Patents by Inventor Jan Thomas Czornack

Jan Thomas Czornack has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and apparatus for embedding wire in substrates for secure documents
    Patent number: 9449269
    Abstract: A booster antenna (BA) for a smart card comprises a card antenna (CA) component extending around a periphery of a card body (CB), a coupler coil (CC) component at a location for an antenna module (AM), and an extension antenna (EA) contributing to the inductance of the booster antenna (BA). A method of wire embedding is also disclosed, by controlling a force and ultrasonic power applied by an embedding tool at different positions on the card body (CB).
    Type: Grant
    Filed: May 16, 2015
    Date of Patent: September 20, 2016
    Assignee: Féinics AmaTech Teoranta
    Inventors: David Finn, Jan Thomas Czornack
  • METHODS AND APPARATUS FOR EMBEDDING WIRE IN SUBSTRATES FOR SECURE DOCUMENTS
    Publication number: 20150356399
    Abstract: A booster antenna (BA) for a smart card comprises a card antenna (CA) component extending around a periphery of a card body (CB), a coupler coil (CC) component at a location for an antenna module (AM), and an extension antenna (EA) contributing to the inductance of the booster antenna (BA). A method of wire embedding is also disclosed, by controlling a force and ultrasonic power applied by an embedding tool at different positions on the card body (CB).
    Type: Application
    Filed: May 16, 2015
    Publication date: December 10, 2015
    Inventors: David Finn, Jan Thomas Czornack
  • Antenna modules for dual interface smart cards, booster antenna configurations, and methods
    Patent number: 9112272
    Abstract: Winding a module antenna (MA) for an antenna module (AM) on a tubular support structure (SS) having have a lid structure (LD) or a planar tool (PT) disposed at its free end to constrain the windings. Alternatively, winding wire coils for module antennas (MA) on coil winding forms (CWF, FIG. 26) and transferring them to a module tape (MT). Double-sided and single-sided module tapes (MT) having vias and openings (h) are disclosed. Connection bridges (CBR) formed within, between or surrounding the contact pads (CP) are disclosed. Various configurations for components (CA, CC, EA) of booster antenna (BA) are disclosed. A coupler coil (CC) has an inner winding (iw) and an outer winding (ow). Techniques for embedding wire and for bonding wire are disclosed.
    Type: Grant
    Filed: November 13, 2013
    Date of Patent: August 18, 2015
    Assignee: Feinics Amatech Teoranta
    Inventors: David Finn, Jan Thomas Czornack, Mustafa Lotya, Theodor Fendt, Klaus Ummenhofer
  • Dual interface smart cards, and methods of manufacturing
    Patent number: 9033250
    Abstract: A booster antenna (BA) for a smart card comprises a card antenna (CA) component extending around a periphery of a card body (CB), a coupler coil (CC) component at a location for an antenna module (AM), and an extension antenna (EA) contributing to the inductance of the booster antenna (BA). A method of wire embedding is also disclosed, by controlling a force and ultrasonic power applied by an embedding tool at different positions on the card body (CB).
    Type: Grant
    Filed: September 8, 2013
    Date of Patent: May 19, 2015
    Assignee: Féinics AmaTech Teoranta
    Inventors: David Finn, Patrick Gerard Conneely, Jan Thomas Czornack, Klaus Ummenhofer, Mustafa Lotya
  • ANTENNA MODULES FOR DUAL INTERFACE SMART CARDS, BOOSTER ANTENNA CONFIGURATIONS, AND METHODS
    Publication number: 20140104133
    Abstract: Winding a module antenna (MA) for an antenna module (AM) on a tubular support structure (SS) having have a lid structure (LD) or a planar tool (PT) disposed at its free end to constrain the windings. Alternatively, winding wire coils for module antennas (MA) on coil winding forms (CWF, FIG. 26) and transferring them to a module tape (MT). Double-sided and single-sided module tapes (MT) having vias and openings (h) are disclosed. Connection bridges (CBR) formed within, between or surrounding the contact pads (CP) are disclosed. Various configurations for components (CA, CC, EA) of booster antenna (BA) are disclosed. A coupler coil (CC) has an inner winding (iw) and an outer winding (ow). Techniques for embedding wire and for bonding wire are disclosed.
    Type: Application
    Filed: November 13, 2013
    Publication date: April 17, 2014
    Inventors: David Finn, Jan Thomas Czornack, Mustafa Lotya, Theodor Fendt, Klaus Ummenhofer
  • DUAL INTERFACE SMART CARDS, AND METHODS OF MANUFACTURING
    Publication number: 20140091149
    Abstract: A booster antenna (BA) for a smart card comprises a card antenna (CA) component extending around a periphery of a card body (CB), a coupler coil (CC) component at a location for an antenna module (AM), and an extension antenna (EA) contributing to the inductance of the booster antenna (BA). A method of wire embedding is also disclosed, by controlling a force and ultrasonic power applied by an embedding tool at different positions on the card body (CB).
    Type: Application
    Filed: September 8, 2013
    Publication date: April 3, 2014
    Inventors: David Finn, Patrick Gerard Conneely, Jan Thomas Czornack, Klaus Ummenhofer, Mustafa Lotya