Abstract: A lighting unit includes a board, which supports a lamp and an electronic circuit for activating the lamp. The lamp includes one or more LEDs. The lighting unit further includes a decorative layer, which is applied directly to a surface of the board.

Abstract: The invention relates to a method for producing a coil integrated in a substrate or applied to a substrate, wherein the coil has first winding portions, which each have first ends and second ends, and wherein the coil has second winding portions and third winding portions, wherein each two of the first ends are electrically interconnected by the second winding portions and two corresponding second ends of the first winding portions are electrically interconnected by the third winding portions, such that coil windings of the coil are formed hereby, wherein at least the first winding portions are applied by means of a 3D printing method, wherein this is aerosol jet or inkjet printing, for example.

Abstract: The subject matter of the invention relates to a method of producing a coil integrated in a substrate, using the following steps: creating the cavity in a substrate, said cavity having an open end which interrupts a surface of the substrate, introducing a paste containing ferromagnetic particles into the cavity so as to produce a coil core, closing the cavity by applying a cover layer so as to bridge the interruption in the surface of the substrate, introducing first winding portions of the coil which are vertical with respect to the surface, with a plurality or all of the first winding portions passing through the coil core contained inside the cavity, and applying second winding portions of the coil onto the surfaces of the substrate, with the second winding portions contacting the first winding portions so as to create the windings of the coil.

Abstract: The invention relates to a method for producing an optical module, comprising the following steps: a) providing a chip having an optical element integrated in the chip, wherein the optical element bas a first electrode and a second electrode, and wherein the chip has a first connection contact for the first electrode and a second connection contact for the second electrode, such that an operating voltage for the optical element can be applied between the first connection contact and the second connection contact, and wherein the chip has an optically active side, which is designed to emit and/or to receive radiation; b) connecting the chip to a film, such that the film completely covers the optically active side of the chip, wherein the film is a film made from acrylate, polyarylate, or polyurethane, wherein the film, at least in the region located above the optically active side, is transparent to radiation which.

Abstract: The invention relates to a method for producing an optical module, comprising the following steps: a) providing a chip having an optical element integrated in the chip, wherein the optical element bas a first electrode and a second electrode, and wherein the chip has a first connection contact for the first electrode and a second connection contact for the second electrode, such that an operating voltage for the optical element can be applied between the first connection contact and the second connection contact, and wherein the chip has an optically active side, which is designed to emit and/or to receive radiation; b) connecting the chip to a film, such that the film completely covers the optically active side of the chip, wherein the film is a film made from acrylate, polyarylate, or polyurethane, wherein the film, at least in the region located above the optically active side, is transparent to radiation which.

Abstract: The subject matter of the invention relates to a method of producing a coil integrated in a substrate, using the following steps: creating the cavity in a substrate, said cavity having an open end which interrupts a surface of the substrate, introducing a paste containing ferromagnetic particles into the cavity so as to produce a coil core, closing the cavity by applying a cover layer so as to bridge the interruption in the surface of the substrate, introducing first winding portions of the coil which are vertical with respect to the surface, with a plurality or all of the first winding portions passing through the coil core contained inside the cavity, and applying second winding portions of the coil onto the surfaces of the substrate, with the second winding portions contacting the first winding portions so as to create the windings of the coil.

Abstract: The invention relates to a method for producing a coil integrated in a substrate or applied to a substrate, wherein the coil has first winding portions, which each have first ends and second ends, and wherein the coil has second winding portions and third winding portions, wherein each two of the first ends are electrically interconnected by the second winding portions and two corresponding second ends of the first winding portions are electrically interconnected by the third winding portions, such that coil windings of the coil are formed hereby, wherein at least the first winding portions are applied by means of a 3D printing method, wherein this is aerosol jet or inkjet printing, for example.

Abstract: The invention relates to a method for producing a coil (140) integrated in a substrate (100) or applied to a substrate, wherein the coil has first winding portions (136), which each have first ends (141) and second ends (147), and wherein the coil has second winding portions (138) and third winding portions (139), wherein each two of the first ends are electrically interconnected by the second winding portions and two corresponding second ends of the first winding portions are electrically interconnected by the third winding portions, such that coil windings of the coil are formed hereby, wherein at least the first winding portions are applied by means of a 3D printing method, wherein this is aerosol jet or inkjet printing, for example.

Abstract: The invention concerns a method for production of electronic assembly (1) with 1.1 Supply of an electrically-conducting film (3), especially a support film (3a), 1.2 Supply of at least one electrical component (5) with at least one electrical contact site (5c), 1.3 Application of an adhesive (20) between the electrical component and a surface (30) of the electrically-conducting film, 1.4 Arrangement of the at least one component (5) with the at least one electrical contact site (5c) on the surface (30) of the electrically-conducting film (3) and fastening of the at least one component by formation of an adhesive joint between the electrical component and the surface, 1.5 Supply of the support (9), especially from a flexible material, 1.

Abstract: The invention relates to a method for producing a coil (140) integrated in a substrate (100) or applied to a substrate, wherein the coil has first winding portions (136), which each have first ends (141) and second ends (147), and wherein the coil has second winding portions (138) and third winding portions (139), wherein each two of the first ends are electrically interconnected by the second winding portions and two corresponding second ends of the first winding portions are electrically interconnected by the third winding portions, such that coil windings of the coil are formed hereby, wherein at least the first winding portions are applied by means of a 3D printing method, wherein this is aerosol jet or inkjet printing, for example.

Abstract: A lighting unit includes a board, which supports a lamp and an electronic circuit for activating the lamp. The lamp includes one or more LEDs. The lighting unit further includes a decorative layer, which is applied directly to a surface of the board.

Abstract: In a method for producing an electronic subassembly, at least one electronic component is fixed in place on an insulating layer of a conductive foil in a first step, the conductive foil with the electronic component is laminated onto a circuit board substrate, and a circuit track structure is then developed by structuring the conductive foil. The expansion coefficient of the insulating layer lies between the expansion coefficient of the circuit board substrate and the expansion coefficient of the circuit track structure, and/or electronic components that require small passages for contacting with the circuit track structure are pressed deeper into the insulating layer than electronic components that require larger passages in the insulating layer.

Abstract: In a method for producing an electronic subassembly, at least one electronic component is fixed in place on an insulating layer of a conductive foil in a first step, the conductive foil with the electronic component is laminated onto a circuit board substrate, and a circuit track structure is then developed by structuring the conductive foil. The expansion coefficient of the insulating layer lies between the expansion coefficient of the circuit board substrate and the expansion coefficient of the circuit track structure, and/or electronic components that require small passages for contacting with the circuit track structure are pressed deeper into the insulating layer than electronic components that require larger passages in the insulating layer.