Abstract: A contactless power supply and motor control system includes a pulse width modulator, a rotary transformer, a demodulator circuit, a motor driver, and a motor. The pulse width modulator supplies a first pulse width modulated (PWM) signal that has a duty cycle and a first amplitude. The rotary transformer receives the PWM signal. The secondary winding is rotatable relative to the primary winding and supplies a second PWM signal having the duty cycle and a second amplitude. The demodulator circuit is rotatable with the secondary winding and supplies a demodulated direct current (DC) voltage having a DC voltage amplitude. The motor driver is rotatable with the secondary winding and the demodulator circuit and controllably supplies motor current. The motor receives the motor current and rotates at a rotational speed.

Abstract: A contactless power supply and motor control system includes a pulse width modulator, a rotary transformer, a demodulator circuit, a motor driver, and a motor. The pulse width modulator supplies a first pulse width modulated (PWM) signal that has a duty cycle and a first amplitude. The rotary transformer receives the PWM signal. The secondary winding is rotatable relative to the primary winding and supplies a second PWM signal having the duty cycle and a second amplitude. The demodulator circuit is rotatable with the secondary winding and supplies a demodulated direct current (DC) voltage having a DC voltage amplitude. The motor driver is rotatable with the secondary winding and the demodulator circuit and controllably supplies motor current. The motor receives the motor current and rotates at a rotational speed.

Abstract: A microelectromechanical systems (MEMS) device comprises an optical directional coupler comprising: a first waveguide having a first and a second end, wherein a light beam is introduced into the first end; a second waveguide having a third and a fourth end, wherein the light beam is evanescently coupled between the two waveguides in the central region; a first photodetector to detect first optical power in the light beam at the second end; and a second photodetector to detect second optical power in the light beam at the fourth end; a vibrating proof mass adjacent to the coupler in a first direction from the coupler, wherein when inertial forces are applied to the MEMS device in a second direction, the proof mass moves in the first direction; a processor to determine the displacement of the proof mass from the coupler as a function of the first and the second optical power.

Abstract: A shock-isolated mounting device and a method and system are provided. For example, the shock-isolated mounting device includes an enclosure configured to support the mounting device, at least one damper attached between the mounting device and the enclosure, and a thermally-conductive element disposed on a surface of the mounting device and configured to thermally couple the mounting device to the enclosure. The thermally-conductive element facilitates the dissipation of heat generated by electronic components mounted onto the shock-isolated mounting device.

Abstract: A microelectromechanical systems (MEMS) device comprises an optical directional coupler comprising: a first waveguide having a first and a second end, wherein a light beam is introduced into the first end; a second waveguide having a third and a fourth end, wherein the light beam is evanescently coupled between the two waveguides in the central region; a first photodetector to detect first optical power in the light beam at the second end; and a second photodetector to detect second optical power in the light beam at the fourth end; a vibrating proof mass adjacent to the coupler in a first direction from the coupler, wherein when inertial forces are applied to the MEMS device in a second direction, the proof mass moves in the first direction; a processor to determine the displacement of the proof mass from the coupler as a function of the first and the second optical power.

Abstract: A shock-isolated mounting device and a method and system are provided. For example, the shock-isolated mounting device includes an enclosure configured to support the mounting device, at least one damper attached between the mounting device and the enclosure, and a thermally-conductive element disposed on a surface of the mounting device and configured to thermally couple the mounting device to the enclosure. The thermally-conductive element facilitates the dissipation of heat generated by electronic components mounted onto the shock-isolated mounting device.