Abstract: Materials having diverse coefficients of thermal expansion are joined together by means of an adhesive film, electrically insulative mesh structure that cures at room temperature. An adhesive film bonding technique is employed to mount a printed wiring board, having a relatively low coefficient of thermal expansion, to a thermally and electrically conductive aluminum stiffener having a relatively high coefficient of thermal expansion, while maintaining the printed wiring board electrically insulated from the aluminum stiffener. A non-adhesive plastic `release` film is initially attached to a flat support substrate. A layer of electrically insulative mesh (glass cloth) is taped onto the plastic release film. The glass cloth is then impregnated with an electrically insulative adhesive that cures at room temperature. The aluminum stiffener is then placed on the adhesive-impregnated cloth layer, which is then cut to fit, using the aluminum stiffener as a template.

Abstract: A process for forming a stripline interface conductor. A stripline interface conductor receives a circuit element and provides spaced-apart connections to each of the closely spaced leads of the circuit element. A first ground plane layer and an attached dielectric layer are perforated to create a first access opening and a plurality of second access openings. The plurality of second access openings are spaced at a distance from the first access opening so that closely spaced leads of the circuit element can be attached to signal traces at the first access opening and electrical connection can be made to the leads in a spaced-apart geometry at the plurality of smaller access openings. A second dielectric layer including top and bottom metallic layers is attached to the exposed side of the first dielectric layer. Before this attachment the top metallic surface of the second dielectric is etched to form the signal traces and a third access opening is formed through all three layers.