Abstract: A LED package (10) for use in a lamp as well as a method for manufacturing such kind of a LED package (10) are disclosed, wherein the LED package (10) comprises at least one LED (16), an optical element (18) for guiding light emitted by the LED (16), and a cover (26) for covering, at least partially, electrical components (20, 22, 24) connectable to the LED (16). The cover (26) includes three protrusions (38) that form the highest points on the package. The protrusions (38) abut a surface in a housing for accurately positioning the LED package relative to a lens (52) in the housing. The LED package (10) may be spring-loaded. Side protrusions (28) of the cover (26) additionally help to position the package within the housing.

Abstract: A LED package (10) for use in a lamp as well as a method for manufacturing such kind of a LED package (10) are disclosed, wherein the LED package (10) comprises at least one LED (16), an optical element (18) for guiding light emitted by the LED (16), and a cover (26) for covering, at least partially, electrical components (20, 22, 24) connectable to the LED (16). The cover (26) includes three protrusions (38) that form the highest points on the package. The protrusions (38) abut a reference surface in a housing when the package is resiliently pushed against the reference surface for accurately positioning the LED package relative to a lens in the housing. Side protrusions (28) of the cover (26) additionally help to position the package within the housing.

Abstract: A LED package (10) for use in a lamp as well as a method for manufacturing such kind of a LED package (10) are provided, wherein the LED package (10) comprises at least one LED (16), an optical element (18) for guiding light emitted by the LED (16), a cover (26) for covering at least partially electrical components (20, 22, 24) connectable to the LED (16) and at least one optical detectable reference mark (32; 36), wherein the optical element (18) comprises at least one first optical detectable mark (30) and the cover (26) comprises at least one second optical detectable mark (34), whereby the optical element (18) and the cover (26) are arranged and aligned both with respect to the same reference mark (32; 36) by means of the first mark (30) and the second mark (34). Due to the same reference (32; 36) for both the optical element (18) and the cover (26) manufacturing tolerances are not added to each other so that the accuracy of a correct arrangement is increased.

Abstract: An improved method of etching a structure and a structure etched by the method is disclosed. The bottom side of a leadframe of an IC-package is an example of a structure, which advantageously may be etched with the disclosed method. The method includes the steps of providing an etch mask to the substrate to be etched. The etch mask comprising at least two sub-mask: a first sub-mask covering the area which substantially should remain after the etching process, and a second sub-mask covering an area to be removed in the etching process. The second sub-mask is a sacrificial mask in the form of a grid. The presence of the second sub-mask increases the etching speed in the area covered by it.

Abstract: A LED package (10) for use in a lamp as well as a method for manufacturing such kind of a LED package (10) are provided, wherein the LED package (10) comprises at least one LED (16), an optical element (18) for guiding light emitted by the LED (16), a cover (26) for covering at least partially electrical components (20, 22, 24) connectable to the LED (16) and at least one optical detectable reference mark (32; 36), wherein the optical element (18) comprises at least one first optical detectable mark (30) and the cover (26) comprises at least one second optical detectable mark (34), whereby the optical element (18) and the cover (26) are arranged and aligned both with respect to the same reference mark (32; 36) by means of the first mark (30) and the second mark (34). Due to the same reference (32; 36) for both the optical element (18) and the cover (26) manufacturing tolerances are not added to each other so that the accuracy of a correct arrangement is increased.

Abstract: An improved method of etching a structure and a structure etched by the method is disclosed. The bottom side of a leadframe of an IC-package is an example of a structure, which advantageously may be etched with the disclosed method. The method includes the steps of providing an etch mask to the substrate to be etched. The etch mask comprising at least two sub-mask: a first sub-mask covering the area which substantially should remain after the etching process, and a second sub-mask covering an area to be removed in the etching process. The second sub-mask is a sacrificial mask in the form of a grid. The presence of the second sub-mask increases the etching speed in the area covered by it.