Abstract: The present invention relates to a method to configure an illuminated surface on a device, and to generate illuminated patterns on a hard surface and to disclose an embodiment in an apparatus that applies the invention. The graphical patterns may include text and/or symbols as illuminated surfaces on the device. The invention may be used in all types of equipment and apparatus, where there is a demand for a high quality user interaction surfaces including graphics patterns on the surface, with a very nice looking expression/display.

Abstract: The present invention relates to a method to configure an illuminated surface on a device, and to generate illuminated patterns on a hard surface and to disclose an embodiment in an apparatus that applies the invention. The graphical patterns may include text and/or symbols as illuminated surfaces on the device. The invention may be used in all types of equipment and apparatus, where there is a demand for a high quality user interaction surfaces including graphics patterns on the surface, with a very nice looking expression/display.

Abstract: Ultra-thin sections in an electrically conducting material are formed by electrochemically removing material to a thickness of approximately 5 to 150 micrometers and removing further material by laser micromachining to a material thickness of 1 to 30 micrometers. The electrochemical process quickly removes substantial material but is not as precise and accurate as laser machining to create the ultra-thin sections or translucent sections. Removing material by an electrochemical process may be controlled down to a thickness of approx. 10-12 micrometres so that enough margin of a material thickness is left at the bottom of this first cavity. The laser micromachining process removes remaining material down to a predetermined level, e.g. 1-5 micrometres, relatively rapidly, so that a relatively quick process for the manufacture of ultra-thin sections in an electrically conducting material is achieved. A metal structure manufactured by the novel and inventive process is disclosed.