Abstract: The invention relates to a method for the direct synthesis of methylchlorosilanes by reacting chloromethane with a contact mass containing silicon, copper catalyst and at least 120 ppm by weight of manganese.

Abstract: A method is proposed for producing a biaxially textured metal substrate having a metal surface, wherein the substrate is modified in order to produce a high-temperature superconductor coating arrangement and wherein the metal surface is modified in order to deposit a buffer layer or another intermediate layer epitaxially thereon and/or to deposit an oriented high-temperature superconductor (HTS) layer thereon. The method includes producing a biaxially textured metal substrate, subjecting the metal substrate surface to a polishing treatment, in particular an electropolishing treatment, and subjecting the metal substrate to a post-annealing after the surface polishing treatment and before a subsequent coating is performed involving epitaxial deposition of a layer of the HTS coating arrangement. This method results in smooth metal substrates with high textural overcoats and thereby improved HTS layers.

Abstract: The invention relates to a method for producing oligohalogen silanes, selected from oligohalogen silanes of the general formulas (1) and (2): SixX2n+2 (1), SimX2m (2), wherein a mixture comprising silicon and metal halogenide selected from Ti, Zr, Hf, V, Nb, Mo, W, Fe, Co, Ni, Gu, Cd, In, Sn, P, Sb, Bi, S, Se, Te and Pb and mixtures thereof is converted at a temperature of ?125° C. to 1100° C. and the oligohalogen silanes formed are removed by means of a carrier gas selected from N2, noble gases, CH3Cl, HCl, CO2, CO, H2, and SiCl4, where X is selected from Cl, Br and J, n is a whole number from 2 to 10, and m is a whole number from 3 to 10.

Abstract: A method is proposed for producing a biaxially textured metal substrate having a metal surface, wherein the substrate is modified in order to produce a high-temperature superconductor coating arrangement and wherein the metal surface is modified in order to deposit a buffer layer or another intermediate layer epitaxially thereon and/or to deposit an oriented high-temperature superconductor (HTS) layer thereon. The method includes producing a biaxially textured metal substrate, subjecting the metal substrate surface to a polishing treatment, in particular an electropolishing treatment, and subjecting the metal substrate to a post-annealing after the surface polishing treatment and before a subsequent coating is performed involving epitaxial deposition of a layer of the HTS coating arrangement. This method results in smooth metal substrates with high textural overcoats and thereby improved HTS layers.