Patents by Inventor Jan J. Hoetjer

Jan J. Hoetjer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacture of chipboard and a novel suitable bonding agent
    Patent number: 4510278
    Abstract: An improved method for the preparation of particleboard wherein a cellulose-containing particulate material is provided with a urea formaldehyde resin bonding agent and thereafter shaped and hardened at an elevated temperature and pressure. The bonding agent used is a urea-formaldehyde resin solution additionally containing melamine in an amount of 1.0 and 10 percent by weight, relative to the total amount of resin solids. The molar ratio of formaldehyde to mole equivalents of amino groups in the bonding agent is in the range of between 0.500:1 and 0.575:1.
    Type: Grant
    Filed: February 1, 1984
    Date of Patent: April 9, 1985
    Assignee: Methanol Chemie Nederland V.o.F.
    Inventor: Jan J. Hoetjer