from the liquid phase precipitated particles of the one or more platinum group metals in clemental form.

Abstract: Ionic compounds containing an anion, and a cation having the following structural formula (1): R1R2R3N+-(linker1)-O-(linker2)-(FC)??(1) wherein: R1 and R2 either linear or branched alkyl groups or together form a N-heterocylic ring with the nitrogen atom to which they are joined; R3 is linear or branched alkyl group; linker1 and linker2 are alkylene chains or polyether chains; and the group FC is a fluorinated alkyl group, as well as an electrolyte material comprising such an ionic compound and a metal salt, and metal-air batteries using such an electrolyte material. The invention also relates to a metal-air battery containing an electrolyte material, wherein the electrolyte material comprises at least one ionic compound and a metal salt, and wherein at least one ionic compound contains an anion CnF2n+1COO? or CnF2n+1SO3?, where in each case n is at least 1 and at most 10.

Abstract: Ionic compounds containing an anion, and a cation having the following structural formula (1): R1R2R3N+-(linker1)-O-(linker2)-(FC)??(1) wherein: R1 and R2 either linear or branched alkyl groups or together form a N-heterocylic ring with the nitrogen atom to which they are joined; R3 is linear or branched alkyl group; linker1 and linker2 are alkylene chains or polyether chains; and the group FC is a fluorinated alkyl group, as well as an electrolyte material comprising such an ionic compound and a metal salt, and metal-air batteries using such an electrolyte material. The invention also relates to a metal-air battery containing an electrolyte material, wherein the electrolyte material comprises at least one ionic compound and a metal salt, and wherein at least one ionic compound contains an anion CnF2n+1COO? or CnF2n+1SO3?, where in each case n is at least 1 and at most 10.

Abstract: Nano-sized particles of carbon black and various metal ions are mixed to form substantially homogenous solutions or dispersions. The nano-sized particles of carbon black and metal ions are electroplated on various types of substrates as composites of one or more metals and substantially uniformly dispersed nano-sized particles of carbon black within the metals.

Abstract: A method to electrodeposit or electroless deposit material onto substrates from ionic liquids in vacuum or in a protective atmosphere after exposing the ionic liquid to vacuum and the resulting material. According to the invention, dense layers, free of unwanted components, can be produced in vacuum or in a protective atmosphere after exposing the ionic liquid to vacuum.

Abstract: The invention provides a process of making porous structures or materials, including the colloidal processing (e.g. slip casting, pressure casting, tape casting or electrophoretic deposition) of solid particle emulsions to form a green body that can be directly sintered without a de-binding step.

Abstract: From an environmental, safety and economic perspective water should be the solvent of choice for electrophoretic deposition under industrial circumstances. However, because of the electrolytic decomposition of water, the majority of EPD is carried out in non-aqueous solvents. Approaches of the art for aqueous deposition involve the separation of the reaction and deposition front by means of a membrane, the use of palladium electrodes to absorb the formed hydrogen, addition of chemicals to suppress the electrolysis reaction, or lowering voltages below the threshold for water electrolysis. With the first two solutions, the production of coatings is impractical since the deposit is not formed on the electrode, or the electrode material is not suitable since the substrate is usually prescribed by the application. The use of specialty chemicals is expensive and difficult to control.

Abstract: The present invention concerns a new process for depositing a thick compact layer of biomolecules for instance such a layer with thickness in the ?m scale and, for depositing a thick compact layer of cells in the ?m scale. The deposited layer is made by application of an unbalanced (asymmetrical) alternating voltage polarization between two electrodes to a dissolved biomolecule or cell from low conductivity solutions. The process allows the rapid manufacturing of sensors and the coating of devices with functional cells and biomolecules. Examples are provided on the preparation of functional sensors such as a glucose, a lactose sensor, a hydrogen peroxide sensor and a glutamate sensor. Examples are also provided on the deposition of eukaryoric cells such as saccharomyces cerevisiae. The examples demonstrate a process that can be applied to coat devices with biomolecules and biological cells.

Abstract: Manufacturing a semiconductor device involves forming (200) a sacrificial layer where a micro cavity is to be located, forming (210) a metal layer of thickness greater than 1 micron over the sacrificial layer, forming (220) a porous layer from the metal layer, the porous layer having pores of length greater than ten times their breadth, and having a breadth in the range 10 nm-500 nanometers. The pores can be created by anodising, electrodeposition or dealloying. Then the sacrificial layer can be removed (230) through the porous layer, to form the micro cavity, and pores can be sealed (240). Encapsulating MEMS devices with a porous layer can reduce costs by avoiding using photolithography for shaping the access holes since the sacrificial layer is removed through the porous membrane.

Abstract: The invention provides a process of making porous structures or materials, including the colloidal processing (e.g. slip casting, pressure casting, tape casting or electrophoretic deposition) of solid particle emulsions to form a green body that can be directly sintered without a de-binding step.

Abstract: Manufacturing a semiconductor device involves forming (200) a sacrificial layer where a micro cavity is to be located, forming (210) a metal layer of thickness greater than 1 micron over the sacrificial layer, forming (220) a porous layer from the metal layer, the porous layer having pores of length greater than ten times their breadth, and having a breadth in the range 10 nm-500 nanometers. The pores can be created by anodising, electrodeposition or dealloying. Then the sacrificial layer can be removed (230) through the porous layer, to form the micro cavity, and pores can be sealed (240). Encapsulating MEMS devices with a porous layer can reduce costs by avoiding using photolithography for shaping the access holes since the sacrificial layer is removed through the porous membrane.

Abstract: The invention provides a process of making porous structures or materials, including the colloidal processing (e.g. slip casting, pressure casting, tape casting or electrophoretic deposition) of solid particle emulsions to form a green body that can be directly sintered without a de-binding step.

Abstract: The invention provides a process of making porous structures or materials, including the colloidal processing (e.g. slip casting, pressure casting, tape casting or electrophoretic deposition) of solid particle emulsions to form a green body that can be directly sintered without a de-binding step.

Abstract: The invention provides a process of making porous structures or materials, including the colloidal processing (e.g. slip casting, pressure casting, tape casting or electrophoretic deposition) of solid particle emulsions to form a green body that can be directly sintered without a de-binding step.

Abstract: Manufacturing a semiconductor device involves forming (200) a sacrificial layer where a micro cavity is to be located, forming (210) a metal layer of thickness greater than 1 micron over the sacrificial layer, forming (220) a porous layer from the metal layer, the porous layer having pores of length greater than ten times their breadth, and having a breadth in the range 10 nm-500 nanometers. The pores can be created by anodising, electrodeposition or dealloying. Then the sacrificial layer can be removed (230) through the porous layer, to form the micro cavity, and pores can be sealed (240). Encapsulating MEMS devices with a porous layer can reduce costs by avoiding using photolithography for shaping the access holes since the sacrificial layer is removed through the porous membrane.