Patents by Inventor Jana M. Whalen

Jana M. Whalen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5213886
    Abstract: Curable compositions contain a low molecular weight polyphenylene ether and a polyepoxide composition containing brominated and non-brominated bisphenol polyglycidyl ethers, in combination with further components including specific catalysts. Said compositions are preferably free from hardeners for epoxy resins. They may be used in the preparation of bonding sheets which are useful in the manufacture of multilayer printed circuit assemblies and which have excellent physical and electrical properties.
    Type: Grant
    Filed: June 22, 1992
    Date of Patent: May 25, 1993
    Assignee: General Electric Company
    Inventors: Herbert S. Chao, Robert E. Colborn, James R. Presley, Jana M. Whalen, Michael J. Davis, James E. Tracy, Edward F. Chu
  • Patent number: 5162450
    Abstract: Curable compositions contain a low molecular weight polyphenylene ether and a polyepoxide composition containing brominated and non-brominated bisphenol polyglycidyl ethers, in combination with further components including specific catalysts. Said compositions are preferably free from hardeners for epoxy resins. They may be used in the preparation of bonding sheets which are useful in the manufacture of multilayer printed circuit assemblies and which have excellent physical and electrical properties.
    Type: Grant
    Filed: January 3, 1990
    Date of Patent: November 10, 1992
    Assignee: General Electric Company
    Inventors: Herbert S. Chao, Robert E. Colborn, James R. Presley, Jana M. Whalen, Michael J. Davis, James E. Tracy, Edward F. Chu
  • Patent number: 5141791
    Abstract: Compositions comprising a polyepoxy compound (preferably bisphenol A diglycidyl ether) and a polyphenylene ether which has been melt processed (e.g., by extrusion) at a temperature in the range of about 230.degree.-390.degree. C., are cured at temperatures in the range of about 190.degree.-250.degree. C. by various epoxy cure catalysts. They may used in the preparation of laminates with excellent dielectric properties, solvent resistance and solder resistance, useful in printed circuit board production.
    Type: Grant
    Filed: June 27, 1990
    Date of Patent: August 25, 1992
    Assignee: General Electric Company
    Inventors: Herbert S. Chao, Jana M. Whalen
  • Patent number: 5001010
    Abstract: Compositions comprising a polyepoxy compound (preferably bisphenol A diglycidyl ether) and a polyphenylene ether which has been melt processed (e.g., by extrusion) at a temperature in the range of about 230.degree.-390.degree. C., are cured at temperatures in the range of about 190.degree.-250.degree. C. by various epoxy cure catalysts. They may be used in the preparation of laminates with excellent dielectric properties, solvent resistance and solder resistance, useful in printed circuit board production.
    Type: Grant
    Filed: October 11, 1988
    Date of Patent: March 19, 1991
    Assignee: General Electric Company
    Inventors: Herbert S. Chao, Jana M. Whalen
  • Patent number: 4912172
    Abstract: Blends of high molecular weight polyphenylene ethers with various epoxy materials, particularly polyglycidyl ethers of bisphenolic compounds, are homogeneous at high temperatures and may be cured in the presence of a catalyst such as aluminum tris(acetylacetonate) or zinc bis(acetylacetonate), especially in the additional presence of an accelerator such as a basic nitrogen compound. The cured compositions have advantageous physical and electrical properties and are useful, for example, for the preparation of printed circuit boards.
    Type: Grant
    Filed: December 22, 1988
    Date of Patent: March 27, 1990
    Assignee: General Electric Company
    Inventors: John E. Hallgren, Victoria J. Eddy, Jana M. Whalen