Abstract: The invention is directed to a radiation curable adhesive composition comprising at least one vinyl modified block copolymer having a first polyvinyl aromatic block and a second polydiene block having vinyl functionality, and at least one tackifier. Optionally, the composition may comprises at least one second block copolymer that has not been vinyl modified, at least one platicizer, and at least one wax. The invention is also directed to a double-faced label formed from the composition and the method of producing said label.

Abstract: The invention is directed to a radiation curable adhesive composition comprising at least one vinyl modified block copolymer having a first polyvinyl aromatic block and a second polydiene block having vinyl functionality, and at least one tackifier. Optionally, the composition may comprises at least one second block copolymer that has not been vinyl modified, at least one platicizer, and at least one wax. The invention is also directed to a double-faced label formed from the composition and the method of producing said label.

Abstract: A hot melt adhesive composition comprising a) from about 5 wt-% to about 50 wt-% of at least one homogeneous linear or substantially linear ethylene/alpha-olefin interpolymer characterized as having a density from 0.850 to 0.965 g/cm3; b) from about 1 wt-% to about 40 wt-% of at least one block copolymer; and c) from about 10 wt-% to about 75 wt-% of at least one tackifying resin wherein said adhesive does not fail cohesively.

Abstract: The invention is directed to a radiation curable adhesive composition comprising at least one vinyl modified block copolymer having a first polyvinyl aromatic block and a second polydiene block having vinyl functionality, and at least one tackifier. Optionally, the composition may comprises at least one second block copolymer that has not been vinyl modified, at least one platicizer, and at least one wax. The invention is also directed to a double-faced label formed from the composition and the method of producing said label.

Abstract: The invention is directed to a radiation curable adhesive composition comprising at least one vinyl modified block copolymer having a first polyvinyl aromatic block and a second polydiene block having vinyl functionality, and at least one tackifier. Optionally, the composition may comprises at least one second block copolymer that has not been vinyl modified, at least one platicizer, and at least one wax. The invention is also directed to a double-faced label formed from the composition and the method of producing said label.

Abstract: This invention relates to a hot melt adhesive composition in pellet form. The hot melt adhesive composition is pressure sensitive, having a storage modulus, G′, at 25° C., of less than about 5×106 dynes/cm2. The pellets are coated with a pelletizing aid on the surface at a concentration preferably ranging from about 1 wt-% to about 30 wt-%. The pelletizing aid is a hot melt adhesive component or a material which does not substantially adversely affect the adhesive properties.

Abstract: This invention relates to a hot melt adhesive composition in pellet form. The hot melt adhesive composition is pressure sensitive, having a storage modulus, G', at 25.degree. C., of less than about 5.times.10.sup.6 dynes/cm.sup.2. The pellets are coated with a pelletizing aid on the surface at a concentration preferably ranging from about 1 wt-% to about 30 wt-%. The pelletizing aid is a hot melt adhesive component or a material which does not substantially adversely affect the adhesive properties. The pellets are free-flowing and have a substantially tack-free surface.

Abstract: A removable grade hot melt pressure sensitive adhesive, comprising from about 10% to about 50% by weight of the adhesive of at least one styrene-isoprene-styrene block copolymer having a diblock content of greater than about 50% a melt index of less than about 30 grams/10 minutes; from about 10% to about 40% by weight of the adhesive of at least one tackifying resin having a softening point of less than about 120.degree. C. and from about 10% to about 50% by weight of the adhesive of a liquid plasticizer. The resultant adhesive has 180.degree. peel values to stainless steel of less than about 4.0 pounds per linear inch.

Abstract: This invention relates to an envelope coated with a hot melt pressure sensitive adhesive composition preferably comprising a) from about 10% to about 40% by weight in the adhesive of at least one block copolymer selected from the group consisting of styrene-isoprene-styrene block copolymers, styrene-butadiene-styrene block copolymers and mixtures thereof wherein the block copolymers comprise from about 15% to about 35% styrene by weight in the copolymer and diblock contents from about 0% to about 90% by weight in the copolymer; and b) from about 60% to about 90% by weight in the adhesive of a modifier selected from the group consisting of solid tackifying resins, liquid tackifying resins, liquid elastomers and mixtures thereof. The invention further relates to an improved oil-free pressure sensitive adhesive that is low in viscosity and provides a destructive bond and resists deformation of high density spun polyolefin materials.