Patents by Inventor Jan-Martin Loth

Jan-Martin Loth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10874256
    Abstract: The present invention relates to a cooking pot for a food processor with a heating element, wherein the heating element includes a heating device for generating heat and a heat exchanger with a heat-absorbing side at which the heat exchanger is heatable by the heating device and a heat emission side for heating of foodstuff in the food processor. The heat exchanger includes an opening for a stirrer and a first functional layer at the heat emission side. The heat exchanger includes at least partially a metallic heat conducting layer, which is arranged with the first functional layer such that the heat generated by the heating device is transferable extensively from the heat conducting layer to the first functional layer.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: December 29, 2020
    Assignee: Vorwerk & Co. Interholding GmbH
    Inventors: Stefan Kraut-Reinkober, Sebastian Tietz, Jan-Martin Loth
  • Publication number: 20180177340
    Abstract: The present invention relates to a cooking pot (3) for a food processor (2) with a heating element (1), wherein the heating element (1) comprises a heating means (10) for generating heat and a heat exchanger (20) with a heat-absorbing side (20.1) at which the heat exchanger (20) is heatable by the heating means (10) and a heat emission side (20.2) for heating of foodstuff in the food processor (2), wherein the heat exchanger (20) comprises an opening (27) for a stirrer (50) and a first functional layer (21) at the heat emission side (20.2) characterized in that the heat exchanger (20) comprises at least partially a metallic heat conducting layer (23), which is arranged with the first functional layer (21) such that the heat generated by the heating means (10) is transferable extensively from the heat conducting layer (23) to the first functional layer (21).
    Type: Application
    Filed: December 22, 2017
    Publication date: June 28, 2018
    Inventors: Stefan Kraut-Reinkober, Sebastian Tietz, Jan-Martin Loth