Patents by Inventor Jan Vanfleteren

Jan Vanfleteren has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220157559
    Abstract: An electron microscopy grid, includes: (i) a perforated substrate, (ii) a support film on the perforated substrate, the support film having a thickness of 60 ? or less, and (iii) linkers attached on top of the support film. The linkers has at least one affinity group for immobilizing an analyte; wherein the linkers form a non-random pattern on the support film.
    Type: Application
    Filed: February 25, 2020
    Publication date: May 19, 2022
    Inventors: Wouter VAN PUTTE, Jean-Pierre TIMMERMANS, Jan VANFLETEREN
  • Publication number: 20220015930
    Abstract: The present invention relates to a method for integrating an electronic circuit in or on a medical stent. The method comprises obtaining (101) a deformable medical stent (21) in a substantially planar shape, in which the deformable medical stent is adapted for being deployed in a substantially cylindrical shape in the body. The method also comprises attaching (104) a deformable electronic circuit (22) onto the deformable medical stent in the planar shape thereby forming a deformable hybrid structure. The method also comprises shaping (107) said hybrid structure into the cylindrical shape.
    Type: Application
    Filed: November 28, 2019
    Publication date: January 20, 2022
    Applicants: Universiteit Gent, IMEC VZW
    Inventors: Rik Verplancke, Jan Vanfleteren
  • Publication number: 20200232968
    Abstract: A method for deriving a calibration curve for determining a concentration of an analyte in an electrochemical reactor comprises determining a current level between a functionalized electrode and a reference electrode in the electrochemical reactor in absence of an analyte, the current level forming a zero-concentration current; injecting a fluid comprising an analyte in a first given concentration in the electrochemical reactor, determining after the predetermined amount of time a first calibration current level corresponding to the first given concentration and calculating a first current ratio of the first current level to the zero-concentration current; repeating the previous step for at least a second given concentration of the analyte, yielding at least a second current ratio of a second current level to the zero-concentration current; obtaining a calibration curve indicative of current ratio as a function of concentration from the first current ratio and at least the second current ratio.
    Type: Application
    Filed: January 26, 2018
    Publication date: July 23, 2020
    Inventors: Jan VANFLETEREN, Patricia KHASHAYAR
  • Publication number: 20200029440
    Abstract: Methods are provided for manufacturing shape-retaining non-flat devices comprising components integrated on a device surface, the non-flat devices being made by deformation of a flat device. Based on the layout of a non-flat device, a layout of a flat device is designed. A method for designing the layout of such a flat device is provided, wherein the method includes inserting mechanical interconnections between pairs of elements to define the position of the elements on a surface of the non-flat device, thus leaving zero or less degrees of freedom for the location of the components. Based on the layout of a flat device thus obtained, the flat device is manufactured and next transformed into the shape-retaining non-flat device by means of a thermoforming process, thereby accurately and reproducibly positioning the elements at a predetermined location on a surface of the non-flat device.
    Type: Application
    Filed: August 17, 2017
    Publication date: January 23, 2020
    Inventors: Jan Vanfleteren, Frederick Bossuyt, Bart Plovie
  • Publication number: 20170010259
    Abstract: Disclosed herein is a microfluidic electrochemical device adapted for analysis of bone turnover markers in a fluidic sample, the microfluidic electrochemical device that can include: an electrochemical sensor layer comprising at least one work electrode having a surface modified for binding a bone turnover marker; and a microfluidic structure layer covering the electrochemical sensor layer such that a fluidic sample travelling in the microfluidic channels of the microfluidic structure layer come into contact with the electrode array.
    Type: Application
    Filed: June 12, 2016
    Publication date: January 12, 2017
    Inventors: Ghassem Amoabediny, Patricia Khashayar, Bagher Ardeshir Larijani, Jan Vanfleteren
  • Patent number: 9418927
    Abstract: A stretchable electronic device is disclosed. In one aspect, the device includes at least one combination of a stretchable electronic structure having a first Young's modulus and a rigid or flexible electronic structure having a second Young's modulus higher than the first Young's modulus. The stretchable electronic structure and the rigid or flexible electronic structure may be electrically connected to each other by a semi-transition structure having a third Young's modulus with a value in a range between the first and the second Young's modulus.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: August 16, 2016
    Assignees: IMEC, Universiteit Gent
    Inventors: Fabrice Axisa, Jan Vanfleteren, Frederick Bossuyt
  • Patent number: 9247648
    Abstract: A stretchable electronic device is disclosed. In one aspect, the device has a stretchable interconnection electrically connecting two electronic components. The stretchable interconnection includes an electrically conductive channel having a predetermined first geometry by which the channel is stretchable up to a given elastic limit and a first flexible supporting layer provided for supporting the electrically conductive channel and having a predetermined second geometry by which the first supporting layer is stretchable. The predetermined second geometry has a predetermined deviation from the predetermined first geometry chosen for restricting stretchability of the electrically conductive channel below its elastic limit.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: January 26, 2016
    Assignees: IMEC, Univesiteit Gent
    Inventors: Jan Vanfleteren, Frederick Bossuyt, Fabrice Axisa
  • Patent number: 8450825
    Abstract: A semiconductor package is disclosed. In one aspect, the package includes a base frame and a wiring substrate mounted on the base frame. The base frame has two pieces made of a material with respectively a first and a second coefficient of thermal expansion and connected to each other via resilient connecting structures. The wiring substrate has electric wiring tracks providing the electric connection between first and second bond pads, provided for being electrically connected to bond pads on respectively a die and a printed wiring board. The electrical wiring tracks have flexible parts provided to expand and contract along with the resilient connecting structures.
    Type: Grant
    Filed: July 30, 2010
    Date of Patent: May 28, 2013
    Assignees: IMEC, Katholieke Universiteit Leuven, Universiteit Gent
    Inventors: Paresh Limaye, Jan Vanfleteren, Eric Beyne
  • Patent number: 8431828
    Abstract: A composite substrate is disclosed. In one aspect, the substrate has a stretchable and/or flexible material. The substrate may further have patterned features embedded in the stretchable and/or flexible material. The patterned features have one or more patterned conducting layers.
    Type: Grant
    Filed: January 5, 2009
    Date of Patent: April 30, 2013
    Assignees: IMEC, Universiteit Gent
    Inventors: Jan Vanfleteren, Dominique Brosteaux, Fabrice Axisa
  • Patent number: 8207473
    Abstract: A method for manufacturing a stretchable electronic device is disclosed. In one aspect, the device comprises at least one electrically conductive channel connecting at least two components of the device. The method comprises forming the channel by laser-cutting a flexible substrate into a predetermined geometric shape.
    Type: Grant
    Filed: June 24, 2008
    Date of Patent: June 26, 2012
    Assignees: IMEC, Universiteit Gent
    Inventors: Fabrice Axisa, Jan Vanfleteren, Thomas Vervust
  • Patent number: 8182872
    Abstract: A method is provided for fabricating a porous elastomer, the method comprising the steps of: providing a predetermined amount of a liquid elastomer and a predetermined amount of a porogen; mixing the liquid elastomer and the porogen in vacuum until a homogenous emulsion without phase separation is formed; curing the homogenous emulsion until polymerizations of the emulsion is reached, thereby forming a cured emulsion; and removing the porogen from the cured emulsion. The method can advantageously be used for forming biocompatible porous elastomers and biocompatible porous membranes.
    Type: Grant
    Filed: September 21, 2009
    Date of Patent: May 22, 2012
    Assignees: IMEC, Universiteit Gent
    Inventors: Fabrice Axisa, Pritesh Dagur, Jan Vanfleteren
  • Publication number: 20120052268
    Abstract: A stretchable electronic device is disclosed. In one aspect, the device includes at least one combination of a stretchable electronic structure having a first young modulus and a rigid or flexible electronic structure having a second young modulus higher than the first young modulus. The stretchable electronic structure and the rigid or flexible electronic structure may be electrically connected to each other by a semi-transition structure having a third young modulus with a value in a range between the first and the second young modulus.
    Type: Application
    Filed: July 28, 2011
    Publication date: March 1, 2012
    Applicants: Universiteit Gent, IMEC
    Inventors: Fabrice Axisa, Jan Vanfleteren, Frederick Bossuyt
  • Publication number: 20120051005
    Abstract: A stretchable electronic device is disclosed. In one aspect, the device has a stretchable interconnection electrically connecting two electronic components. The stretchable interconnection includes an electrically conductive channel having a predetermined first geometry by which the channel is stretchable up to a given elastic limit and a first flexible supporting layer provided for supporting the electrically conductive channel and having a predetermined second geometry by which the first supporting layer is stretchable. The predetermined second geometry has a predetermined deviation from the predetermined first geometry chosen for restricting stretchability of the electrically conductive channel below its elastic limit.
    Type: Application
    Filed: July 28, 2011
    Publication date: March 1, 2012
    Applicants: Universiteit Gent, IMEC
    Inventors: Jan Vanfleteren, Frederick Bossuyt, Fabrice Axisa
  • Publication number: 20110037179
    Abstract: A semiconductor package is disclosed. In one aspect, the package includes a base frame and a wiring substrate mounted on the base frame. The base frame has two pieces made of a material with respectively a first and a second coefficient of thermal expansion and connected to each other via resilient connecting structures. The wiring substrate has electric wiring tracks providing the electric connection between first and second bond pads, provided for being electrically connected to bond pads on respectively a die and a printed wiring board. The electrical wiring tracks have flexible parts provided to expand and contract along with the resilient connecting structures.
    Type: Application
    Filed: July 30, 2010
    Publication date: February 17, 2011
    Applicants: IMEC, Katholieke Universiteit Leuven, UNIVERSITEIT GENT
    Inventors: Paresh Limaye, Jan Vanfleteren, Eric Beyne
  • Patent number: 7759167
    Abstract: A method of manufacturing a semiconductor device is provided, involving forming a first flexible film on a rigid carrier substrate, attaching a die to the flexible film, so as to leave contacts on the die exposed, forming a wiring layer to contact the contacts of the die, and releasing the flexible film where the die is attached, from the carrier. An area of the first flexible film where the die is attached can have a lower adhesion to the rigid carrier substrate than other areas, so that releasing can involve cutting the first flexible film to release a part of the area of lower adhesion, and leaving an area of higher adhesion. A combined thickness of the die, the first flexible film and the wiring layer can be less than 150 ?m, so that the device is bendable. Devices can be stacked.
    Type: Grant
    Filed: November 21, 2006
    Date of Patent: July 20, 2010
    Assignees: IMEC, Universiteit Gent (RUG)
    Inventors: Jan Vanfleteren, Wim Christiaens
  • Publication number: 20100075056
    Abstract: A method is provided for fabricating a porous elastomer, the method comprising the steps of: providing a predetermined amount of a liquid elastomer and a predetermined amount of a porogen; mixing the liquid elastomer and the porogen in vacuum until a homogenous emulsion without phase separation is formed; curing the homogenous emulsion until polymerizations of the emulsion is reached, thereby forming a cured emulsion; and removing the porogen from the cured emulsion. The method can advantageously be used for forming biocompatible porous elastomers and biocompatible porous membranes.
    Type: Application
    Filed: September 21, 2009
    Publication date: March 25, 2010
    Applicant: IMEC
    Inventors: Fabrice Axisa, Pritesh Dagur, Jan Vanfleteren
  • Publication number: 20090317639
    Abstract: A method for manufacturing a stretchable electronic device is disclosed. In one aspect, the device comprises at least one electrically conductive channel connecting at least two components of the device. The method comprises forming the channel by laser-cutting a flexible substrate into a predetermined geometric shape.
    Type: Application
    Filed: June 24, 2008
    Publication date: December 24, 2009
    Applicants: Interuniversitair Microelektronica Centrum vzw (IMEC), Universiteit Gent
    Inventors: Fabrice Axisa, Jan Vanfleteren, Thomas Vervust
  • Publication number: 20090107704
    Abstract: A composite substrate is disclosed. In one aspect, the substrate has a stretchable and/or flexible material. The substrate may further have patterned features embedded in the stretchable and/or flexible material. The patterned features have one or more patterned conducting layers.
    Type: Application
    Filed: January 5, 2009
    Publication date: April 30, 2009
    Applicants: Interuniversitair Microelektronica Centrum vzw (IMEC), Universiteit Gent
    Inventors: Jan Vanfleteren, Dominique Brosteaux, Fabrice Axisa
  • Patent number: 7487587
    Abstract: Methods of producing a composite substrate and devices made by the methods are disclosed. One of the methods comprises providing a flexible sacrificial layer, producing one or more patterned conducting layers on the flexible sacrificial layer, bending the sacrificial layer into a predetermined shape, providing a stretchable and/or flexible material on top of and in between features of the one or more patterned layers.
    Type: Grant
    Filed: March 22, 2006
    Date of Patent: February 10, 2009
    Assignees: Interuniversitair Microelektronica Centrum vzw (IMEC), Universiteit Gent
    Inventors: Jan Vanfleteren, Dominique Brosteaux, Fabrice Axisa
  • Publication number: 20070134849
    Abstract: A method of manufacturing a semiconductor device is provided, involving forming a first flexible film on a rigid carrier substrate, attaching a die to the flexible film, so as to leave contacts on the die exposed, forming a wiring layer to contact the contacts of the die, and releasing the flexible film where the die is attached, from the carrier. An area of the first flexible film where the die is attached can have a lower adhesion to the rigid carrier substrate than other areas, so that releasing can involve cutting the first flexible film to release a part of the area of lower adhesion, and leaving an area of higher adhesion. A combined thickness of the die, the first flexible film and the wiring layer can be less than 150 ?m, so that the device is bendable. Devices can be stacked.
    Type: Application
    Filed: November 21, 2006
    Publication date: June 14, 2007
    Inventors: Jan Vanfleteren, Wim Christiaens