Abstract: Numerous examples of a multi-axis beam positioner operative to deflect a beam path along which laser light along multiple axes are disclosed. The beam positioner includes a first AOD and a second AOD arranged optically in series with each other. The first and second AODs are arranged and configured to deflect the beam path along a different axes of the multi-axis beam positioner. In one example, AO cell of the first AOD and is formed from the same material as the AO cell of the second AOD but the first AOD is configured differently from the second AOD. In other example, the first AOD and the second AOD are longitudinal-mode AODs and no retarder is present between the first and second AODs. In other example, a heat exchanger is provided to cool the AO cell of the second AOD relative to the AO cell of the first AOD.

Abstract: A method for forming a through-via in a substrate having opposing first and second surfaces can include directing a focused beam of laser pulses through the first surface and through the second surface of the substrate. The focused beam of laser pulses can have a wavelength to which the substrate is at least partially transparent, and an optical intensity less than an optical breakdown intensity of the substrate. The focused beam of laser pulses may have a pulse repetition rate, a peak optical intensity and an average power at the substrate driving a cumulative heating effect to melt a region of the substrate. The pulses may have a pulse width, and wherein the peak optical intensity, pulse repetition rate, average power and pulse width are selected such that the through-via is formed in less than 120 ?s.

Abstract: A method for forming a through-via in a substrate having opposing first and second surfaces can include directing a focused beam of laser pulses into the substrate through the first surface of the substrate and, subsequently, through the second surface of the substrate. The focused beam of laser pulses can have a wavelength to which the substrate is at least substantially transparent and a beam waist of the focused beam of laser pulses is closer to the second surface than to the first surface. The focused beam of laser pulses is characterized by a pulse repetition rate, a peak optical intensity at the substrate and an average power at the substrate sufficient to: melt a region of the substrate near the second surface, thereby creating a melt zone within the substrate; propagate the melt zone toward the first surface; and vaporize or boil material of the substrate and located within the melt zone.

Abstract: A laser-processing apparatus can carry out a process to form a via in a workpiece, having a first material formed on a second material, by directing laser energy onto the workpiece such that the laser energy is incident upon the first material, wherein the laser energy has a wavelength to which the first material is more reflective than the second material. The apparatus can include a back-reflection sensing system operative to capture a back-reflection signal corresponding to a portion of laser energy directed to the workpiece and reflected by the first material and generate a sensor signal based on the captured back-reflection signal; and a controller communicatively coupled to an output of the back-reflection sensing system, wherein the controller is operative to control a remainder of the process by which the via is formed based on the sensor signal.

Abstract: Numerous embodiments of optical relay systems are disclosed. In one embodiment, a laser-processing apparatus includes an optical relay system configured to correct for beam placement errors by maintaining the optical path length of a beam of laser energy between a first positioner and a scan lens. In another embodiment, the optical relay system may include a first lens, a second lens, and a zoom lens assembly arranged between the first lens and the second lens, wherein the zoom lens assembly includes a first lens group and a second lens group. The zoom lens assembly may be movable relative to the first lens and the second lens (e.g., mounted on a positioner, such as a motion stage). The distance between the lenses of the first lens group and the distance between the lenses of the second lens group may be fixed or variable.

Abstract: A beam positioner for deflecting a beam path, along which a diffracted beam of linearly polarized laser light is propagatable, within a two-dimensional scan field, the beam positioner includes a first acousto-optic deflectors (AOD) to deflect the beam path within a first one-dimensional scan field extending along a first axis of the two-dimensional scan field, a second AOD to deflect the beam path within a second one-dimensional scan field extending along a second axis of the two-dimensional scan field, a phase retarder arranged between the first AOD and the second AOD and within the beam path along which the beam of laser light is propagatable from the first AOD and a mirror arranged between the first AOD and the second AOD and within the beam path along which the beam of laser light is propagatable from the first AOD.

Abstract: A beam positioner can be broadly characterized as including a first acousto-optic (AO) deflector (AOD) operative to diffract an incident beam of linearly polarized laser light, wherein the first AOD has a first diffraction axis and wherein the first AOD is oriented such that the first diffraction axis has a predetermined spatial relationship with the plane of polarization of the linearly polarized laser light. The beam positioner can include at least one phase-shifting reflector arranged within a beam path along which light is propagatable from the first AOD. The at least one phase-shifting reflector can be configured and oriented to rotate the plane of polarization of light diffracted by the first AOD.

Abstract: A workpiece (100) having substrate, such as a glass substrate, can be etched by a laser or by other means to create recessed features (200, 202). A laser-induced forward transfer (LIFT) process or metal oxide printing process can be employed to impart a seed material (402), such as a metal, onto the glass substrate, especially into the recessed features (200, 202). The seeded recessed features can be plated, if desired, by conventional techniques, such as electroless plating, to provide conductive features (500) with predictable and better electrical properties. The workpieces (100) can be connected in a stacked such that subsequently stacked workpieces (100) can be modified in place.

Abstract: Numerous embodiments are disclosed. Many of which relate to methods of forming vias in workpieces such as printed circuit boards. Some embodiments relates techniques for indirectly ablating a region of an electrical conductor structure of, for example, a printed circuit board by spatially distributing laser energy throughout the region before the electrical conductor is indirectly ablated. Other embodiments relate to techniques for temporally-dividing laser pulses, modulating the optical power within laser pulses, and the like.

Abstract: Numerous embodiments are disclosed. In one, a laser-processing apparatus includes a positioner arranged within a beam path along which a beam of laser energy is propagatable. A controller may be used to control an operation of the positioner to deflect the beam path within first and second primary angular ranges, and to deflect the beam path to a plurality of angles within each of the first and second primary angular ranges. In another, an integrated beam dump system includes a frame; and a pickoff mirror and beam dump coupled to the frame. In still another, a wavefront correction optic includes a mirror having a reflective surface having a shape characterized by a particular ratio of fringe Zernike terms Z4 and Z9. Many more embodiments are disclosed.

Abstract: A system includes a multi-channel beam splitter arranged and configured to split an input optical signal into a plurality of split optical signals; a plurality of phase modulators, wherein each phase modulator of the plurality of phase modulators is operative to modify a phase of a corresponding split optical signal of the plurality of split optical signals in response to a control signal; a waveguide arranged at an optical output of the plurality of phase modulators, the waveguide configured to spatially-rearrange the split optical signals output from the plurality of phase modulators into a pattern, thereby producing an optical signal pattern; and an optical amplifier arranged at an optical output of the waveguide, wherein the optical amplifier is configured to amplify the optical signal pattern produced by the waveguide.

Abstract: One embodiment of the present invention can be characterized as a method for controlling a multi-axis machine tool that includes obtaining a preliminary rotary actuator command (wherein the rotary actuator command has frequency content exceeding a bandwidth of a rotary actuator), generating a processed rotary actuator command based, at least in part, on the preliminary rotary actuator command, the processed rotary actuator command having frequency content within a bandwidth of the rotary actuator and generating a first linear actuator command and a second linear actuator command based, at least in part, on the processed rotary actuator command. The processed rotary actuator command can be output to the rotary actuator, the first linear actuator command can be output to a first linear actuator and the second linear actuator command can be output to a second linear actuator.

Abstract: Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to use of beam characterization tools to facilitate adaptive processing, process control and other desirable features. Other embodiments relate to laser power sensors incorporating integrating spheres. Still other embodiments relate to workpiece handling systems capable of simultaneously providing different workpieces to a common laser-processing apparatus. A great number of other embodiments and arrangements are also detailed.

Abstract: Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to processing of workpieces in a manner resulting in enhanced accuracy, throughput, etc. Other embodiments relate to realtime Z-height measurement and, when suitable, compensation for certain Z-height deviations. Still other embodiments relate to modulation of scan patterns, beam characteristics, etc., to facilitate feature formation, avoid undesirable heat accumulation, or otherwise enhance processing throughput. A great number of other embodiments and arrangements are also detailed.

Abstract: A laser beam positioning system of a laser-based specimen processing system produces at beam positioner stage, from a fully fiber-coupled optics phased array laser beam steering system, a steered laser input beam. System directs beam through one or more other beam positioner stages to form a processing laser beam that processes target features of a workpiece mounted on a support.

Abstract: A method for forming a through-via in a substrate having opposing first and second surfaces can include directing a focused beam of laser pulses into the substrate through the first surface of the substrate and, subsequently, through the second surface of the substrate. The focused beam of laser pulses can have a wavelength to which the substrate is at least substantially transparent and a beam waist of the focused beam of laser pulses is closer to the second surface than to the first surface. The focused beam of laser pulses is characterized by a pulse repetition rate, a peak optical intensity at the substrate and an average power at the substrate sufficient to: melt a region of the substrate near the second surface, thereby creating a melt zone within the substrate; propagate the melt zone toward the first surface; and vaporize or boil material of the substrate and located within the melt zone.

Abstract: Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to processing of workpieces in a manner resulting in enhanced accuracy, throughput, etc. Other embodiments relate to realtime Z-height measurement and, when suitable, compensation for certain Z-height deviations. Still other embodiments relate to modulation of scan patterns, beam characteristics, etc., to facilitate feature formation, avoid undesirable heat accumulation, or otherwise enhance processing throughput. A great number of other embodiments and arrangements are also detailed.

Abstract: A beam positioner can be broadly characterized as including a first acousto-optic (AO) deflector (AOD) operative to diffract an incident beam of linearly polarized laser light, wherein the first AOD has a first diffraction axis and wherein the first AOD is oriented such that the first diffraction axis has a predetermined spatial relationship with the plane of polarization of the linearly polarized laser light. The beam positioner can include at least one phase-shifting reflector arranged within a beam path along which light is propagatable from the first AOD. The at least one phase-shifting reflector can be configured and oriented to rotate the plane of polarization of light diffracted by the first AOD.

Abstract: A laser beam positioning system of a laser-based specimen processing system produces at beam positioner stage, from a fully fiber-coupled optics phased array laser beam steering system, a steered laser input beam. System directs beam through one or more other beam positioner stages to form a processing laser beam that processes target features of a workpiece mounted on a support.

Abstract: A workpiece (100) having substrate, such as a glass substrate, can be etched by a laser or by other means to create recessed features (200, 202). A laser-induced forward transfer (LIFT) process or metal oxide printing process can be employed to impart a seed material (402), such as a metal, onto the glass substrate, especially into the recessed features (200, 202). The seeded recessed features can be plated, if desired, by conventional techniques, such as electroless plating, to provide conductive features (500) with predictable and better electrical properties. The workpieces (100) can be connected in a stacked such that subsequently stacked workpieces (100) can be modified in place.