Patents by Inventor Jana Hartmann

Jana Hartmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11105254
    Abstract: A cooling system of an internal combustion engine includes a plurality of components in the form of heat sources, coolant pumps, actuator devices, and temperature sensors that are fluidically connected to one another via coolant lines, wherein a plurality of cooling circuits, each including at least one of the various components, is formed. In addition, a control device is provided that is in signal-conducting connection with at least one of the temperature sensors, with at least one of the coolant pumps, and with at least one of the actuator devices.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: August 31, 2021
    Assignee: VOLKSWAGEN AKTIENGESELLSCHAFT
    Inventors: Holger Loof, Jana Hartmann, Bodo Hoffmann, Marco Kiel
  • Patent number: 11069835
    Abstract: An optoelectronic semiconductor chip and a method for manufacturing a semiconductor chip are disclosed. In an embodiment an optoelectronic semiconductor chip includes a plurality of fins and a current expansion layer for common contacting of at least some of the fins, wherein each fin includes two side surfaces arranged opposite one another and an active region arranged on each of the side surfaces, wherein the plurality of fins include inner fins and outer fins having an adjacent fin only on one side, and wherein the current expansion layer is in direct contact with the inner fins on their outside.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: July 20, 2021
    Assignee: OSRAM OLED GMBH
    Inventors: Adrian Stefan Avramescu, Tansen Varghese, Martin Straßburg, Hans-Jürgen Lugauer, Sönke Fündling, Jana Hartmann, Frederik Steib, Andreas Waag
  • Publication number: 20200028029
    Abstract: An optoelectronic semiconductor chip and a method for manufacturing a semiconductor chip are disclosed. In an embodiment an optoelectronic semiconductor chip includes a plurality of fins and a current expansion layer for common contacting of at least some of the fins, wherein each fin includes two side surfaces arranged opposite one another and an active region arranged on each of the side surfaces, wherein the plurality of fins include inner fins and outer fins having an adjacent fin only on one side, and wherein the current expansion layer is in direct contact with the inner fins on their outside.
    Type: Application
    Filed: March 16, 2018
    Publication date: January 23, 2020
    Inventors: Adrian Stefan Avramescu, Tansen Varghese, Martin Straßburg, Hans-Jürgen Lugauer, Sönke Fündling, Jana Hartmann, Frederik Steib, Andreas Waag
  • Publication number: 20190264600
    Abstract: A cooling system of an internal combustion engine includes a plurality of components in the form of heat sources, coolant pumps, actuator devices, and temperature sensors that are fluidically connected to one another via coolant lines, wherein a plurality of cooling circuits, each including at least one of the various components, is formed. In addition, a control device is provided that is in signal-conducting connection with at least one of the temperature sensors, with at least one of the coolant pumps, and with at least one of the actuator devices.
    Type: Application
    Filed: February 27, 2019
    Publication date: August 29, 2019
    Applicant: Volkswagen Aktiengesellschaft
    Inventors: Holger Loof, Jana Hartmann, Bodo Hoffmann, Marco Kiel