Abstract: The modular gamma camera (1) comprises at least one hybrid semiconductor detector (2) of transient ionizing radiation and at least one collimator (3) of transient ionizing radiation arranged in front of the hybrid semiconductor detector (2) in the direction of propagation of transient ionizing radiation. The core of the invention is based on the fact that the modular gamma camera consists of a housing (4) which has at least one opening (5) on the front side provided with a holder of an exchangeable collimator (3), and which has a rear side provided with means for connecting a heat sink (6), and its sides provided with connecting means for modular chain connection of adjacent housings (4). In housing (4) is placed at least one hybrid semiconductor detector (2) of transient radiation. The subject of the invention is the modular gamma camera assembly (1) also, in which the housings (4) in the assembly are connected in a circle.

Abstract: A module (1) for a detector (14) of ionizing radiation comprising at least two detection segments (2) for detecting ionizing radiation, attached to a row carrier (3) allowing for the assembly of detectors (14) with an unlimitedly large detection surface for continuous imaging of ionizing radiation. The construction of the module (1), including a means (10) for power supply stabilization for each detection segment (2), an interconnection of electrical conductors (8), formed by printed circuit boards (9, 13) led vertically downwards perpendicular to the detector surface along the row carrier (3), and a parallel connection to the connectors (11) of the read-out electronics, increases the reliability and speed of the operation of the detector (14). Between the individual parts of the module (1) there are formed thermal bridges to stabilize the temperature and to increase the reliability of the detector (14) assemblies from the modules (1).

Abstract: The layered pixel detector (7) of ionizing radiation includes at least two semiconductor pixel particle counting detectors. Each detector consists of a sensor (1) connected to a readout chip (2), while the readout chip (2) on a part of its perimeter has a projecting section (8) with contact pads to connect conductors (3). The detectors form at least one segment (9) in which the pixel detectors are arranged into layers on top of each other. The thickness of the readout chips (2) is up to 200 ?m and the thickness of the sensors (1) is up to 2000 ?m. The layered detector (7) includes at least one carrying thermal conductive platform (10) provided with at least one supporting structure (5) to support at least one projecting section (8) of the readout chip (2).

Abstract: Problem to be resolved: Non-destructive detection of directional and other defects in structured materials that cannot be detected by current detection and imaging methods. Problem solution: The problem has been resolved by inclining the incident beam of ionizing radiation irradiating the examined object (3), while knowing the geometry of positions of the object (3), source (2) of beams ionizing radiation and detector (8), including the size of the angle of incidence (?). Based on detection of an attenuated or dispersed beam of ionizing radiation an image is obtained of directional defects in the material with internal structure.

Abstract: A detector of ionizing radiation, e.g. x-ray radiation, allowing for the creation of a continuous digital image of a scanned object. The detection surface is formed by a mosaic of detector segments arranged in a matrix and consisted of a sensor layer arranged on a chip reader with the formation of tiers to engage an adjacent detector segment. The sensor layer is active over its entire area, and the matrix is provided with a means for positioning the detector segments to define their mutual lateral clearance less than the size of one pixel. The positioning means preferably comprises a carrier of rows. The resulting detection surface is active over its entire area and allows for the direct creation of continuous digital image without dead zones.

Abstract: A module (1) for a detector (14) of ionizing radiation comprising at least two detection segments (2) for detecting ionizing radiation, attached to a row carrier (3) allowing for the assembly of detectors (14) with an unlimitedly large detection surface for continuous imaging of ionizing radiation. The construction of the module (1), including a means (10) for power supply stabilization for each detection segment (2), an interconnection of electrical conductors (8), formed by printed circuit boards (9, 13) led vertically downwards perpendicular to the detector surface along the row carrier (3), and a parallel connection to the connectors (11) of the read-out electronics, increases the reliability and speed of the operation of the detector (14). Between the individual parts of the module (1) there are formed thermal bridges to stabilize the temperature and to increase the reliability of the detector (14) assemblies from the modules (1).

Abstract: For volumetric analysis of the elemental composition of a measured sample (3) the method of three-dimensional scanning is executing using fluorescence induced by electromagnetic radiation, in which the primary beam (1) of electromagnetic radiation is flattened and is directed at the measured sample (3) in which it irradiates the measured area (6). From the measured area (6) there exits fluorescence radiation, which is almost completely shielded by the shielding means (7) to a secondary beam (9), which is released towards the shielded detector (4) through the permeable area (8) formed in the shielding means (7). The secondary beam (9) projects the image of the measured area (6) onto the shielded detector (4), which records the data of the measured area (6) and subsequently uses the data to obtain an elemental composition of the measured sample (3), including the distribution of concentration of elements in the sample volume.

Abstract: A detector of ionizing radiation, e.g. x-ray radiation, allowing for the creation of a continuous digital image of a scanned object. The detection surface is formed by a mosaic of detector segments arranged in a matrix and consisted of a sensor layer arranged on a chip reader with the formation of tiers to engage an adjacent detector segment. The sensor layer is active over its entire area, and the matrix is provided with a means for positioning the detector segments to define their mutual lateral clearance less than the size of one pixel. The positioning means preferably comprises a carrier of rows. The resulting detection surface is active over its entire area and allows for the direct creation of continuous digital image without dead zones.

Abstract: The present invention relates to a pixel detector (10), comprising a semiconductor sensor layer (12), in which charges can be generated upon interaction with particles to be detected. The semiconductor layer defines an X-Y-plane and has a thickness extending in Z-direction. The detector further comprises a read-out electronics layer (14) connected to said semiconductor layer (12), said read-out electronics layer (14) comprising an array of read-out circuits (20) for detecting signals indicative of charges generated in a corresponding volume of said semiconductor sensor layer (12). The neighboring read-out circuits (20) are connected by a relative timing circuit configured to determine time difference information between signals detected at said neighboring read-out circuits (20).

Abstract: A hybrid pixel detector structure including a plurality of detector entities, each detector entity including at least one read-out element, such as a read-out ASIC, and an overlapping substantially edgeless radiation sensitive detector volume, these two being electrically coupled utilizing a number of conductive elements in between, further including a substrate, such as a circuit board, or multiple substrates such as one per detector entity, for accommodating the plurality of detector entities, wherein the substantially edgeless detector volume of at least one detector entity of the plurality includes an overhang portion outside the overlap between the detector volume and the read-out element, and the read-out element of at least one other detector entity of the plurality includes an extension portion, also outside the overlap, with a number of electrical coupling elements to electrically couple to the substrate, such as conductors and/or electronics thereof.

Abstract: The present invention relates to a pixel detector (10), comprising a semiconductor sensor layer (12), in which charges can be generated upon interaction with particles to be detected. The semiconductor layer defines an X-Y-plane and has a thickness extending in Z-direction. The detector further comprises a read-out electronics layer (14) connected to said semiconductor layer (12), said read-out electronics layer (14) comprising an array of read-out circuits (20) for detecting signals indicative of charges generated in a corresponding volume of said semiconductor sensor layer (12). The neighbouring read-out circuits (20) are connected by a relative timing circuit configured to determine time difference information between signals detected at said neighbouring read-out circuits (20).

Abstract: A hybrid pixel detector structure including a plurality of detector entities, each detector entity including at least one read-out element, such as a read-out ASIC, and an overlapping substantially edgeless radiation sensitive detector volume, these two being electrically coupled utilizing a number of conductive elements in between, further including a substrate, such as a circuit board, or multiple substrates such as one per detector entity, for accommodating the plurality of detector entities, wherein the substantially edgeless detector volume of at least one detector entity of the plurality includes an overhang portion outside the overlap between the detector volume and the read-out element, and the read-out element of at least one other detector entity of the plurality includes an extension portion, also outside the overlap, with a number of electrical coupling elements to electrically couple to the substrate, such as conductors and/or electronics thereof.

Abstract: A probe (14; 14?), comprising an ultrasonic probe (56a,56b; 74a,74b) and a pixellated radiation detector (16) with discrete detecting elements (50a,50b,50c) for detecting a predefined radiation. The probe (14) is adapted to be located at least partially within a body cavity. Also, an imaging method, comprising employing such a probe (14) to form an image while located within a body cavity, and a dosimetry method, comprising employing such a probe (14) to conduct dosimetry while located within a body cavity.