Abstract: Copolymers for use in a digital manufacturing process, in particular support materials for use in a digital manufacturing process comprising such copolymers. More particularly, the invention is directed to a copolymer, a support material based on the the copolymer, the use of the copolymer in a digital manufacturing process, a method for preparing the copolymer and a method for building a 3D-model by using a support material comprising the copolymer.

Abstract: Copolymers for use in a digital manufacturing process, in particular support materials for use in a digital manufacturing process comprising such copolymers. More particularly, the invention is directed to a copolymer, a support material based on the the copolymer, the use of the copolymer in a digital manufacturing process, a method for preparing the copolymer and a method for building a 3D-model by using a support material comprising the copolymer.

Abstract: A photocurable resin composition for support regions for use in photochemical fabrication by an inkjet method, which has low viscosity and outstanding photocurability, and where the support regions, formed by the photocuring, have good supporting performance and, following the end of the photochemical fabrication, can readily be removed from the main body by dissolving in water and/or by a weak external force such as a water jet. The photocurable resin composition for support regions for use in photochemical 3D fabrication by the inkjet method contains, based on the total mass of photocurable resin composition, from 2 to 20 mass % of N-hydroxyalkyl (meth) acrylamide, from 2 to 20 mass % of (meth) acryloyl morpholine, from 3 to 30 mass % of (meth) acrylate compound having at least one (meth) acryloyloxy group, from 40 to 90 mass % of polyhydroxy compound containing two or more hydroxyl groups, and from 0.1 to 5 mass % of a photo-radical polymerization initiator.

Abstract: A photocurable resin composition for support regions for use in photochemical fabrication by an inkjet method, which has low viscosity and outstanding photocurability, and where the support regions, formed by the photocuring, have good supporting performance and, following the end of the photochemical fabrication, can readily be removed from the main body by dissolving in water and/or by a weak external force such as a water jet. The photocurable resin composition for support regions for use in photochemical 3D fabrication by the inkjet method contains, based on the total mass of photocurable resin composition, from 2 to 20 mass % of N-hydroxyalkyl (meth) acrylamide, from 2 to 20 mass % of (meth) acryloyl morpholine, from 3 to 30 mass % of (meth) acrylate compound having at least one (meth) acryloyloxy group, from 40 to 90 mass % of polyhydroxy compound containing two or more hydroxyl groups, and from 0.1 to 5 mass % of a photo-radical polymerization initiator.