Patents by Inventor Jan Sik

Jan Sik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a multilayer structure for reducing defects in semiconductor devices and structure
    Patent number: 10242929
    Abstract: A method of forming a semiconductor device includes providing a semiconductor substrate and forming amorphous semiconductor layers adjacent a major surface of the substrate. The method includes interposing dielectric layers between the amorphous semiconductor layers. The method includes forming polycrystalline semiconductor layers adjacent the amorphous semiconductor layers. The method includes interposing dielectric layers between the polycrystalline semiconductor layers and between the last amorphous semiconductor layer and the first polycrystalline semiconductor layer. The method includes forming a fine-grain polycrystalline semiconductor layer adjacent the polycrystalline semiconductor layers but is separated from the last polycrystalline semiconductor layer by an additional dielectric layer. The fine-grain polycrystalline semiconductor layer is formed at a higher temperature than the polycrystalline semiconductor layers and the amorphous semiconductor layers.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: March 26, 2019
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: David Lysacek, Viola Krizakova, Jan Sik
  • SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
    Publication number: 20150333016
    Abstract: In one embodiment, methods for making semiconductor devices are disclosed.
    Type: Application
    Filed: July 29, 2015
    Publication date: November 19, 2015
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Jan Sik, Petr Kostelník, Lukás Válek, Michal Lorenc, Milos Pospísil, David Lysácek, John Michael Parsey, JR.
  • SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
    Publication number: 20140264761
    Abstract: In one embodiment, methods for making semiconductor devices are disclosed.
    Type: Application
    Filed: March 7, 2014
    Publication date: September 18, 2014
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Jan Sik, Petr Kostelník, Lukás Válek, Michal Lorenc, Milos Pospìsil, David Lysácek, John Michael Parsey, JR.