Patents by Inventor Jan Martin Stumpf

Jan Martin Stumpf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240047703
    Abstract: A layer, in particular for forming an electrically conductive plate for an electrochemical cell, wherein the layer contains a first chemical element from the group of precious metals in the form of ruthenium in a concentration in the range of 50 to 99 at. % and at least a second chemical element in the form of silicon in a concentration of <10 at. %. Furthermore, a layer system, an electrically conductive plate and an electrochemical cell are provided.
    Type: Application
    Filed: November 26, 2021
    Publication date: February 8, 2024
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventors: Romina BAECHSTAEDT, Moritz WEGENER, Jan Martin STUMPF, Edgar SCHULZ, Ricardo Henrique BRUGNARA, Joachim WEBER
  • Publication number: 20240003022
    Abstract: A component for an electrochemical cell, wherein the component is present in the form of an electrode for a redox-flow cell or in the form of a bipolar plate for a fuel cell or an electrolyzer or in the form of a fluid diffusion layer for an electrolyzer, including a substrate which is formed from a material in the form of a metal sheet and/or an expanded metal grille, wherein the material is formed from a tin-nickel alloy or a tin-silver alloy or a tin-zinc alloy or a tin-bismuth alloy or a tin-antimony alloy. A redox-flow cell, a fuel cell and an electrolyzer are also provided.
    Type: Application
    Filed: October 11, 2021
    Publication date: January 4, 2024
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventors: Ladislaus DOBRENIZKI, Mehmet OETE, Bertram HAAG, Jan-Peter Viktor SCHINZEL, Jeevanthi VIVEKANANTHAN, Jan Martin STUMPF
  • Publication number: 20230223559
    Abstract: A layer system for coating a metal substrate in order to form a flow field plate includes at least one cover layer made of metal oxide; at least one intermediate layer, which supports the cover layer; and a lower layer, which supports the intermediate layer(s). The cover layer is formed of indium tin oxide; wherein the indium tin oxide is optionally doped with at least one element from the group comprising carbon, nitrogen, boron, fluorine, hydrogen, silicon, titanium, tin and zirconium. At least one intermediate layer is formed of titanium nitride and/or titanium carbide and/or titanium carbonitride and/or titanium niobium nitride and/or titanium niobium carbide and/or titanium niobium carbonitride and/or chromium nitride and/or chromium carbide and/or chromium carbonitride. The lower layer is formed of titanium or a titanium-niobium alloy or chromium.
    Type: Application
    Filed: April 16, 2021
    Publication date: July 13, 2023
    Applicant: Schaeffler Technologies AG & Co. KG
    Inventors: Moritz Wegener, Nazlim Bagcivan, Edgar Schulz, Ladislaus Dobrenizki, Jan Martin Stumpf, Romina Baechstaedt, Jeevanthi Vivekananthan