Patents by Inventor Jan Waldmann

Jan Waldmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micromechanical sensor
    Patent number: 11485630
    Abstract: A micromechanical sensor. The sensor includes a substrate, a cap element situated on the substrate, at least one seismic mass that is deflectable orthogonal to the cap element, an internal pressure that is lower by a defined amount relative to the surrounding environment prevailing inside a cavity, and a compensating element designed to provide a homogenization of a temperature gradient field in the cavity during operation of the micromechanical sensor.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: November 1, 2022
    Assignee: Robert Bosch GmbH
    Inventors: Jan Waldmann, Rolf Scheben, Rudy Eid
  • Micromechanical sensor system
    Patent number: 11242240
    Abstract: A micromechanical sensor system that includes a mass that is deflectable at least in the z direction. A stop element having an elastic design is situated on the mass on at least one of the sides oriented in the z direction, via a connection element.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: February 8, 2022
    Assignee: Robert Bosch GmbH
    Inventors: Benny Pekka Herzogenrath, Denis Gugel, Jan Waldmann, Michael Jaax, Monika Koster
  • MICROMECHANICAL SENSOR
    Publication number: 20210214213
    Abstract: A micromechanical sensor. The sensor includes a substrate, a cap element situated on the substrate, at least one seismic mass that is deflectable orthogonal to the cap element, an internal pressure that is lower by a defined amount relative to the surrounding environment prevailing inside a cavity, and a compensating element designed to provide a homogenization of a temperature gradient field in the cavity during operation of the micromechanical sensor.
    Type: Application
    Filed: June 6, 2019
    Publication date: July 15, 2021
    Inventors: Jan Waldmann, Rolf Scheben, Rudy Eid
  • Micromechanical z-inertial sensor
    Patent number: 10899603
    Abstract: A micromechanical z-inertial sensor, having a movable MEMS structure developed in a micromechanical function layer; a torsion spring connected to the movable MEMS structure; and a spring device connected to the torsion spring, the spring device being developed to hamper a deflection of the torsion spring orthogonal to a sensing direction of the MEMS structure in a defined manner.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: January 26, 2021
    Assignee: Robert Bosch GmbH
    Inventors: Ralf Boessendoerfer, Jan Waldmann, Jochen Reinmuth
  • MICROMECHANICAL Z-INERTIAL SENSOR
    Publication number: 20190135612
    Abstract: A micromechanical z-inertial sensor, having a movable MEMS structure developed in a micromechanical function layer; a torsion spring connected to the movable MEMS structure; and a spring device connected to the torsion spring, the spring device being developed to hamper a deflection of the torsion spring orthogonal to a sensing direction of the MEMS structure in a defined manner.
    Type: Application
    Filed: November 2, 2018
    Publication date: May 9, 2019
    Inventors: Ralf Boessendoerfer, Jan Waldmann, Jochen Reinmuth
  • MICROMECHANICAL SENSOR SYSTEM
    Publication number: 20190092619
    Abstract: A micromechanical sensor system that includes a mass that is deflectable at least in the z direction. A stop element having an elastic design is situated on the mass on at least one of the sides oriented in the z direction, via a connection element.
    Type: Application
    Filed: September 11, 2018
    Publication date: March 28, 2019
    Inventors: Benny Pekka Herzogenrath, Denis Gugel, Jan Waldmann, Michael Jaax, Monika Koster