Abstract: Disclosed is a manufacturing method of a circuit of a printed circuit board using a dry film resist in forming a circuit pattern on a copper overlaid laminate as a normal printed circuit board, in which a modification of the manufacturing process can enhance the resolution and fine weldability of the resist to realize a fine structure of the circuit pattern. The method includes: laminating the dry film resist on the top surface of the printed circuit board; exposing the dry film resist to ultraviolet (UV) radiations using a photomask in which a desired circuit pattern is formed; annealing the resulting material of the previous step with infrared (IR) radiations; and removing unexposed areas of the resist by development.