Abstract: A magnetic mirror machine (2100; 2200; 3100; 3200) for plasma confinement comprises a plurality of longitudinally disposed superconductor coils (2104, 2105, 2106a, 2106b) arranged for producing an open-field-line plasma confinement area (2106), said plasma confinement area (2106) at each of two ends being limited by a respective mirror area (2108) of increased magnetic flux density relative to a central area (2110) of said plasma confinement area (2106), wherein a superconductor coil (2105, 2106a, 2106b) of said of plurality of superconductor coils is located adjacent to said mirror area (2108) and said superconductor coil (2105, 2106a, 2106b) of has a cross-section, in a plane intersecting a magnetic field line (2112) through said mirror area, having an elongate shape in a direction along said magnetic field line (2112).

Abstract: A plasma confinement device (500), comprises a first magnet system (1) comprising a first plurality of concentrically arranged circular-loop coils (11, 12), comprising a first coil (11) arranged to carry a current in a first direction; and a second coil (12) arranged to carry a current in a second direction opposite to the first direction; and a second magnet system (2) comprising a second plurality of concentrically arranged circular-loop coils (21, 22), arranged with mirror symmetry with respect to the first magnet system (1) relative to a symmetry plane (P) located between the first magnet system (1) and the second magnet system (2), creating an annular plasma confinement area (206) at the symmetry plane (P) with a magnetic field normal to the symmetry plane (P) at the symmetry plane (P).

Abstract: The present disclosure relates to a method for embossing a plastic sheet and a corresponding tool (1). The plastic sheet is pressed between first and second tool halves (3, 5) while being heated such that a pattern is imprinted on first and second faces (19, 21) of the plastic sheet. Reference marks (31, 33) are imprinted on both faces of the plastic sheet and the embossed plastic sheet is evaluated optically to determine error data based on the relative position of the first and second reference marks. This allows to adjust the embossing tool based on the error data for subsequent embossing operations.

Abstract: The present disclosure relates to a tool such as an injection molding tool or an embossing tool. A heating device including a stack of layers is provided for heating a tool surface. The stack may include a coil carrier layer with a number of wound coils for generating a magnetic field, and a conductive top layer, being adjacent to the tool surface currents are induced in the top layer to heat the surface. Efficient heating may be provided by solutions involving low resistivity layers that lead currents to the top layer without themselves developing heat to any greater extent. A conduction frame device can be provided beneath the top layer and around the perimeter thereof to provide reliable contact with a backing layer. A thermal resistance layer may placed between the intermediate layer and the top layer, and may comprise a heat resistive plastic material such as a polyimide.

Abstract: The present disclosure relates to a tool such as an injection moulding tool or an embossing tool. A heating device including a stack of layers is provided for heating a tool surface. The stack may include a coil carrier layer with a number of wound coils for generating a magnetic field, and a conductive top layer, being adjacent to the tool surface currents are induced in the top layer to heat the surface. Efficient heating may be provided by solutions involving low resistivity layers that lead currents to the top layer without themselves developing heat to any greater extent. A conduction frame device can be provided beneath the top layer and around the perimeter thereof to provide reliable contact with a backing layer.

Abstract: The present disclosure relates to a tool for injection moulding or embossing/pressing with means for heating an active tool surface, including a coil for generating an oscillating magnetic field in a conductive top layer adjacent to the active tool surface, and an electrically conductive intermediate layer (23), located between the coil carrier layer and the top layer. A thermal resistance layer (29) is located between the intermediate layer and the top layer and comprises a ceramic material thermal spray coating which is bonded to the layer beneath the thermal resistance layer as seen from the active tool surface.

Abstract: The present disclosure relates to a tool such as an injection moulding tool or an embossing tool. A heating device including a stack of layers is provided for heating a tool surface. The stack may include a coil carrier layer with a number of wound coils for generating a magnetic field, and a conductive top layer, being adjacent to the tool surface currents are induced in the top layer to heat the surface. Efficient heating may be provided by solutions involving low resistivity layers that lead currents to the top layer without themselves developing heat to any greater extent. A conduction frame device can be provided beneath the top layer and around the perimeter thereof to provide reliable contact with a backing layer.

Abstract: The present disclosure relates to a tool such as an injection moulding tool or an embossing tool. A heating device including a stack of layers is provided for heating a tool surface. The stack may include a coil carrier layer with a number of wound coils for generating a magnetic field, and a conductive top layer, being adjacent to the tool surface currents are induced in the top layer to heat the surface. Efficient heating may be provided by solutions involving low resistivity layers that lead currents to the top layer without themselves developing heat to any greater extent. A conduction frame device can be provided beneath the top layer and around the perimeter thereof to provide reliable contact with a backing layer.

Abstract: An injection-molding device includes at least first and second mould parts, defining a mould cavity, wherein at least one of the mould parts includes a heating device, for heating the mould part in the vicinity of a mould cavity surface, the heating device includes an inductive coil having a plurality of windings and being powered by an oscillator. The heating device further comprises a thin top member, which functions as a susceptor for electromagnetic energy emitted by the inductive coil, which is placed in grooves in a carrier member. An intermediate member is placed between the top member and the carrier member. The intermediate member does not function as a susceptor to any grater extent, but provides mechanical stability while allowing the heat generation to be concentrated to the top member.

Abstract: An injection-moulding device is disclosed, comprising at least first and second mould parts, defining a mould cavity, wherein at least one of the mould parts comprises heating means, for heating the mould part in the vicinity of a mould cavity surface, said heating means comprising an inductive coil having a plurality of windings and being powered by an oscillator. The mould part comprises a top member, at the mould cavity surface, and, beneath the top member, a carrier member comprising grooves for taking up said coil windings, wherein the top member resistivity is lower than 1.5*10?6 ?m, the top member relative magnetic permeability is lower than 10, the carrier member resistivity is higher than 20*10?6 ?m, and the carrier member relative magnetic permeability is higher than 50.

Abstract: An injection-moulding device is disclosed, comprising at least a first (1) and a second (3) mould part, defining a mould cavity (4). At least one of the mould parts comprises cooling ducts (5), for cooling the mould part in the vicinity of a mould cavity surface (11), and heating means (6), for heating the mould part in the vicinity of the mould cavity surface. The cooling ducts (16) comprise grooves, in a carrier member (17), and the heating means comprises an inductive coil (18) having a plurality of windings, wherein at least a part of the inductive coil is placed in a cooling duct groove.