Abstract: A method for machining a plate-shaped component, in particular an electrostatic holding device or an immersion wafer table, with a surface formed by end faces of protruding burls, including: mutual alignment of the component on a component carrier device and of a mechanical polishing tool on a tool carrier device, wherein the polishing tool and the component are arranged for relative movement to remove material from end face(s) of at least one burl. The polishing tool includes shape-stable, deformable binding agent and polishing particles therein. Pressure force between the polishing tool and the at least one burl is measured by a force sensor device. The tool carrier device and/or the component carrier device are set to a predefined working value of the pressure force such that material is removed from the end face during removal movement. Also disclosed are a plate-shaped component produced with the method, and a polishing device.