Abstract: Low-cost, robust, and high performance microelectromechanical systems (MEMS) acoustic sensors are described. Described MEMS acoustic sensors can comprise a set of etch release structures in the acoustic sensor membrane that facilitates rapid and/or uniform etch release of the acoustic sensor membrane. In addition, MEMS acoustic sensors can comprise a set of membrane position control structures of the acoustic sensor membrane that can reduce the bending stress of the acoustic sensor membrane. MEMS acoustic sensors can further comprise a three layer acoustic sensor membrane that provides increased robustness. Further design flexibility and improvements are described that provide increased robustness and/or cost savings, and a low cost fabrication process for MEMS acoustic sensors is provided.

Abstract: A container includes a container body and a lid, which has an outer lid wall portion surrounding a central portion. The outer lid wall portion provides a lid-side sealing surface, which engage with body-side sealing surface, when the lid is applied to the container body to close the container. The container further includes a securing ring inserted within the outer lid wall portion. The securing ring having a lower portion and an upper flange portion extending from the lower portion at an acute angle (?) of less than 80° from vertical.

Abstract: A container includes a container body and a lid, which has an outer lid wall portion surrounding a central portion. The outer lid wall portion provides a lid-side sealing surface, which engage with body-side sealing surface, when the lid is applied to the container body to close the container. The container further includes a securing ring inserted within the outer lid wall portion. The securing ring having a lower portion and an upper flange portion extending from the lower portion at an acute angle (?) of less than 80° from vertical.