Patents by Inventor Jan ROMBERG

Jan ROMBERG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230172625
    Abstract: An implantation catheter for implanting an implant into a human or animal body, comprises a first catheter shaft and a holding element being arranged at a distal end of the first catheter shaft, the holding element being configured for holding and releasing the implant. The holding element comprises a shape memory element.
    Type: Application
    Filed: March 26, 2021
    Publication date: June 8, 2023
    Applicant: BIOTRONIK SE & Co. KG
    Inventors: Christian Zickert, Sonja Meine, Jan Helge Richter, Philipp Konstantin Siegel, Jan Romberg
  • Publication number: 20210410287
    Abstract: A printed circuit board assembly of an implantable medical device comprises a printed circuit board and a sensor device that is arranged at the printed circuit board and joined to the printed circuit board by way of an adhesive layer. It is provided in the process that the adhesive layer is formed of an adhesive compound in which glass spheres are embedded. In this way, a printed circuit board assembly is provided which, in a simple, inexpensive manner, allows a sensor device to be joined to a printed circuit board for installation in a medical device, with advantageous mechanical decoupling and improved process reliability.
    Type: Application
    Filed: September 10, 2021
    Publication date: December 30, 2021
    Applicant: BIOTRONIK SE & Co. KG
    Inventors: Roman Meier, Dany Quahs, Jan Romberg
  • Patent number: 11147164
    Abstract: A printed circuit board assembly of an implantable medical device comprises a printed circuit board and a sensor device that is arranged at the printed circuit board and joined to the printed circuit board by way of an adhesive layer. It is provided in the process that the adhesive layer is formed of an adhesive compound in which glass spheres are embedded. In this way, a printed circuit board assembly is provided which, in a simple, inexpensive manner, allows a sensor device to be joined to a printed circuit board for installation in a medical device, with advantageous mechanical decoupling and improved process reliability.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: October 12, 2021
    Assignee: BIOTRONIK SE & Co. KG
    Inventors: Roman Meier, Dany Quahs, Jan Romberg
  • Publication number: 20210092849
    Abstract: A printed circuit board assembly of an implantable medical device comprises a printed circuit board and a sensor device that is arranged at the printed circuit board and joined to the printed circuit board by way of an adhesive layer. It is provided in the process that the adhesive layer is formed of an adhesive compound in which glass spheres are embedded. In this way, a printed circuit board assembly is provided which, in a simple, inexpensive manner, allows a sensor device to be joined to a printed circuit board for installation in a medical device, with advantageous mechanical decoupling and improved process reliability.
    Type: Application
    Filed: September 11, 2020
    Publication date: March 25, 2021
    Inventors: Roman Meier, Dany Quahs, Jan Romberg
  • Patent number: 10617877
    Abstract: An electromedical implant, having a housing with three housing segments A, B and C. Segment A is joined to segment B, and segment B is joined to segment C, so that segment B is disposed between segments A and C. Segment A and segment C are at least partially made of electrically conducting material. Furthermore, an electronics module is disposed within housing segment A and has an electric circuit arrangement for picking up and further processing electrical signals, and at least one first and one second electrical conductor for measuring electrical potentials and/or for delivering electric pulses. Each conductor has a conductor start and a conductor end, and each conductor start is connected to the electric circuit arrangement. An electrical feedthrough is at least partially made of electrically insulating material, and segment B is formed by portions of the feedthrough.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: April 14, 2020
    Assignee: BIOTRONIK SE & Co. KG
    Inventors: Marcel Starke, Jan Romberg
  • Publication number: 20180028821
    Abstract: An electromedical implant, having a housing with three housing segments A, B and C. Segment A is joined to segment B, and segment B is joined to segment C, so that segment B is disposed between segments A and C. Segment A and segment C are at least partially made of electrically conducting material. Furthermore, an electronics module is disposed within housing segment A and has an electric circuit arrangement for picking up and further processing electrical signals, and at least one first and one second electrical conductor for measuring electrical potentials and/or for delivering electric pulses. Each conductor has a conductor start and a conductor end, and each conductor start is connected to the electric circuit arrangement. An electrical feedthrough is at least partially made of electrically insulating material, and segment B is formed by portions of the feedthrough.
    Type: Application
    Filed: July 21, 2017
    Publication date: February 1, 2018
    Applicant: BIOTRONIK SE & Co. KG
    Inventors: Marcel STARKE, Jan ROMBERG