Abstract: Components are fastened with inserts that are placed into a hole in the component and bonded with an adhesive. A decoupling element is provided on the front face of the insert. This diverts the forces around the highly stressed front face of the inserts. The insert may be of a material with a lower stiffness compared with the adhesive. This arrangement may reduce stress peaks and increase the load capacity of the connection. A tool may be provided that reduces air inclusion between the insert and the component during fitting. The connection arrangement can be used when components of different stiffnesses have to be securely connected to one another. This applies to, among other things, fastening of fibre composite components or mineral components to metal components.

Abstract: A method for setting up a virtual ad hoc network for transmitting at least one piece of information to a first transportation vehicle as a first network subscriber. The method includes the information being provided based on first data from at least one second network subscriber, and at least one second network subscriber being a second transportation vehicle or an infrastructure component; wherein a motor-vehicle-external, central data processing device receives second data from multiple potential second network subscribers and takes the second data and at least one space-time parameter as a basis for determining the second network subscribers and setting up the virtual ad hoc network with the first transportation vehicle, as the first network subscriber, and the determined second network subscribers, the space-time parameter defining a specific area of relevance that has a predetermined physical and temporal correlation with the current position of the first transportation vehicle.

Abstract: Components are fastened with inserts that are placed into a hole in the component and bonded with an adhesive. A decoupling element is provided on the front face of the insert. This diverts the forces around the highly stressed front face of the inserts. The insert may be of a material with a lower stiffness compared with the adhesive. This arrangement may reduce stress peaks and increase the load capacity of the connection. A tool may be provided that reduces air inclusion between the insert and the component during fitting. The connection arrangement can be used when components of different stiffnesses have to be securely connected to one another. This applies to, among other things, fastening of fibre composite components or mineral components to metal components.

Abstract: A semiconductor component has interface functions between the controller and the power components of power converters, suitable for gating semiconductor switches. In particular, the semiconductor component serves to gate IGBT and MOSFET power switches in low and medium performance three-phase bridge circuits and integrates signal processing (12), level conversion (16) and amplification (gate driver) (17), error recognition, such as short-circuit monitoring by means of VCE detection (19) and operating voltage monitoring (21) as well as error processing (15) for several power semiconductor switches. The advantages of this gating IC in comparison with hybrid or discrete solutions consist of the high integration density of various digital, analogue and driver functions which result in a reduction in the number of discrete components, which means a lower failure rate of the system and lower costs. Another important consideration is the improvement of switching characteristics thanks to monolithic integration.

Abstract: A semiconductor component performing interface functions between the controller and the power components of a power inverter, is designed for the control of semiconductor components, in particular for the control of IGBT (Insulated Gate Bipolar Transistor) and MOSFET (Metal Oxide Semiconductor Field Effect Transistor) power switches in different circuit topologies for intermediate and high power capacity. The component carries a monolithically integrated circuit performing the functions of signal processing (12), level transformation (13, 14), gate driver amplification, generation and monitoring of operating voltages, short-circuit monitoring by means of collector-emitter voltage detection, as well as the processing, storing and transmission of error signals for a power semiconductor switch.

Abstract: A semiconductor component performing interface functions between the controller and the power components of a power inverter, is designed for the control of semiconductor components, in particular for the control of IGBT (Insulated Gate Bipolar Transistor) and MOSFET (Metal Oxide Semiconductor Field Effect Transistor) power switches in different circuit topologies for intermediate and high power capacity. The component carries a monolithically integrated circuit performing the functions of signal processing (12), level transformation (13, 14), gate driver amplification, generation and monitoring of operating voltages, short-circuit monitoring by means of collector-emitter voltage detection, as well as the processing, storing and transmission of error signals for a power semiconductor switch.

Abstract: A semiconductor component has interface functions between the controller and the power components of power converters, suitable for gating semiconductor switches. In particular, the semiconductor component serves to gate IGBT and MOSFET power switches in low and medium performance three-phase bridge circuits and integrates signal processing (12), level conversion (16) and amplification (gate driver) (17), error recognition, such as short-circuit monitoring by means of VCE detection (19) and operating voltage monitoring (21) as well as error processing (15) for several power semiconductor switches. The advantages of this gating IC in comparison with hybrid or discrete solutions consist of the high integration density of various digital, analogue and driver functions which result in a reduction in the number of discrete components, which means a lower failure rate of the system and lower costs. Another important consideration is the improvement of switching characteristics thanks to monolithic integration.