Abstract: A power semiconductor device includes a semiconductor wafer having a junction and a junction termination laterally surrounding the junction. A protection layer covers the lateral side of the semiconductor wafer and covers the second main side at least in an area of the junction termination. A first metal disk is arranged on the first main side to cover the first main side of the semiconductor wafer. An interface between the first metal disk and the semiconductor wafer is a free floating interface. A metal layer sandwiched between the first metal disk and the semiconductor wafer.

Abstract: A power semiconductor device includes a semiconductor wafer having a junction and a junction termination laterally surrounding the junction. A protection layer covers the lateral side of the semiconductor wafer and covers the second main side at least in an area of the junction termination. A first metal disk is arranged on the first main side to cover the first main side of the semiconductor wafer. An interface between the first metal disk and the semiconductor wafer is a free floating interface. A metal layer sandwiched between the first metal disk and the semiconductor wafer.

Abstract: A power semiconductor module including at least one power semiconductor chip providing a power electronics switch; and a semiconductor wafer, to which the at least one power semiconductor chip is bonded; wherein the semiconductor wafer is doped, such that it includes a field blocking region and an electrically conducting region on the field blocking region, to which electrically conducting region the at least one power semiconductor chip is bonded.

Abstract: A bidirectional thyristor device includes a semiconductor wafer with a number of layers forming pn junctions. A first main electrode and a first gate electrode are arranged on a first main side of the wafer. A second main electrode and a second gate electrode are arranged on a second main side of the wafer. First emitter shorts penetrate through a first semiconductor layer and second emitter shorts penetrate through a fifth semiconductor layer. In an orthogonal projection onto a plane parallel to the first main side, a first area occupied by the first semiconductor layer and the first emitter shorts overlaps in an overlapping area with a second area occupied by the fifth semiconductor layer and the second emitter shorts. The overlapping area, in which the first area overlaps with the second area, encompasses at least 50% of a total wafer area occupied by the semiconductor wafer.

Abstract: A bidirectional thyristor device includes a semiconductor wafer with a number of layers forming pn junctions. A first main electrode and a first gate electrode are arranged on a first main side of the wafer. A second main electrode and a second gate electrode are arranged on a second main side of the wafer. First emitter shorts penetrate through a first semiconductor layer and second emitter shorts penetrate through a fifth semiconductor layer. In an orthogonal projection onto a plane parallel to the first main side, a first area occupied by the first semiconductor layer and the first emitter shorts overlaps in an overlapping area with a second area occupied by the fifth semiconductor layer and the second emitter shorts. The overlapping area, in which the first area overlaps with the second area, encompasses at least 50% of a total wafer area occupied by the semiconductor wafer.

Abstract: The present application relates to a power semiconductor device, including a substrate having a first side and a second side, the first side and the second side being located opposite to each other, wherein the first side includes a cathode and the second side includes an anode, wherein a junction termination of a p/n-junction is provided at at least one surface of the substrate, preferably at at least one of the first side and the second side, the junction termination is coated by a passivating coating, the passivating coating including at least one material selected from the group consisting of an inorganic-organic composite material, parylene, and a phenol resin comprising polymeric particles.

Abstract: A thyristor is disclosed with a plurality of emitter shorts at points in the cathode region. The points define a Delaunay triangulation with a plurality of triangles. For a first subset of triangles a coefficient of variation of the values qT,l with l?S1 is smaller than 0.1, and/or an absolute value of a skewedness of the geometric quantities qT,l with l?S1 is smaller than 5, and/or a Kurtosis of the geometric quantities qT,l with l?S1 is smaller than 20. For a second subset of triangles, a quotient of a standard deviation of the quantities qT,m with m?S2 and a mean squared value of the geometric quantity qT,l with l?S1 is less than 1, and/or a quotient of a number of triangles in the second subset and a number of triangles in the first subset is less than 1.0×10?2.

Abstract: There is provided a thyristor having emitter shorts, wherein in an orthogonal projection onto a plane parallel to a first main side, a contact area covered by an electrical contact of a first electrode layer with a first emitter layer and the emitter shorts includes areas in the shape of lanes, in which an area coverage of the emitter shorts is less than the area coverage of emitter shorts in the remaining area of the contact area, wherein the area coverage of the emitter shorts in a specific area is the area covered by the emitter shorts in that specific area relative to the specific area. The thyristor of the invention exhibits a fast turn-on process even without complicated amplifying gate structure.

Abstract: A method for manufacturing an edge termination structure for a silicon carbide power semiconductor device having a central region and an edge region is provided.

Abstract: The present application relates to a power semiconductor device, including a substrate having a first side and a second side, the first side and the second side being located opposite to each other, wherein the first side includes a cathode and the second side includes an anode, wherein a junction termination of a p/n-junction is provided at at least one surface of the substrate, preferably at at least one of the first side and the second side, the junction termination is coated by a passivating coating, the passivating coating including at least one material selected from the group consisting of an inorganic-organic composite material, parylene, and a phenol resin comprising polymeric particles.

Abstract: The invention relates to a bipolar non-punch-through power semiconductor device and a corresponding manufacturing method. The device comprises a semiconductor wafer and a first electrode formed on a first main side of the wafer and a second electrode formed on a second main side of the wafer opposite the first main side. The wafer comprises a pair of layers of different conductivity types, such as a drift layer of a first conductivity type, and a first layer of a second conductivity type arranged on the drift layer towards the first main side and contacting the first electrode. The wafer comprises an inner region wand an outer region surrounding the inner region. The drift layer has a thickness in the inner region greater or equal than a thickness in the outer region. A thickness of the first layer increases in a transition region between the inner region and the outer region from a thickness in the inner region to a maximum thickness in the outer region.

Abstract: A method for manufacturing an edge termination structure for a silicon carbide power semiconductor device having a central region and an edge region is provided.

Abstract: There is provided a thyristor having emitter shorts, wherein in an orthogonal projection onto a plane parallel to a first main side, a contact area covered by an electrical contact of a first electrode layer with a first emitter layer and the emitter shorts includes areas in the shape of lanes, in which an area coverage of the emitter shorts is less than the area coverage of emitter shorts in the remaining area of the contact area, wherein the area coverage of the emitter shorts in a specific area is the area covered by the emitter shorts in that specific area relative to the specific area. The thyristor of the invention exhibits a fast turn-on process even without complicated amplifying gale structure.

Abstract: A power semiconductor module including at least one power semiconductor chip providing a power electronics switch; and a semiconductor wafer, to which the at least one power semiconductor chip is bonded; wherein the semiconductor wafer is doped, such that it includes a field blocking region and an electrically conducting region on the field blocking region, to which electrically conducting region the at least one power semiconductor chip is bonded.

Abstract: A thyristor, in particular a phase control thyristor, is disclosed with comprises: a) a semiconductor slab, in particular a semiconductor wave or die, in which a thyristor structure is formed, b) a cathode metallization formed on a cathode region on a cathode side surface of the semiconductor slab, c) a gate metallization formed on a gate region on the cathode side surface of the semiconductor slab, d) a plurality of N discrete emitter shorts, arranged at points Pi in the cathode region, said points having point locations xi, with i?{1; . . . ; N}, e) the points Pl defining a Delaunay triangulation comprising a plurality of triangles Tj with j?{1; . . . ; M), wherein f) for a first subset of triangles Tl with l?S1?{1; . . . ; M), g) with each triangle Tl being characterized by a geometric quantity having values qT,l with l?S1?{1; . . . ; M), said geometric quantity having a mean value ?, and i) a coefficient of variation of the values qT,l with l?S1 is smaller than 0.1, preferably smaller than 0.

Abstract: A RC power semiconductor is provided which comprises a plurality of diode cells and a plurality of GCT cells. Each GCT cell comprises a first cathode layer with at least three cathode layer regions, which are separated from each other by a base layer. In orthogonal projection onto a plane parallel to the first main side each one of the cathode layer regions is strip-shaped and a width (w, w?), wherein the diode cells alternate with the GCT cells in a lateral direction in at least a mixed part, wherein in each GCT cell, the width (w?) of each one of the two outer cathode layer regions next to a diode cell neighboring to that GCT cell is less than the width (w) of any intermediate cathode layer region between the two outer cathode layer regions in that GCT cell.

Abstract: A RC power semiconductor is provided which comprises a plurality of diode cells and a plurality of GCT cells. Each GCT cell comprises a first cathode layer with at least three cathode layer regions, which are separated from each other by a base layer. In orthogonal projection onto a plane parallel to the first main side each one of the cathode layer regions is strip-shaped and a width (w, w?), wherein the diode cells alternate with the GCT cells in a lateral direction in at least a mixed part, wherein in each GCT cell, the width (w?) of each one of the two outer cathode layer regions next to a diode cell neighbouring to that GCT cell is less than the width (w) of any intermediate cathode layer region between the two outer cathode layer regions in that GCT cell.

Abstract: The invention relates to a bipolar non-punch-through power semiconductor device and a corresponding manufacturing method. The device comprises a semiconductor wafer and a first electrode formed on a first main side of the wafer and a second electrode formed on a second main side of the wafer opposite the first main side. The wafer comprises a pair of layers of different conductivity types, such as a drift layer of a first conductivity type, and a first layer of a second conductivity type arranged on the drift layer towards the first main side and contacting the first electrode. The wafer comprises an inner region wand an outer region surrounding the inner region. The drift layer has a thickness in the inner region greater or equal than a thickness in the outer region. A thickness of the first layer increases in a transition region between the inner region and the outer region from a thickness in the inner region to a maximum thickness in the outer region.

Abstract: A reverse-conducting power semiconductor device with a wafer has first and second main sides which are arranged opposite and parallel to each other. The device includes a plurality of diode cells and a plurality of gate commutated thyristors (GCT) cells. Each GCT cell includes layers of a first conductivity type (e.g., n-type) and a second conductivity type (e.g., p-type) between the first and second main sides. The device includes at least one mixed part in which diode anode layers of the diode cells alternate with first cathode layers of the GCT cells. In each diode cell, a diode buffer layer of the first conductivity type is arranged between the diode anode layer and a drift layer such that the diode buffer layer covers lateral sides of the diode anode layer from the first main side to a depth of approximately 90% of the thickness of the diode anode layer.

Abstract: A method for manufacturing a power semiconductor device is disclosed which can include: providing a wafer of a first conductivity type; and applying on a second main side of the wafer at least one of a dopant of the first conductivity type for forming a layer of the first conductivity type and a dopant of a second conductivity type for forming a layer of the second conductivity type. A Titanium layer with a metal having a melting point above 1300° C. is then deposited on the second main side. The Titanium deposition layer is annealed so that simultaneously an intermetal compound layer is formed at the interface between the Titanium deposition layer and the wafer and the dopant is diffused into the wafer. A first metal electrode layer is created on the second main side.