Abstract: An embodiment of the invention relates to a radiation detector which includes a plurality of radiation detector modules arranged adjacent to one another with in each case one scintillation element with a radiation inlet surface aligned transversely with respect to a main direction of a radiation, and light detector arrangements arranged transversely with respect to the radiation inlet surfaces of the scintillation elements. In the process of at least one embodiment, one light detector arrangement is arranged between two scintillation elements and has two light inlet surfaces which point away from one another, of which one is associated with a first scintillation element and one is associated with a second scintillation element. Furthermore, at least one embodiment of the invention relates to a light detector arrangement, a production method for a radiation detector according to at least one embodiment of the invention and/or an imaging system.

Abstract: A method for gluing microcomponents to a substrate (1) during the production of microsystem components includes the steps of applying a reactive or non-reactive hot melt type adhesive (5) to the microcomponent (18) and/or the substrate (1), heating the hot melt type adhesive (5), and placing the microcomponent (18) onto the substrate (1). The hot melt type adhesive (5) is on the contact surfaces between the microcomponent (18) and the substrate (1) during and after gluing.

Abstract: Use of a hotmelt adhesive is disclosed for fixing at least one micro device on a carrier. A pasty fixation compound is further disclosed for micro devices including a powdered hotmelt adhesive, an anti-flow additive and a solvent for the anti-flow additive. Furthermore, a method is disclosed for fixing at least one micro device on a carrier, a hotmelt adhesive being applied to a carrier, the micro device being positioned at a predetermined distance from the carrier and fixed by the hotmelt adhesive until a solid adhesive bond has been produced between the at least one micro device and the carrier by cooling the hotmelt adhesive, the gap produced being filled by an epoxy resin and the two devices being adhesively bonded securely by curing of the epoxy resin. Furthermore, a detector is disclosed for detecting ionizing radiation which has a multiplicity of detector elements disposed in a two-dimensional arrangement.

Abstract: In a method and a device for non-contacting monitoring of the fill state of liquids in an unpressurized liquid container, the fill state and/or the fill state change is determined by radiating light onto the boundary region of the liquid at which a fill state-dependent curvature arises due to adhesion forces of the liquid at the reservoir wall and surface tension, and the intensity of the reflected light or the reflection angle is measured at a predetermined location.

Abstract: A method for gluing microcomponents to a substrate (1) during the production of microsystem components includes the steps of applying a reactive or non-reactive hot melt type adhesive (5) to the microcomponent (18) and/or the substrate (1), heating the hot melt type adhesive (5), and placing the microcomponent (18) onto the substrate (1). The hot melt type adhesive (5) is on the contact surfaces between the microcomponent (18) and the substrate (1) during and after gluing.