Abstract: Power amplifier (PA) packages having air cavities enclosed by electrically-routed lids, as well as to method for fabricating such power amplifier packages, are disclosed. In embodiments, the PA package includes a package body having a package topside surface and a package bottomside surface. The package body is defined, at least in part, by a package substrate and an electrically-routed lid bonded to the package substrate to sealingly enclose an air cavity. The electrically-routed lid includes, in turn, an upper lid wall, peripheral lid sidewalls, and sidewall-embedded vias contained in the peripheral lid sidewalls and each extending essentially in a package height direction. Radio frequency (RF) circuitry is attached to the package substrate and located within the air cavity, while a topside input/output interface is provided on the upper lid wall and electrically interconnected with the RF circuitry through the sidewall-embedded vias of the electrically-routed lid.

Abstract: An insert for a ball joint (19) in a motor vehicle. The insert having a first part-structure (6) for making at least partial slide-bearing contact with a joint ball (2). The first part-structure (6) can be connected, by over-molding, to a joint socket (17) and/or to a joint housing (18). The insert (1) can be positioned and/or handled to cover a pole surface, to increase the extraction force, the insert (1) has an open part-structure (20) such that a cage-like configuration can be produced for surrounding the joint ball (2).

Abstract: A device includes a package body including a central flange and an amplifier module mounted to the central flange of the surface-mount device. The amplifier module includes a module substrate mounted to the central flange. The module substrate includes a first die mount window, a first circuitry on a first surface of the module substrate, a second circuitry on the first surface of the module substrate, and a first amplifier die mounted on the central flange. The first amplifier die is at least partially disposed within the first die mount window and the first amplifier die is electrically connected to the first circuitry and the second circuitry. The first circuitry is electrically connected to a first lead of the package body and the second circuitry is electrically connected to a second lead of the package body.

Abstract: A joint (10) with first and second joint components (12, 26; 19) are movably connected to one another. The first joint component (12, 26) has a spherical joint body (14, 28) and the second joint component (19) rotatably and pivotably holds the joint body (14, 28). A sensor device, for determining the position of the first and second joint components (12, 26; 19) relative to one another, is arranged on the joint (10). The sensor device has at least one sensor element (21, 31) which can be integrated in a housing (18) that is produced by an assembly overmolding process. The joint housing (18) forms the second joint component (19) in which the joint body (14, 28) is directly supported.

Abstract: A chassis component for a wheel suspension which has a strut arrangement with at least one strut which is in the form of a profile component with an open cross-section. The at least one strut has a profile base and two wall sections that extend away from the profile base. An articulation point is provided, at least at one end of the strut, for receiving two joint components movably connected to one another, namely, a first joint component having a spherical joint body and a second joint component that rotatably and/or pivotably holds the joint body. In the area of the at least one articulation point, the wall sections have first and second joint accommodation apertures arranged opposite one another. A cylindrical sleeve is pressed in between the first joint accommodation aperture and the second joint accommodation aperture and keeps the opposite wall sections apart from one another.

Abstract: A chassis component for a wheel suspension, having a strut arrangement with at least one strut which has a profile with an open cross-section. The at least one strut has a profile base and two wall sections which extend away from the base. An end of the strut has an articulation point that receives a first joint component having a spherical joint body and a second joint component which holds the joint body so as to rotate and/or pivot. A first joint accommodation aperture and a second joint accommodation aperture are arranged, in the area of the articulation point, opposite one another. The joint body is positioned via a circular-segment-shaped fastening element arranged on the joint body between the joint accommodation apertures. The joint accommodation apertures and the joint body positioned between them are integrated in a joint housing produced by overmolding, which forms the second joint component.

Abstract: Interconnected substrate arrays, microelectronic packages, and methods for fabricating microelectronic packages for fabricating microelectronic packages utilizing interconnected substrate arrays containing integrated electrostatic discharge (ESD) protection grids are provided. In an embodiment, the method includes obtaining an interconnected substrate array having an integrated ESD protection grid. The ESD protection grid includes, in turn, ESD grid lines at least partially formed in singulation streets of an interconnected substrate array and electrically coupling die attachment regions of the substrate array to one or more peripheral machine ground contacts. Array-level fabrication steps are performed to produce an interconnected package array utilizing the interconnected substrate array, while electrically coupling the die attachment regions to electrical ground through the ESD protection grid during at least one of the array-level fabrication steps.

Abstract: Interconnected substrate arrays, microelectronic packages, and methods for fabricating microelectronic packages for fabricating microelectronic packages utilizing interconnected substrate arrays containing integrated electrostatic discharge (ESD) protection grids are provided. In an embodiment, the method includes obtaining an interconnected substrate array having an integrated ESD protection grid. The ESD protection grid includes, in turn, ESD grid lines at least partially formed in singulation streets of an interconnected substrate array and electrically coupling die attachment regions of the substrate array to one or more peripheral machine ground contacts. Array-level fabrication steps are performed to produce an interconnected package array utilizing the interconnected substrate array, while electrically coupling the die attachment regions to electrical ground through the ESD protection grid during at least one of the array-level fabrication steps.

Abstract: A chassis component for a wheel suspension which has a strut arrangement with at least one strut which is in the form of a profile component with an open cross-section. The at least one strut has a profile base and two wall sections that extend away from the profile base. An articulation point is provided, at least at one end of the strut, for receiving two joint components movably connected to one another, namely, a first joint component having a spherical joint body and a second joint component that rotatably and/or pivotably holds the joint body. In the area of the at least one articulation point, the wall sections have first and second joint accommodation apertures arranged opposite one another. A cylindrical sleeve is pressed in between the first joint accommodation aperture and the second joint accommodation aperture and keeps the opposite wall sections apart from one another.

Abstract: A power amplifier module includes a module substrate, a power transistor die, and a heat spreader. The module substrate has first, second, and third module pads exposed at a mounting surface. The power transistor die has an input/output surface that faces the mounting surface, an opposed ground surface, an input pad electrically coupled to the first module pad, an output pad electrically coupled to the second module pad, and an integrated power transistor. In an embodiment, the power transistor is a field effect transistor with a gate terminal coupled to the input pad, a drain terminal coupled to the output pad, and a source terminal coupled to the ground surface. The heat spreader has a thermal contact surface that is physically and electrically coupled to the ground surface of the power transistor die. An electrical ground contact structure is connected between the thermal contact surface and the third module pad.

Abstract: A chassis component for a wheel suspension, having a strut arrangement with at least one strut which has a profile with an open cross-section. The at least one strut has a profile base and two wall sections which extend away from the base. An end of the strut has an articulation point that receives a first joint component having a spherical joint body and a second joint component which holds the joint body so as to rotate and/or pivot. A first joint accommodation aperture and a second joint accommodation aperture are arranged, in the area of the articulation point, opposite one another. The joint body is positioned via a circular-segment-shaped fastening element arranged on the joint body between the joint accommodation apertures. The joint accommodation apertures and the joint body positioned between them are integrated in a joint housing produced by overmolding, which forms the second joint component.

Abstract: A joint (10) with first and second joint components (12, 26; 19) are movably connected to one another. The first joint component (12, 26) has a spherical joint body (14, 28) and the second joint component (19) rotatably and pivotably holds the joint body (14, 28). A sensor device, for determining the position of the first and second joint components (12, 26; 19) relative to one another, is arranged on the joint (10). The sensor device has at least one sensor element (21, 31) which can be integrated in a housing (18) that is produced by an assembly overmolding process. The joint housing (18) forms the second joint component (19) in which the joint body (14, 28) is directly supported.

Abstract: A method for producing a ball joint having an outer housing with an outer housing stud opening, an inner housing arranged inside the outer housing and provided with an inner housing stud opening, and a ball stud having a joint ball is moveably fitted in the inner housing and which extends out through the inner housing stud opening. The method includes inserting and positioning the stud with its joint ball in the outer housing such that, between the outer housing and the stud, a free space surrounding the joint ball and/or stud remains and the stud extends out through the outer housing stud opening. After which the free space is filled with a plastic material which enclosed the joint ball and then cures to form the inner housing. A gap is formed between the outer and inner housings during curing and closed after curing by compressing the outer housing.

Abstract: A sleeve joint (1), in particular for a vehicle, having an outer sleeve (3) which receives and secures a ball socket (9), in an axial direction. The ball socket (9) is composed of a plastics material for engagement with an inner ball joint body (5). The ball socket (9) extends radially as far as an inner wall (11) of the outer sleeve, such that the ball socket (9) is supported directly on the outer sleeve (3).

Abstract: A method for producing a ball joint having an outer housing with an outer housing stud opening, an inner housing arranged inside the outer housing and provided with an inner housing stud opening, and a ball stud having a joint ball is moveably fitted in the inner housing and which extends out through the inner housing stud opening. The method includes inserting and positioning the stud with its joint ball in the outer housing such that, between the outer housing and the stud, a free space surrounding the joint ball and/or stud remains and the stud extends out through the outer housing stud opening. After which the free space is filled with a plastic material which enclosed the joint ball and then cures to form the inner housing. A gap is formed between the outer and inner housings during curing and closed after curing by compressing the outer housing.

Abstract: An insert for a ball joint (19) in a motor vehicle. The insert having a first part-structure (6) for making at least partial slide-bearing contact with a joint ball (2). The first part-structure (6) can be connected, by over-molding, to a joint socket (17) and/or to a joint housing (18). The insert (1) can be positioned and/or handled to cover a pole surface, to increase the extraction force, the insert (1) has an open part-structure (20) such that a cage-like configuration can be produced for surrounding the joint ball (2).

Abstract: A sleeve joint (1), in particular for a vehicle, having an outer sleeve (3) which receives and secures a ball socket (9), in an axial direction. The ball socket (9) is composed of a plastics material for engagement with an inner ball joint body (5). The ball socket (9) extends radially as far as an inner wall (11) of the outer sleeve, such that the ball socket (9) is supported directly on the outer sleeve (3).