Abstract: A micromechanical component having a printed circuit board with a main extension plane, having an ASIC chip and a MEMS chip, which are arranged parallel to the main extension plane, wherein the ASIC chip is arranged above the printed circuit board, and the MEMS chip is arranged above the ASIC chip, wherein the ASIC chip is electrically contacted to the printed circuit board in a bonding region by bonding wires. An adapter chip is arranged between the ASIC chip and the MEMS chip, which adapter chip at least partially covers the bonding region in a z-direction perpendicular to the main extension plane. A method for producing a micromechanical component is also described.

Abstract: The invention relates to a device (100) for supporting one or more MEMS components (160), comprising a base component (110), which substantially consists of a first material with a first coefficient of expansion ?1, an interposer (120), which is integrally bonded to the base component (110) in one or more first connection regions (140) and substantially consists of a second material with a second coefficient of expansion ?2, and a support substrate (130), which is integrally bonded to the interposer (120) in one or more second connection regions (150) and substantially consists of a third material with a third coefficient of expansion ?3, wherein the support substrate (130) is configured to support the one or more MEMS components (160), and for the coefficients of expansion the following holds true: ?1>?2??3, preferably ?1>?2=?3.