Patents by Inventor Jane-Wang Lai

Jane-Wang Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10439076
    Abstract: An optical package structure includes a first conductive frame, a second conductive frame, a light receiver, and a light-permeable package compound. The first and second conductive frames are arranged apart from each other and have a light entrance there-between. The light receiver includes a light receiving region and two soldering portions arranged on a surface thereof. The two soldering portions are respectively arranged at two opposite sides of the light receiving region, and are respectively soldered onto the first and second conductive frames, such that the light receiving region faces the light entrance. At least part of the first conductive frame, at least part of the second conductive frame, and the light receiver are embedded in the light-permeable package compound. The light receiver is configured to receive a light signal traveling through the light-permeable package compound and the light entrance.
    Type: Grant
    Filed: May 14, 2018
    Date of Patent: October 8, 2019
    Assignee: ANPEC ELECTRONICS CORPORATION
    Inventors: Chih-Cheng Chien, Jane-Wang Lai, Chien-Chung Hsiao
  • Publication number: 20190259882
    Abstract: An optical package structure includes a first conductive frame, a second conductive frame, a light receiver, and a light-permeable package compound. The first and second conductive frames are arranged apart from each other and have a light entrance there-between. The light receiver includes a light receiving region and two soldering portions arranged on a surface thereof. The two soldering portions are respectively arranged at two opposite sides of the light receiving region, and are respectively soldered onto the first and second conductive frames, such that the light receiving region faces the light entrance. At least part of the first conductive frame, at least part of the second conductive frame, and the light receiver are embedded in the light-permeable package compound. The light receiver is configured to receive a light signal traveling through the light-permeable package compound and the light entrance.
    Type: Application
    Filed: May 14, 2018
    Publication date: August 22, 2019
    Inventors: CHIH-CHENG CHIEN, JANE-WANG LAI, CHIEN-CHUNG HSIAO