Patents by Inventor JAN SPENGLER

JAN SPENGLER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240290313
    Abstract: An acoustic damping material includes at least one polybutadiene PB, at least one at 25° C. liquid rubber LR, at least one butyl rubber BR, at least one natural or synthetic polyisoprene PI, at least one hydrocarbon resin HR and at least one solid particulate filler FM. The acoustic damping material is suitable for use in damping of undesired vibrations and noise in mechanical structures and components of manufactured articles. The acoustic damping material is used for damping of vibrations and noise in transportation vehicles and white goods, and a vibration and noise damping element include an adhesive layer composed of the acoustic damping material, and a method for applying a vibration and noise damping element to a noise emitting surface of a substrate, and a vibration damped system include a substrate and the vibration and noise damping element bonded to a noise emitting surface of the substrate.
    Type: Application
    Filed: July 5, 2022
    Publication date: August 29, 2024
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Robert WITT, Marko VIDOVIC, Frederick SCHWAB, Christian HARDT, Jan SPENGLER
  • Publication number: 20240282286
    Abstract: A vibration and noise damping element including a damping layer having first and second surfaces and an adhesive layer covering at least part of the first surface. The damping layer is composed of a damping layer material with a viscosity at 60° C. of 30?000-500?000 Pa*s containing at least one rubber component and the adhesive layer is composed of an adhesive layer material with a viscosity at 60° C. of 50?000-300?000 Pa*s containing at least one rubber component. The ratio of the thickness of the damping layer d1 to the adhesive layer d2 (d1/d2) is 0.6-4.0 and the sum (d1+d2) is 0.5-2.5 mm. The element shows good performance in the ball drop test at low temperatures, has good adhesion to the substrate it is applied to, provides good vibration and noise damping properties and guarantees easy separation after storage at temperatures between 30-50° C.
    Type: Application
    Filed: June 27, 2022
    Publication date: August 22, 2024
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Robert WITT, Marko VIDOVIC, Frederick SCHWAB, Christian HARDT, Jan SPENGLER
  • Publication number: 20240271415
    Abstract: A sealing element includes: a waterproofing adhesive layer having first and second major surfaces, an adhesive layer covering at least a portion of the first major surface of the waterproofing adhesive layer, and a carrier layer on the side of the waterproofing adhesive layer opposite to the side of the adhesive layer, wherein the waterproofing adhesive layer is composed of a self-adhering bituminous composition and the adhesive layer is composed of a non-bituminous pressure sensitive adhesive. The sealing element is used as a waterproofing, roofing, vapor barrier, vapor retarder, or a façade membrane, or as a waterproofing, roofing tape, or façade tape.
    Type: Application
    Filed: July 5, 2022
    Publication date: August 15, 2024
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Johannes PECHER, Jan SPENGLER, Simon SCHOENBRODT, Gina FRUTIGER
  • Publication number: 20240018327
    Abstract: A thermally expandable composition includes at least one polymer P, at least one chemical blowing agent CBA, at least one physical blowing agent PBA composed of expandable microspheres, and at least one filler F. A damping element includes a first layer composed of an expansion material and a second layer composed of an acoustic damping material. The damping element is suitable for providing vibration and/or noise damped systems.
    Type: Application
    Filed: November 8, 2021
    Publication date: January 18, 2024
    Applicant: SIKA TECHNOLOGY AG
    Inventors: Dusko PARIPOVIC, Christian HARDT, Jan SPENGLER, Jean Georges BECKER, Achim KOHL
  • Patent number: 10896860
    Abstract: The present invention relates to a method for casting electronic components. The invention also relates to a curable compound that can be used as casting compound in the method. The casting compound contains at least one cross-linking component which is homogeneously distributed in the casting compound and can cross-link to at least two different cross-linked systems. A first of these networks has a higher cross-link density than a second cross-linked system, wherein the cross-linking to the first cross-linked system is triggered via an event other than the cross-linking to the second cross-linked system. During casting, the at least one cross-linking component of the casting compound is cured at least in part to the first cross-linked system in at least one first region spaced from the components and at least to the second cross-linked system in a second region enclosing and immediately surrounding the components.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: January 19, 2021
    Assignee: Robert Bosch GmbH
    Inventors: Arno Reil, Juergen Wieser, Jan Spengler, Roland Klein, Alexandra Kreickenbaum
  • Publication number: 20190304861
    Abstract: The present invention relates to a method for casting electronic components. The invention also relates to a curable compound that can be used as casting compound in the method. The casting compound contains at least one cross-linking component which is homogeneously distributed in the casting compound and can cross-link to at least two different cross-linked systems. A first of these networks has a higher cross-link density than a second cross-linked system, wherein the cross-linking to the first cross-linked system is triggered via an event other than the cross-linking to the second cross-linked system. During casting, the at least one cross-linking component of the casting compound is cured at least in part to the first cross-linked system in at least one first region spaced from the components and at least to the second cross-linked system in a second region enclosing and immediately surrounding the components.
    Type: Application
    Filed: July 10, 2017
    Publication date: October 3, 2019
    Inventors: ARNO REIL, JUERGEN WIESER, JAN SPENGLER, ROLAND KLEIN, ALEXANDRA KREICKENBAUM