Abstract: A ceramic material has the following composition: (Ba1-xMnx)O.z(Ti1-yMmy)O2.Dd.Ee. In this composition, (Ba1-xMnx)=A and (Ti1-yMmy)=B, where Mn stands for at least one element selected from: Mg, Ca, Sr, Pb and mixtures thereof; Mm stands for at least one element selected from: Sn, Zr and mixtures thereof; D stands for at least one element having donor properties; E stands for at least one element having acceptor properties. The following applies for the parameters: 0?x?0.6; 0?y?0.35; 0?d?0.02; 0?e?0.02; 1<z; and the following applies for the molar ratio of B to A: 1<B/A. The ceramic material comprises Si only as an impurity.

Abstract: A feedstock for injection molding includes a ceramic filler that is sinterable to produce a ceramic with a positive temperature coefficient of electrical resistance, a matrix for binding the ceramic filler, the matrix having a melting point lower than a melting point of the ceramic filler, and metallic impurities. A content of the metallic impurities in the feedstock is lower than 10 ppm.

Abstract: A heating device is provided, comprising a shaped body, which has at least two regions comprising different compositions of a ceramic material with a positive temperature coefficient of electrical resistance. A method for manufacturing a heating device is furthermore specified.

Abstract: A heating module includes a housing with an opening, and a PTC ceramic heating element arranged in the housing having an inner face facing toward the opening, an outer face facing away from the opening and two end faces connecting the inner and outer faces, wherein the inner face is at least partially matched to the opening.

Abstract: The invention relates to a heating arrangement in the shape of a frame.

Abstract: A molded body is provided, having a first region (10) comprising a first ceramic material with a positive temperature coefficient of the electric resistance and a second region (20) comprising a second material and a third region (30) comprising a third ceramic material. Furthermore, the invention relates to a heating device comprising said molded body. Furthermore, a method for producing a molded body is provided.

Abstract: A ceramic material has the following composition: (Ba1-xMnx)O.z(Ti1-yMmy)O2.Dd.Ee. In this composition, (Ba1-xMnx)=A and (Ti1-yMmy)=B, where Mn stands for at least one element selected from: Mg, Ca, Sr, Pb and mixtures thereof; Mm stands for at least one element selected from: Sn, Zr and mixtures thereof; D stands for at least one element having donor properties; E stands for at least one element having acceptor properties. The following applies for the parameters: 0?x?0.6; 0?y?0.35; 0?d?0.02; 0?e?0.02; 1<z; and the following applies for the molar ratio of B to A: 1<B/A. The ceramic material comprises Si only as an impurity.

Abstract: The invention relates to a functional module and a method for producing a functional module. The functional module includes an outer tube having a first and second end face and an inner surface. The functional module also includes an inner tube having a first and second end face and a lateral surface disposed within the outer tube. At least one molded part is disposed in a form-fitting manner between the inner surface of the outer tube and the shell surface of the inner tube. The functional module has a material with a positive temperature coefficient of electrical resistance. The first end face of the inner tube and the outer tube is disposed on an electrically isolative substrate and the molded part is thereby fixed between the outer tube and the inner tube by clamping force.

Abstract: A heating apparatus and a method for producing a heating apparatus are specified. The heating apparatus comprises a pipe (10), which is suitable for conducting a medium and has an outer surface, and at least one injection-molded shaped body on the outer surface of the pipe (10). The shaped body comprises a material with a positive temperature coefficient of electrical resistance and is adapted to the outer surface of the pipe (10).

Abstract: A PTC-resistor includes a base body made of a ceramic material with a positive temperature coefficient of resistance. The base body extends along a median plane, and is confined by surfaces. At least one surface is configured to electrically connect the base body. An area of the at least one surface is larger than an area of a parallel projection of the base body in a direction perpendicular to the median plane.

Abstract: A mold (30), which has a first region (10) comprising an electroceramic material and a second region (20) comprising a structural ceramic material, is provided. A heating device with this mold is also specified. Furthermore, a method for producing a mold is provided.

Abstract: A heating device is provided, comprising a shaped body, which has at least two regions comprising different compositions of a ceramic material with a positive temperature coefficient of electrical resistance. A method for manufacturing a heating device is furthermore specified.

Abstract: A PTC-resistor includes a base body made of a ceramic material with a positive temperature coefficient of resistance. The base body extends along a median plane, and is confined by surfaces. At least one surface is configured to electrically connect the base body. An area of the at least one surface is larger than an area of a parallel projection of the base body in a direction perpendicular to the median plane.

Abstract: A resistor arrangement with resistor elements is specified that are arranged essentially regularly and that are spaced apart from each other and that are interconnected by a flexible substrate. According to a first preferred embodiment, intermediate spaces that are provided to carry a flow of flowing medium are arranged between the resistor elements. According to a second preferred embodiment, the resistor elements are arranged between two flexible substrates and are rigidly connected to these substrates. According to a third preferred embodiment, an electrically insulating adhesive layer that has openings through which the resistor elements are conductively connected to the substrate is arranged between the resistor elements and the substrate. According to a fourth preferred embodiment, the substrate is composed of, as a ground material, an elastic plastic that is filled with electrically conductive particles. In addition, a method for producing the resistor arrangement is specified.

Abstract: According to a first preferred embodiment, a resistor arrangement with resistor elements is specified whose first electrodes are conductively connected to each other by means of a flexible, conductive connection element that is curved. The connection element has changes in curvature in the regions arranged between two adjacent resistor elements. According to a second preferred embodiment, a resistor arrangement with resistor elements is specified that are connected to each other by a flexible connection element. The resistor elements each have an arrangement of slot-like recesses.

Abstract: According to a first preferred embodiment, a resistor arrangement with resistor elements is specified whose first electrodes are conductively connected to each other by means of a flexible, conductive connection element that is curved. The connection element has changes in curvature in the regions arranged between two adjacent resistor elements. According to a second preferred embodiment, a resistor arrangement with resistor elements is specified that are connected to each other by a flexible connection element. The resistor elements each have an arrangement of slot-like recesses.

Abstract: A resistor arrangement with resistor elements is specified that are arranged essentially regularly and that are spaced apart from each other and that are interconnected by a flexible substrate. According to a first preferred embodiment, intermediate spaces that are provided to carry a flow of flowing medium are arranged between the resistor elements. According to a second preferred embodiment, the resistor elements are arranged between two flexible substrates and are rigidly connected to these substrates. According to a third preferred embodiment, an electrically insulating adhesive layer that has openings through which the resistor elements are conductively connected to the substrate is arranged between the resistor elements and the substrate. According to a fourth preferred embodiment, the substrate is composed of, as a ground material, an elastic plastic that is filled with electrically conductive particles. In addition, a method for producing the resistor arrangement is specified.

Abstract: An injection molded nozzle includes a base body having a fluid channel, a fluid inlet, and a fluid outlet. The base body is made of a ceramic material with a positive temperature coefficient. The base body, in response to an electrical current, is configured to vaporize a fluid receivable in the fluid channel by heating. The fluid outlet is configured to eject vaporized fluid as a spray.

Abstract: A mold includes a fluid channel, a fluid inlet, and a fluid outlet. The mold is manufactured, at least in part, from a PTC-ceramic material. Upon application of a voltage to the mold, the mold is heated such that a fluid passing through the fluid channel may also be subject to heating.

Abstract: An injection molded body includes a ceramic material with a positive temperature coefficient containing less than 10 ppm of metallic impurities. A method for producing the injection molded body includes providing a feedstock for injection molding containing less than 10 ppm of metallic impurities, injecting the feedstock into a mold, removing a binder, sintering the molded body, and cooling the molded body.