Patents by Inventor Jan Pieter Hein VAN DELFT

Jan Pieter Hein VAN DELFT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220015229
    Abstract: A curved electronic device (10c) can be formed by a stack with a curved substrate (13) comprising a thermoplastic material (Ms), and at least one electronic component (14) connected to an electronic circuit (15) disposed on the substrate (13). A component area (11) of the substrate surface (11.12) around the electronic component (14) comprises a first material (M1) providing relatively low absorption (A1) to light (L) and a surrounding area (12) of the substrate (13) outside the component area (11), comprises a second material (M2) providing relatively high absorption (A2) of the light (L). E.g. as a result of differential heating and thermoforming a first thickness (T1) of the substrate (13) in the component area (11) may be relatively high compared to a second thickness (T2) of the substrate (13) in the surrounding area (12).
    Type: Application
    Filed: December 2, 2019
    Publication date: January 13, 2022
    Inventors: Margaretha Maria DE KOK, Roel Henry Louis KUSTERS, Jan Pieter Hein VAN DELFT, Jeroen Franciscus Marinus SCHRAM, Adri VAN DER WAAL, Jan-Eric Jack Martijn RUBINGH, Jeroen VAN DEN BRAND