Abstract: A process for the deposition of a metal on surfaces of a shaped plastic body. A catalyst for metal deposition is incorporated into a shaped body. After removing material from a surface of the body and activating the catalyst with an acid, metal is deposited on the surface by an electroless metal deposition process.

Abstract: A gold or gold alloy plating composition comprises: a source of gold ions such as potassium gold (I) cyanide; optionally a source of alloying metal (e.g. nickel or cobalt) ions, for example as a sulphate; optionally a complexing agent for the alloying metal ions if present, such as citic acid or oxalic acid; and a rate promoting additive compound of general formula IA or IB: ##STR1## wherein: each of R.sup.1 and R.sup.2 independently represents a hydrogen or halogen atom or a formyl, carbamoyl, C.sub.1-4 alkyl, amino, phenyl or benzyl group, wherein the alkyl, phenyl and benzyl moieties may optionally be substituted with one or more hydroxy or amino groups or halogen atoms;R.sup.3 represents a C.sub.1-6 alkylene radical which may optionally be hydroxylated; andQ represents --SO.sub.2 -- or --CO--.

Abstract: The difficulties associated with electroplating palladium metal or alloy deposits from palladium diammino dichloride, palladium diamino dinitrite and palladium triammino sulphite baths can be avoided by plating from palladium baths containing oxalate. The palladium and oxalate may be in a single complex, such as palladium diamino oxalate, (Pd(NH.sub.3).sub.2 C.sub.2 O.sub.4), palladium tetraamino oxalate (Pd(NH.sub.3).sub.4 C.sub.2 O.sub.4) or an ammonium or alkali metal salt of palladium dioxalate (M.sub.2 Pd(C.sub.2 O.sub.4)).sub.2), where M represents an ammonium or alkali metal cation.Alloying metal ions may also be present, as may an electrolyte, a brightener and/or a stress reducer.

Abstract: A citrate-free electroplating bath for the high speed deposition of gold alloy plates on substrates comprises a source of gold (for example gold (I) potassium cyanide), a source of alloying metal (for example, nickel sulfate), oxalic acid and formic acid. As citrate is not used, higher plating speeds are obtained and precipitates of certain citrate salts (for example, nickel citrate) are avoided.

Abstract: There is disclosed a chemical stripping solution suitable for removing tin and tin-lead alloys from metallized, e.g. copper coated, substrates so as to leave the said substrate reusable comprising an aqueous solution of hydrogen peroxide in an amount of 0.1 to 10 molar, ammonium bifluoride in an amount of 0.4 to 10 molar, an acid of a type and in an amount such as to maintain the pH of the solution at the surface being stripped below the value at which smut formation occurs whereby effective stripping is achieved in use, and a metal complexing compound in an amount of at least 0.005 molar, the said metal complexing compound comprising 8-hydroxyquinoline or an 8-hydroxyquinoline derivative or a substituted 8-hydroxyquinoline and wherein the molar ratio ammonium bifluoride to complexor is at least 125:1 and the molar ratio of hydrogen peroxide to complexor is at least 50:1.