Patents by Inventor Janet D. Kirkland

Janet D. Kirkland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor component and method of manufacture
    Patent number: 6936501
    Abstract: A semiconductor component having a lid for protecting a semiconductor chip and a method for manufacturing the semiconductor component. The semiconductor chip has an active surface and a mounting surface. It is flip-chip mounted to a support substrate so the active surface is adjacent the support substrate. A passive or active circuit element may be mounted to the support substrate. The mounting surface of the semiconductor chip has a radius of curvature. A thermal interface material is dispensed on the mounting surface of the semiconductor chip. A lid is coupled to the support substrate via a lid adhesive. A portion of the lid has a radius of curvature that corresponds to the radius of curvature of the semiconductor chip. A force is applied to the lid so that it contacts the thermal interface material and urges the interface material to the sides of the semiconductor chip. The force causes wetting of the thermal interface material.
    Type: Grant
    Filed: April 5, 2004
    Date of Patent: August 30, 2005
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Seah Sun Too, James Hayward, Janet D. Kirkland