Abstract: An electronic device includes (i) an integrated circuit (IC) die mounted on a substrate, (ii) a lid having first and second surfaces facing one another, and one or more openings formed through the lid between the first and second surfaces, the lid being disposed over at least the IC die to form a space between the IC die and the first surface of the lid, the one or more openings are configured to enable transference of fluids through the lid, (iii) a liquid thermal interface material (TIM) filling the space and being formulated to conduct heat from the IC die to the lid, and (iv) a stopper structure extended from the first surface of the lid, the stopper structure includes one or more sidewalls configured to contain the liquid TIM at least in the space between the IC die and the first surface of the lid.

Abstract: A multi-chip integrated circuit (IC) apparatus includes a substrate, one or more first IC chips mounted on the substrate, and a second IC chip mounted on the substrate. One or more first heat sinks are respectively thermally coupled to the one or more first IC chips. A second heat sink is thermally coupled to the second IC chip. An under side of the second heat sink is located further from the substrate than each of respective one or more top sides of the one or more first heat sinks.

Abstract: An apparatus and method for use of an improved stretching device providing various stretches and manipulation of a user's muscle groups, including lower body muscle groups. Movement of the upper and lower support members can be achieved with a controller or wireless controller, such as a cellular phone executing an application operatively connected via a transceiver of the stretching device. The upper support member and lower support member may be independently controlled by a secondary motor assembly at a rotational connection between the support members. Some embodiments may provide removable support members for switching between left and right-side manipulation of a user's left and right legs with a single device. Other embodiments may include a track to allow for a sliding movement of the motor assembly or the upper and lower support members between left and right sides of the stretching device.

Abstract: A semiconductor package includes a package substrate, a semiconductor chip disposed on the package substrate, and a stiffener disposed on the package substrate. The stiffener includes an inner portion configured to surround the semiconductor chip, the inner portion defining a space on the package substrate external to the inner portion and located between the inner portion and outer edges of the package substrate, and a plurality of leg portions extending outwardly from the inner portion toward one or more of the outer edges of the package substrate and corners of the package substrate.

Abstract: A multi-chip integrated circuit (IC) apparatus includes a substrate, one or more first IC chips mounted on the substrate, and a second IC chip mounted on the substrate. One or more first heat sinks are respectively thermally coupled to the one or more first IC chips. A second heat sink is thermally coupled to the second IC chip. An under side of the second heat sink is located further from the substrate than each of respective one or more top sides of the one or more first heat sinks.

Abstract: A method of reducing heat flow between IC chips and the resulting device are provided. Embodiments include attaching plural IC chips to an upper surface of a substrate; forming a lid over the IC chips; and forming a slit through the lid at a boundary between adjacent IC chips.

Abstract: A method of reducing heat flow between IC chips and the resulting device are provided. Embodiments include attaching plural IC chips to an upper surface of a substrate; forming a lid over the IC chips; and forming a slit through the lid at a boundary between adjacent IC chips.

Abstract: A method of reducing heat flow between IC chips and the resulting device are provided. Embodiments include attaching plural IC chips to an upper surface of a substrate; forming a lid over the IC chips; and forming a slit through the lid at a boundary between adjacent IC chips.

Abstract: A method of reducing heat flow between IC chips and the resulting device are provided. Embodiments include attaching plural IC chips to an upper surface of a substrate; forming a lid over the IC chips; and forming a slit through the lid at a boundary between adjacent IC chips.

Abstract: A method of reducing heat flow between IC chips and the resulting device are provided. Embodiments include attaching plural IC chips to an upper surface of a substrate; forming a lid over the IC chips; and forming a slit through the lid at a boundary between adjacent IC chips.

Abstract: A sequential circuit test generation system and method to generate test patterns for sequential without assuming the use of scan techniques or a reset state utilizes the iterative logic array (ILA) model of the sequential circuit and a targeted-D propagation scheme employing both forward time processing (FTP) and reverse time processing (RTP) techniques for assigning a sequence of primary input (PI) values and for producing a an initial pseudo primary input (PPI) vector representing the initial state of the digital circuit at a particular time frame. Improved state justification techniques generate the remaining sequence of PI vectors necessary to put the circuit into the initial state from either known or don't care first states, by means of a heuristic method for reducing required initial state assignments. The method can also be applied to reduce the required number of PI vector assignments is also presented.