Patents by Inventor Janet E. Mebane

Janet E. Mebane has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5574832
    Abstract: Techniques are disclosed for depleting raster data to allow printing of the depleted raster data on a grid that corresponds to the resolution of the undepleted raster data with a printed dot size that is larger that would otherwise be utilized with the undepleted raster data and to achieve faster ink dry time. Also disclosed is a technique for up scaling raster data at a particular resolution (e.g., 300 dpi) to a higher resolution in such a manner that expanded data includes a greater number of dot producing pixels to compensate for a dot size that is larger than the dot size that is appropriate for the higher resolution, and does not require horizontal depletion for printing with such dot size. This allows raster data at a particular resolution to be combined with higher resolution rasterized vector data for printing in accordance with the enhanced mode of operation.
    Type: Grant
    Filed: April 30, 1993
    Date of Patent: November 12, 1996
    Assignee: Hewlett-Packard Corporation
    Inventors: David C. Towery, Alan E. Cariffe, Janet E. Mebane, Anne P. Kadonaga, Iue-Shuenn Chen, Mark Overton
  • Patent number: 4806106
    Abstract: Disclosed herein is a method and apparatus for interconnecting a flexible (flex) circuit, printed circuit or the like to an ink jet printhead or other similar electronic device. This approach includes providing a flexible lead frame member between the flex circuit and printhead, with the lead frame member having a plurality of conductive leads or fingers extending at a predetermined angle with respect to the final plane of interconnection. During the interconnection process, these leads or fingers are spring biased through this predetermined angle to provide good compressive electrical contact between the two members interconnected by the lead frame in a single plane of interconnection.
    Type: Grant
    Filed: April 9, 1987
    Date of Patent: February 21, 1989
    Assignee: Hewlett-Packard Company
    Inventors: Janet E. Mebane, Lawrence W. Chan, Duong T. La, Ruben Nevarez