Patents by Inventor Jan Haisma
Jan Haisma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8472006Abstract: The joint between the projection system element and its support comprises an inorganic layer or a direct bond and is thus liquid tight, which can prevent deformation by an immersion liquid. The joint can be made either warm or cold. Solders, glue, and glue protection can all be used in the formation of this joint. In an embodiment, the elements and its support are made of quartz.Type: GrantFiled: May 8, 2009Date of Patent: June 25, 2013Assignees: ASML Netherlands B.V., Carl Zeiss SMT GmbHInventors: Bob Streefkerk, Johannes Jacobus Matheus Baselmans, Paul Graupner, Jan Haisma, Nicodemus Hattu, Christiaan Alexander Hoogendam, Erik Roelof Loopstra, Johannes Catharinus Hubertus Mulkens, Bernard Gellrich
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Publication number: 20090214986Abstract: The joint between the projection system element and its support comprises an inorganic layer or a direct bond and is thus liquid tight, which can prevent deformation by an immersion liquid. The joint can be made either warm or cold. Solders, glue, and glue protection can all be used in the formation of this joint. In an embodiment, the elements and its support are made of quartz.Type: ApplicationFiled: May 8, 2009Publication date: August 27, 2009Applicants: ASML NETHERLANDS B.V., CARL ZEISS SMT AGInventors: Bob STREEFKERK, Johannes Jacobus Matheus BASELMANS, Paul GRAUPNER, Jan HAISMA, Nicodemus HATTU, Christiaan Alexander HOOGENDAM, Erik Roelof LOOPSTRA, Johannes Catharinus Hubertus MULKENS, Bernard GELLRICH
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Patent number: 7545481Abstract: The joint between the projection system element and its support comprises an inorganic layer or a direct bond and is thus liquid tight, which can prevent deformation by an immersion liquid. The joint can be made either warm or cold. Solders, glue, and glue protection can all be used in the formation of this joint. In an embodiment, the elements and its support are made of quartz.Type: GrantFiled: November 24, 2003Date of Patent: June 9, 2009Assignees: ASML Netherlands B.V., Carl Zeiss SMT AGInventors: Bob Streefkerk, Johannes Jacobus Matheus Baselmans, Paul Graupner, Jan Haisma, Nicodemus Hattu, Christiaan Alexander Hoogendam, Erik Roelof Loopstra, Johannes Catharinus Hubertus Mulkens, Bernard Gellrich
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Publication number: 20060118817Abstract: A stress free composite substrate is disclosed comprising a carrier (2) composed of a carrier material, a first layer (12) composed of a first material, and an intermediate layer composed of a second material being located between the carrier (2) and the first layer (12), wherein the first material has a dilatation behavior being substantially the same as that of the carrier material, and having a dilatation mismatch with the second material, the intermediate layer (6) having structures (8) of second material for absorbing stress originating from the dilatation mismatch. A method for making such a stress free composite substrate is also disclosed.Type: ApplicationFiled: November 20, 2003Publication date: June 8, 2006Applicant: Koninklijke Philips Electronics N.V.Inventor: Jan Haisma
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Publication number: 20050110973Abstract: The joint between the projection system element and its support comprises an inorganic layer or a direct bond and is thus liquid tight, which can prevent deformation by an immersion liquid. The joint can be made either warm or cold. Solders, glue, and glue protection can all be used in the formation of this joint. In an embodiment, the elements and its support are made of quartz.Type: ApplicationFiled: November 24, 2003Publication date: May 26, 2005Applicants: ASML NETHERLANDS B.V., CARL ZEISS SMT AGInventors: Bob Streefkerk, Johannes Baselmans, Paul Graupner, Jan Haisma, Nicodemus Hattu, Christiaan Hoogendam, Erik Loopstra, Johannes Hubertus Mulkens, Bernard Gellrich
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Patent number: 6252982Abstract: An image processing system creates a 2-dimensional output image with enhanced depth sensation by operating on a 2-dimensional input image. The system processes the input image non-uniformly by selecting an area in the input image according to a predetermined criterion, and changing a property, e.g., its brightness, of the area relative to a corresponding property of a complement of the area in the input image.Type: GrantFiled: August 4, 1995Date of Patent: June 26, 2001Assignee: U.S. Philips CorporationInventors: Jan Haisma, Franciscus P. Widdershoven, Marnix G. Collet
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Patent number: 6054969Abstract: A three-dimensional image display system, based on a novel depth concept referred to as Double-D-Depth, includes a first display device (3) and at least a second display device (4) which, viewed along the system axis (9-91), are offset with respect to each other and are each intended to partially display the same two-dimensional image of a scene, while parameters which are relevant to depth representation are included in the form of an additional dedicated intensity gradation in at least one of the displayed images, and all images, together with the axial distance (.quadrature.L) in between, evoke a depth effect with a viewer (10).Type: GrantFiled: March 7, 1996Date of Patent: April 25, 2000Assignee: U.S. Philips CorporationInventor: Jan Haisma
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Patent number: 5757883Abstract: A method of manufacturing an X-ray optical element. The element consists of a body of a material having a shape memory. At a high temperature, i.e. a temperature beyond the transition temperature of the material, the body is pressed so as to impart a first, desired shape. A surface of the body is thus shaped for example, as a logarithmic spiral or as another curved shape. After cooling to a low temperature, i.e. a temperature below the transition temperature of the material, a second, machinable shape is imparted to the body, preferably a flat surface. A number of precision operations can be performed on this second, machinable shape, for example polishing to a surface roughness of 0.5 nm RMS. Subsequent to this precision operation, the body is heated and resumes its first, desired shape which is retained after cooling. The body can be provided, if desired, with a comparatively thin surface layer which is also polished in the flat shape and which bends when the body resumes the desired shape.Type: GrantFiled: April 24, 1996Date of Patent: May 26, 1998Assignee: U.S. Philips CorporationInventors: Jan Haisma, Johannes F. M. D'Achard Van Enschut, Cornelis L. Adema, Jan C. Gijsbers, Pieter K. De Bokx
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Patent number: 5688714Abstract: A method is set forth of manufacturing a silicon body (5) having an n-type top layer (1') and an adjoining, more highly doped n-type base layer (2'), by which a first, n-type silicon slice (1) and a second, more highly doped n-type silicon slice (2) are put one on the other and then bonded together by heating. To obtain a low contact resistance between top layer (1') and base layer (2'), a boundary layer having a higher doping than the to player (1') is provided in the top layer (1') adjoining the base layer (2'). According to the invention, the boundary layer is formed by diffusion of an n-type dopant (11, 14) into the first slice (1) from the second slice (2) during heating. The concentration of the n-type dopant (11, 14) is taken to be so high in this case that boron (12) present as an impurity is overdoped, so that undesired pn transitions cannot occur.Type: GrantFiled: March 7, 1996Date of Patent: November 18, 1997Assignee: U.S. Philips CorporationInventors: Franciscus P. Widdershoven, Jan Haisma, Arie J. R. De Kock, Aart A. Van Gorkum
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Patent number: 5637028Abstract: Method of polishing a surface (5a) of a noble metal or an alloy comprising mainly noble metal, in which a polishing means is moved across the surface while exerting a polishing pressure for obtaining a plane and smooth polished surface without any defects. A composition comprising demineralized water with 20 to 40% by weight of an organic liquid comprising a poly-alcohol or a derivative thereof, for example, glycerol, and particles which can be encapsulated and have a Knoop's hardness of between 5 and 50 GPa, for example Al.sub.2 O.sub.3 grains, is used as a polishing means.Type: GrantFiled: March 16, 1994Date of Patent: June 10, 1997Assignee: U.S. Philips CorporationInventors: Jan Haisma, Cornelis L. Adema, Lambertus Postma, Mathijs P. H. Souts
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Patent number: 5622525Abstract: Method of polishing a surface (5a) of copper or an alloy comprising mainly copper, in which a polishing means is moved across the surface while exerting a polishing pressure of approximately 500 g/cm.sup.2 for obtaining a plane and smooth polished surface without any defects. A composition of a polishing component comprising a colloidal suspension of SiO.sub.2 particles having an average particle size of between 20 and 50 nm in an alkali solution, demineralized water and a chemical activator is used as a polishing means.Type: GrantFiled: March 16, 1994Date of Patent: April 22, 1997Assignee: U.S. Philips CorporationInventors: Jan Haisma, Peter W. De Haas, Dirk K. G. De Boer, Waltherus W. Van den Hoogenhof, Lambertus Postma
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Patent number: 5580407Abstract: A first object, which comprises organic material, is bonded to a second object by a method whereby both objects are provided with complementary optically smooth surfaces, subsequent to which these surfaces are brought into substantial contact with one another, consequent upon which spontaneous atomic bonds are formed between atoms of the two objects. The strength of the atomic bonds thus formed can be increased by subsequently heating the region of contact of the two surfaces.Type: GrantFiled: July 13, 1994Date of Patent: December 3, 1996Assignee: U.S. Philips CorporationInventors: Jan Haisma, Franciscus J. H. M. Van Der Kruis, Gijsbertus A. C. M. Spierings
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Patent number: 5547119Abstract: The method of intimately joining a hard magnetic part to a soft magnetic part in the manufacture of an electrical machine comprising polishing the joining surfaces such that the surface roughness hight is about less than or equal to two nanometers and joining the parts by direct bonding.Type: GrantFiled: May 24, 1995Date of Patent: August 20, 1996Assignee: U.S. Philips CorporationInventors: Jan Haisma, Evert M. H. Kamerbeek, Gijsbertus A. C. M. Spierings, Peter W. De Haas
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Patent number: 5531016Abstract: Method of manufacturing a thin-film magnetic head in which a main layer (5) of a non-magnetic material is formed on a support, which layer is recessed by removing material from a side remote from the support, said recess being subsequently filled up with a soft-magnetic material for forming a flux guide (17a, 17b), whereafter the main layer provided with the filled recess is mechanochemically polished for forming a main surface (19) at which subsequently a layer of a magnetoresistive material is provided for forming a magnetoresistive element (23).Type: GrantFiled: March 22, 1994Date of Patent: July 2, 1996Assignee: U.S. Philips CorporationInventors: Lambertus Postma, Henricus G. R. Maas, Jan Haisma, Jacobus J. M. Ruigrok, Gerardus H. J. Somers
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Patent number: 5483735Abstract: Method of manufacturing a magnetoresistive magnetic head in which a first insulation layer (5) of a non-magnetic material is formed on a support face (3a), on which insulation layer a soft-magnetic layer having an upper face remote from the first insulation layer is formed by deposition of a soft-magnetic material. Subsequently a layer portion is removed for forming the flux-guiding elements (17a, 17b) and an aperture extending between said elements, and non-magnetic material for forming a second insulation layer (18) having an upper face remote from the soft-magnetic layer is deposited on the soft-magnetic layer and in the aperture formed therein, which second insulation layer has such a thickness that, viewed in a direction transverse to the support face, the smallest distance between the support face and the upper face of the second insulation layer is larger than the largest distance between the support face and the upper face of the soft-magnetic layer.Type: GrantFiled: March 22, 1994Date of Patent: January 16, 1996Assignee: U.S. Philips CorporationInventors: Lambertus Postma, Jan Haisma, Jacobus J. M. Ruigrok, Gerardus H. J. Somers
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Patent number: 5483115Abstract: An electrical machine comprises a stationary first section (1) and a second section (5) which is movable relative to the stationary section. At least one of the sections comprises a soft-magnetic part (7) and a hard-magnetic part (9). A surface (7a) of the soft-magnetic part and a surface (9a) of the hard-magnetic part are fixed intimately to one another by direct bonding.Type: GrantFiled: August 2, 1994Date of Patent: January 9, 1996Assignee: U.S. Philips CorporationInventors: Jan Haisma, Evert M. H. Kamerbeek, Gijsbertus A. C. M. Spierings, Peter W. De Haas
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Patent number: 5441442Abstract: Methods and device for manufacturing a plate with a plane main surface or with parallel main surfaces, whereby material is taken off from the edges of the plate and from the central portion of the plate alternately by means of polishing in order to obtain main surfaces having a convex, plane, or concave shape. Polishing is stopped after at least one transition from convex to concave or vice versa at the moment at which the main surface has a substantially plane shape or has substantially parallel main surfaces.Type: GrantFiled: June 3, 1993Date of Patent: August 15, 1995Assignee: U.S. Philips CorporationInventors: Jan Haisma, Peter W. De Haas, Franciscus J. H. M. Van Der Kruis, Jakob Vijfvinkel
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Patent number: 5425848Abstract: A description is given of a method and a device (1) for providing (replicating) a patterned resyntetic resin relief (37) on the surface (25) of a glass substrate (27). For this purpose, a UV-curable acrylate lacquer (33) is applied to the surface (25), after which a transparent mould (3) having a relief (13) is rolled-off over the surface (25). By means of a UV light source (17) and an elliptic mirror (21), the lacquer is cured at the location of the focal line (23), thereby forming said relief (37). The relief (13) of the mould (3) is replicated on the glass substrate (27). The method described enables a relief of small dimensions (10.times.10 .mu.m) to be seamlessly provided on a large fiat surface (1.times.1 m), without being hindered by large release forces.Type: GrantFiled: March 15, 1994Date of Patent: June 20, 1995Assignee: U.S. Philips CorporationInventors: Jan Haisma, Martinus Verheijen, Johannes T. Schrama
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Patent number: 5302559Abstract: A method of growing mixed crystals having at least two lattice sites each having a different number of adjacent oxygen ions from melts of oxidic multi-component systems, homogeneous mixed crystals being grown such that the cations intended to occupy the first lattice site having the highest number of adjacent oxygen ions and to occupy the second lattice site having the next lowest number of adjacent oxygen ions are chosen such that the ratio of the bond length of the cations in the first lattice site to the bond length of the cations in the second lattice site is in the range from 0.7 to 1.5.Type: GrantFiled: June 2, 1992Date of Patent: April 12, 1994Assignee: U.S. Philips CorporationInventors: Dieter Mateika, Erich Volkel, Jan Haisma
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Patent number: 5299247Abstract: The invention provides a signal processing device including sampling means (31, 41, 32) for sampling an input signal in the form of charge carrier packages and a shift register (4) having an input region (41) to which a signal sample is offered during operation, and provided with transport means (2) for transporting the signal sample to an output region (42) of the shift register. The device according to the invention is capable of adapting itself to the frequency with which the input signal is sampled in such a way that the storage of the increase in signal samples which accompanies an increase in the sampling frequency does not require additional space. For this purpose, according to the invention, the shift register comprises a transport channel (4) in which an electron-hole liquid can exist. The sampling means (31, 41, 32) are capable of sampling the input signal in the form of electron-hole droplets (71 . . .Type: GrantFiled: October 14, 1992Date of Patent: March 29, 1994Assignee: U.S. Philips CorporationInventors: Franciscus P. Widdershoven, Jan Haisma