Abstract: In a calibration routine, a first set of X-ray recordings of at least one closed first reference package without content is produced, and a mass calibration signature is derived therefrom. A second set of X-ray recordings of at least one closed second reference package having a reference content is produced, and a reference signature is derived therefrom. From the reference signature and the mass calibration signature, a reference measurement value is derived via subtraction. The reference mass of the reference content is ascertained by weighing and assigned to the reference measurement value. In ongoing measurement operation, at least one set of measuring X-ray recordings of closed foil packages each having a content is produced and a measurement signature is derived therefrom. Herefrom, and from the mass calibration signature, measurement values for the individual closed foil packages are derived via subtraction, from which the masses of the contents are quantitatively determined.

Abstract: In a calibration routine, a first set of X-ray recordings of at least one closed first reference package without content is produced, and a mass calibration signature is derived therefrom. A second set of X-ray recordings of at least one closed second reference package having a reference content is produced, and a reference signature is derived therefrom. From the reference signature and the mass calibration signature, a reference measurement value is derived via subtraction. The reference mass of the reference content is ascertained by weighing and assigned to the reference measurement value. In ongoing measurement operation, at least one set of measuring X-ray recordings of closed foil packages each having a content is produced and a measurement signature is derived therefrom. Herefrom, and from the mass calibration signature, measurement values for the individual closed foil packages are derived via subtraction, from which the masses of the contents are quantitatively determined.

Abstract: The invention relates to an apparatus (1) for examining test bodies (P), in particular electronic subassemblies and electronic devices, comprising at least one radiation source (2) for X-raying at least one test body (P), at least one detection unit (3) for detecting radiation (S) emitted by means of the radiation source (2), at least one holding element (4) for holding the at least one test body (P) and for positioning the latter between the radiation source (2) and the detection unit (3), and a movement unit (5), coupled to the holding element (4), for moving the holding element (4), wherein the movement unit (5) is constructed as a parallel-mechanism movement unit.

Abstract: The invention relates to an apparatus (1) for examining test bodies (P), in particular electronic subassemblies and electronic devices, comprising at least one radiation source (S) for X-raying at least one test body (P), at least one detection unit (3) for detecting radiation (S) emitted by means of the radiation source (2), at least one holding element (4) for holding the at least one test body (P) and for positioning the latter between the radiation source (2) and the detection unit (3), and a movement unit (5), coupled to the holding element (4), for moving the holding element (4), wherein the movement unit (5) is constructed as a parallel-mechanism movement unit.

Abstract: A first x-ray image of the circuit board that is equipped with components only on a first side with a first x-ray device (2) that produces transmission images and a second x-ray image of a circuit board that is equipped with components on both sides with a second x-ray device (4) that produces transmission images are recorded in an x-ray testing method for checking circuit boards that are equipped with components on two sides, in particular for checking soldered joints. A test x-ray image is then evaluated in a computer unit in which the second side that is equipped with components is displayed in enhanced form by forming a function from the pixel values of the first x-ray image and the corresponding pixel values of the second x-ray image.

Abstract: A first x-ray image of the circuit board that is equipped with components only on a first side with a first x-ray device (2) that produces transmission images and a second x-ray image of a circuit board that is equipped with components on both sides with a second x-ray device (4) that produces transmission images are recorded in an x-ray testing method for checking circuit boards that are equipped with components on two sides, in particular for checking soldered joints. A test x-ray image is then evaluated in a computer unit in which the second side that is equipped with components is displayed in enhanced form by forming a function from the pixel values of the first x-ray image and the corresponding pixel values of the second x-ray image.