Abstract: One or more methods and systems of improving performance and reducing the size of a translation lookaside buffer are presented. In one embodiment, the method comprises using a bit obtained from a virtual page number to store even and odd page frame numbers into a single page frame number field of a miniature translation lookaside buffer (mini-TLB). In one embodiment, even and odd page frame number fields are consolidated into a single page frame number field. In one embodiment, the mini-TLB facilitates the use of a buffer or memory of reduced size. Furthermore, in one or more embodiments, aspects of the invention may be found in a system and method that easily incorporates and adapts the use of existing control processor instruction sets or commands of a typical translation lookaside buffer.

Abstract: One or more methods and systems of improving performance and reducing the size of a translation lookaside buffer are presented. In one embodiment, the method comprises using a bit obtained from a virtual page number to store even and odd page frame numbers into a single page frame number field of a miniature translation lookaside buffer (mini-TLB). In one embodiment, even and odd page frame number fields are consolidated into a single page frame number field. In one embodiment, the mini-TLB facilitates the use of a buffer or memory of reduced size. Furthermore, in one or more embodiments, aspects of the invention may be found in a system and method that easily incorporates and adapts the use of existing control processor instruction sets or commands of a typical translation lookaside buffer.

Abstract: A thermally enhanced face-up BGA substrate consists of a metal (copper) core, layers, dielectric layers, conductive through-core and build-up vias. It is a new and simple structure with better thermal performance, resulting in lower cost and better reliability. Moreover, high degree of flexibility in choice of material and layer counts as well as layer thickness allows for a wide range of applications in packaging and high density printed circuit board.

Abstract: A method of making a thermally enhanced BGA substrate in which a metal (copper) core, has dielectric layers applied to each side thereof and conductive through-core build-up vias are provided. Rigidifying non-conductive dielectric sheets are laminated to the oppositely facing surfaces and then conductive layers are applied to at least one of the rigidifying non-conductive sheets and via connections are made through the dielectric layer(s) to the core conductive layer.